IN2014DN10401A - - Google Patents

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Publication number
IN2014DN10401A
IN2014DN10401A IN10401DEN2014A IN2014DN10401A IN 2014DN10401 A IN2014DN10401 A IN 2014DN10401A IN 10401DEN2014 A IN10401DEN2014 A IN 10401DEN2014A IN 2014DN10401 A IN2014DN10401 A IN 2014DN10401A
Authority
IN
India
Prior art keywords
electrical component
component part
metal
metal alloy
pasty
Prior art date
Application number
Other languages
English (en)
Inventor
Thoralf Krull
Carsten Senge
Original Assignee
Morpho Cards Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48985721&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IN2014DN10401(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Morpho Cards Gmbh filed Critical Morpho Cards Gmbh
Publication of IN2014DN10401A publication Critical patent/IN2014DN10401A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
IN10401DEN2014 2012-07-03 2013-07-02 IN2014DN10401A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012211546.3A DE102012211546B4 (de) 2012-07-03 2012-07-03 Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung
PCT/EP2013/063899 WO2014006024A1 (en) 2012-07-03 2013-07-02 Chip card with contacting that is pasty or liquid at room temperature

Publications (1)

Publication Number Publication Date
IN2014DN10401A true IN2014DN10401A (enExample) 2015-08-14

Family

ID=48985721

Family Applications (1)

Application Number Title Priority Date Filing Date
IN10401DEN2014 IN2014DN10401A (enExample) 2012-07-03 2013-07-02

Country Status (9)

Country Link
US (1) US20150161501A1 (enExample)
JP (1) JP2015521777A (enExample)
KR (1) KR20150034695A (enExample)
CN (1) CN104412281A (enExample)
BR (1) BR112014032514A2 (enExample)
CA (1) CA2875765A1 (enExample)
DE (1) DE102012211546B4 (enExample)
IN (1) IN2014DN10401A (enExample)
WO (1) WO2014006024A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3026530B1 (fr) 2014-09-30 2017-12-22 Oberthur Technologies Document electronique a extremites d'antenne inclinees, support d'antenne pour un tel document electronique et procede de fabrication d'un tel document
EP3032468A1 (fr) * 2014-12-11 2016-06-15 Gemalto Sa Procédé de fabrication d'un dispositif comprenant une plage d'interconnexion filaire
KR102251694B1 (ko) * 2015-06-23 2021-05-13 랑셍 홀딩 정보의 무접촉 전송을 위한 적어도 하나의 인터페이스를 가진 스마트 카드 블랭크
FR3038425B1 (fr) * 2015-06-30 2017-08-25 Oberthur Technologies Document electronique tel qu'une carte a puce a metallisation reduite
EP3159832B1 (en) 2015-10-23 2020-08-05 Nxp B.V. Authentication token
JP6442003B1 (ja) * 2017-07-05 2018-12-19 日本エンジニアリング株式会社 Ｉｃカード及びｉｃカードの製造方法
WO2019068077A1 (en) 2017-09-29 2019-04-04 Avery Dennison Retail Information Services, Llc SYSTEMS AND METHODS FOR TRANSFERRING A FLEXIBLE CONDUCTOR TO A MOBILE STRIP
WO2019068068A1 (en) * 2017-09-29 2019-04-04 Avery Dennison Retail Information Services, Llc STRAP MOUNTING TECHNIQUES FOR WIRED FORMAT ANTENNAS
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
FR3079645B1 (fr) * 2018-04-03 2021-09-24 Idemia France Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay
KR102176235B1 (ko) * 2019-03-28 2020-11-09 코나엠 주식회사 양방향 통신이 가능한 메탈 카드 및 메탈 카드 제조 방법
DE102019123093A1 (de) * 2019-08-28 2021-03-04 Infineon Technologies Ag Verfahren zum Bearbeiten einer Schichtenstruktur und Chipkarteninlay
EP4404101A3 (de) * 2021-05-04 2024-10-16 Giesecke+Devrient ePayments GmbH Kartenförmiger datenträger sowie halbzeug und kontaktlayout dafür, und verfahren zur herstellung derselben
KR102877175B1 (ko) 2021-10-18 2025-10-24 주식회사 아이에스시 커넥터
JP2025150463A (ja) * 2024-03-27 2025-10-09 株式会社東芝 Ｉｃモジュール及びｉｃカード

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624284B1 (fr) * 1987-12-03 1991-08-16 Sgs Thomson Microelectronics Carte comportant un composant electronique
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US20020086566A1 (en) * 2000-12-06 2002-07-04 Simons Everett F. Robust, low-resistance elastomeric conductive polymer interconnect
JP2007265114A (ja) * 2006-03-29 2007-10-11 Oki Electric Ind Co Ltd 非接触通信電子機器のアクセス制御方法及び非接触通信電子機器
WO2009101561A1 (en) * 2008-02-14 2009-08-20 Koninklijke Philips Electronics N.V. Lighting system, light source and electrode device
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
JP5697856B2 (ja) * 2009-06-24 2015-04-08 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子、白色有機エレクトロルミネッセンス素子、表示装置及び照明装置
DE102009058435A1 (de) 2009-12-16 2011-06-22 Giesecke & Devrient GmbH, 81677 Befestigen und elektrisch leitendes Verbinden eines Chipmoduls mit einer Chipkarte
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
US9823221B2 (en) * 2012-02-17 2017-11-21 STRATEC CONSUMABLES GmbH Microstructured polymer devices
US9523713B2 (en) * 2013-05-28 2016-12-20 Intel Corporation Interconnects including liquid metal

Also Published As

Publication number Publication date
US20150161501A1 (en) 2015-06-11
DE102012211546B4 (de) 2017-02-16
KR20150034695A (ko) 2015-04-03
WO2014006024A1 (en) 2014-01-09
DE102012211546A1 (de) 2014-01-09
CA2875765A1 (en) 2014-01-09
CN104412281A (zh) 2015-03-11
JP2015521777A (ja) 2015-07-30
BR112014032514A2 (pt) 2017-06-27

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