IT1000992B - PROCESS AND COMPOSITIONS FOR THE ELECTROLYTIC DE POSITO OF COPPER FROM A BATH OF COPPER PLATING - Google Patents

PROCESS AND COMPOSITIONS FOR THE ELECTROLYTIC DE POSITO OF COPPER FROM A BATH OF COPPER PLATING

Info

Publication number
IT1000992B
IT1000992B IT9720/73A IT972073A IT1000992B IT 1000992 B IT1000992 B IT 1000992B IT 9720/73 A IT9720/73 A IT 9720/73A IT 972073 A IT972073 A IT 972073A IT 1000992 B IT1000992 B IT 1000992B
Authority
IT
Italy
Prior art keywords
copper
posito
electrolytic
bath
compositions
Prior art date
Application number
IT9720/73A
Other languages
Italian (it)
Inventor
D Arcilesi
S Valayil
O Kardos
Original Assignee
Met Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Met Chemicals Inc filed Critical Met Chemicals Inc
Application granted granted Critical
Publication of IT1000992B publication Critical patent/IT1000992B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT9720/73A 1972-12-14 1973-12-13 PROCESS AND COMPOSITIONS FOR THE ELECTROLYTIC DE POSITO OF COPPER FROM A BATH OF COPPER PLATING IT1000992B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31511272A 1972-12-14 1972-12-14

Publications (1)

Publication Number Publication Date
IT1000992B true IT1000992B (en) 1976-04-10

Family

ID=23222945

Family Applications (1)

Application Number Title Priority Date Filing Date
IT9720/73A IT1000992B (en) 1972-12-14 1973-12-13 PROCESS AND COMPOSITIONS FOR THE ELECTROLYTIC DE POSITO OF COPPER FROM A BATH OF COPPER PLATING

Country Status (11)

Country Link
JP (1) JPS5727190B2 (en)
BE (1) BE808564A (en)
CA (1) CA1020900A (en)
CS (1) CS191224B2 (en)
DE (1) DE2360892A1 (en)
FR (1) FR2210673B1 (en)
GB (1) GB1433040A (en)
IT (1) IT1000992B (en)
NL (1) NL7317204A (en)
PL (1) PL94267B1 (en)
ZA (1) ZA739310B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791594A (en) * 1980-11-29 1982-06-07 Anritsu Electric Co Ltd Method of plating through hole with copper
JPS641687A (en) * 1987-03-28 1989-01-06 Toshiji Shimokawa Water discharging device for vessel
JPS6482598A (en) * 1987-09-24 1989-03-28 Fujitsu Ltd Copper plating method for printed board
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE10100954A1 (en) * 2001-01-11 2002-07-18 Raschig Gmbh Use of polyolefins with basic, aromatic substituents as auxiliaries for the electrolytic deposition of metallic layers
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
PL2620529T3 (en) * 2012-01-25 2014-09-30 Atotech Deutschland Gmbh Method for producing matt copper deposits
CN116348636A (en) 2021-10-26 2023-06-27 宁德时代新能源科技股份有限公司 Copper plating solution and negative composite current collector prepared from same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating

Also Published As

Publication number Publication date
GB1433040A (en) 1976-04-22
CS191224B2 (en) 1979-06-29
CA1020900A (en) 1977-11-15
JPS49135832A (en) 1974-12-27
ZA739310B (en) 1974-11-27
FR2210673B1 (en) 1977-08-19
NL7317204A (en) 1974-06-18
JPS5727190B2 (en) 1982-06-09
PL94267B1 (en) 1977-07-30
BE808564A (en) 1974-03-29
DE2360892A1 (en) 1974-06-20
FR2210673A1 (en) 1974-07-12
AU6354273A (en) 1975-06-12

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