IN2015DN01249A - - Google Patents

Info

Publication number
IN2015DN01249A
IN2015DN01249A IN1249DEN2015A IN2015DN01249A IN 2015DN01249 A IN2015DN01249 A IN 2015DN01249A IN 1249DEN2015 A IN1249DEN2015 A IN 1249DEN2015A IN 2015DN01249 A IN2015DN01249 A IN 2015DN01249A
Authority
IN
India
Prior art keywords
fluorine containing
percent
sensitive adhesive
pressure sensitive
weight
Prior art date
Application number
Other languages
English (en)
Inventor
TELGENBÜSCHER Klaus KEITE
Jan Ellinger
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of IN2015DN01249A publication Critical patent/IN2015DN01249A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09J127/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/16—Homopolymers or copolymers or vinylidene fluoride
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
IN1249DEN2015 2012-08-24 2015-02-16 IN2015DN01249A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012215136 2012-08-24
DE102012219877.6A DE102012219877A1 (de) 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung
PCT/EP2013/064145 WO2014029545A1 (de) 2012-08-24 2013-07-04 Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung

Publications (1)

Publication Number Publication Date
IN2015DN01249A true IN2015DN01249A (zh) 2015-06-26

Family

ID=50069636

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1249DEN2015 IN2015DN01249A (zh) 2012-08-24 2015-02-16

Country Status (11)

Country Link
US (1) US9631127B2 (zh)
EP (1) EP2888330B1 (zh)
JP (1) JP6307079B2 (zh)
KR (1) KR102123407B1 (zh)
CN (1) CN104736654B (zh)
BR (1) BR112015003675A2 (zh)
DE (1) DE102012219877A1 (zh)
IN (1) IN2015DN01249A (zh)
PL (1) PL2888330T3 (zh)
TW (1) TWI582188B (zh)
WO (1) WO2014029545A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110750449A (zh) * 2019-09-19 2020-02-04 中山大学 一种测试驱动的网页构件功能抽取方法
CN111858367A (zh) * 2020-07-24 2020-10-30 北京达佳互联信息技术有限公司 代码覆盖率测试方法、系统、装置、电子设备及存储介质
CN117171057A (zh) * 2023-11-02 2023-12-05 沐曦集成电路(上海)有限公司 芯片软硬件联合仿真阶段的软件代码覆盖率确定系统

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013215149A1 (de) * 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
JP5667282B1 (ja) * 2013-12-27 2015-02-12 古河電気工業株式会社 有機電界発光素子用充填材料及び有機電界発光素子の封止方法
US20170327717A1 (en) * 2014-10-29 2017-11-16 Tesa Se Adhesive compounds containing getter materials that can be activated
JP6720473B2 (ja) * 2015-04-09 2020-07-08 Dic株式会社 発光装置、照明器具及び情報表示装置ならびに発光装置の製造方法
JP2017073379A (ja) * 2015-10-09 2017-04-13 荒川化学工業株式会社 非水系二次電池電極用バインダー、非水系二次電池電極形成用スラリー、非水系二次電池電極、非水系二次電池、リチウムイオン二次電池
CN105759511A (zh) * 2016-04-15 2016-07-13 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置及其制造方法
US20190330496A1 (en) * 2016-06-15 2019-10-31 3M Innovative Properties Company Membrane electrode assembly component and method of making an assembly
CN109563397B (zh) 2016-08-10 2021-03-16 3M创新有限公司 氟化压敏粘合剂及其制品
CN110476241B (zh) * 2017-03-31 2023-05-09 琳得科株式会社 半导体装置的制造方法及双面粘合片
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
US20210135109A1 (en) * 2017-07-31 2021-05-06 Corning Incorporated Accelerated thermal crosslinking of pvdf-hfp via addition of organic bases, and the usage of crosslinked pvdf-hfp as gate dielectric material for otft devices
DE102017221270B4 (de) * 2017-11-28 2021-08-12 Tesa Se Verfahren zur Herstellung eines Siegelklebebandes und Verwendung
TWI678404B (zh) * 2017-11-29 2019-12-01 住華科技股份有限公司 感壓性黏著組成物、電極複合膜及其製造方法
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
CN109335253A (zh) * 2018-08-30 2019-02-15 浙江时进包装有限公司 一种新型可重复封合自粘包装袋
JP7445211B2 (ja) * 2019-09-25 2024-03-07 大日本印刷株式会社 光学シート及びその製造方法
CN112996235B (zh) * 2021-02-10 2022-09-27 武汉天马微电子有限公司 一种柔性电路板、显示面板及绝缘膜

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EP0107793A1 (en) * 1982-09-29 1984-05-09 Daikin Kogyo Co., Ltd. Carbon fiber-containing fluoroelastomer composition
JPS6028444A (ja) 1983-07-27 1985-02-13 Daikin Ind Ltd 加工容易な含フツ素熱可塑性ゴム組成物
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DE102008047964A1 (de) * 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008060113A1 (de) * 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
FR2943349B1 (fr) * 2009-03-23 2012-10-26 Arkema France Procede de preparation d'un materiau composite elastomerique a haute teneur en nanotubes
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110750449A (zh) * 2019-09-19 2020-02-04 中山大学 一种测试驱动的网页构件功能抽取方法
CN111858367A (zh) * 2020-07-24 2020-10-30 北京达佳互联信息技术有限公司 代码覆盖率测试方法、系统、装置、电子设备及存储介质
CN117171057A (zh) * 2023-11-02 2023-12-05 沐曦集成电路(上海)有限公司 芯片软硬件联合仿真阶段的软件代码覆盖率确定系统

Also Published As

Publication number Publication date
PL2888330T3 (pl) 2017-09-29
KR102123407B1 (ko) 2020-06-16
TW201418392A (zh) 2014-05-16
CN104736654B (zh) 2017-10-20
JP2015531807A (ja) 2015-11-05
JP6307079B2 (ja) 2018-04-04
EP2888330A1 (de) 2015-07-01
BR112015003675A2 (pt) 2017-07-04
KR20150050571A (ko) 2015-05-08
EP2888330B1 (de) 2017-06-21
TWI582188B (zh) 2017-05-11
WO2014029545A1 (de) 2014-02-27
CN104736654A (zh) 2015-06-24
US9631127B2 (en) 2017-04-25
US20150240134A1 (en) 2015-08-27
DE102012219877A1 (de) 2014-02-27

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