IN2014DE01762A - - Google Patents
Info
- Publication number
- IN2014DE01762A IN2014DE01762A IN1762DE2014A IN2014DE01762A IN 2014DE01762 A IN2014DE01762 A IN 2014DE01762A IN 1762DE2014 A IN1762DE2014 A IN 1762DE2014A IN 2014DE01762 A IN2014DE01762 A IN 2014DE01762A
- Authority
- IN
- India
- Prior art keywords
- circuit
- series
- parallel
- capacitor
- switching elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
- Power Conversion In General (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013137780A JP6151110B2 (ja) | 2013-07-01 | 2013-07-01 | 電力変換装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DE01762A true IN2014DE01762A (fr) | 2015-06-19 |
Family
ID=52258020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1762DE2014 IN2014DE01762A (fr) | 2013-07-01 | 2014-06-30 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6151110B2 (fr) |
CN (1) | CN104283448B (fr) |
IN (1) | IN2014DE01762A (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017137057A1 (fr) * | 2016-02-08 | 2017-08-17 | Abb Schweiz Ag | Dispositif de commutation pour système d'alimentation haute-tension et agencement comprenant un tel dispositif de commutation |
CN106546782A (zh) * | 2016-11-21 | 2017-03-29 | 国网四川省电力公司成都供电公司 | 一种用于超长电缆交流耐压试验的串并联谐振电抗器阵列 |
JP2018107866A (ja) * | 2016-12-22 | 2018-07-05 | 富士ゼロックス株式会社 | 電源装置、画像形成装置及びトランス |
WO2019163205A1 (fr) * | 2018-02-20 | 2019-08-29 | 三菱電機株式会社 | Module de semi-conducteur de puissance et dispositif de conversion d'énergie l'utilisant |
JP6704538B2 (ja) * | 2018-05-28 | 2020-06-03 | 三菱電機株式会社 | 電力変換装置 |
JP6677363B1 (ja) * | 2018-06-23 | 2020-04-08 | 株式会社村田製作所 | 電子モジュールおよびスイッチング電源 |
CN112260560B (zh) * | 2019-07-05 | 2023-12-19 | 松下知识产权经营株式会社 | 电力变换装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274322A (ja) * | 2000-03-27 | 2001-10-05 | Mitsubishi Electric Corp | パワー半導体モジュール |
US7446628B2 (en) * | 2004-12-09 | 2008-11-04 | Wispry, Inc. | Pole-zero elements and related systems and methods |
JP2010041790A (ja) * | 2008-08-04 | 2010-02-18 | Fuji Electric Systems Co Ltd | 電力変換装置 |
JP5240215B2 (ja) * | 2010-02-17 | 2013-07-17 | 日立電線株式会社 | 回路基板及びそれを用いた電力変換装置 |
DE102010060508B8 (de) * | 2010-11-11 | 2012-08-16 | Sma Solar Technology Ag | Spannungswandler mit einer Speicherdrossel mit einer Wicklung und einer Speicherdrossel mit zwei Wicklungen |
JP2012231593A (ja) * | 2011-04-26 | 2012-11-22 | Nippon Soken Inc | 電力変換装置 |
JP5669677B2 (ja) * | 2011-06-14 | 2015-02-12 | 住友重機械工業株式会社 | 電力変換装置および電力変換モジュール |
TWI474616B (zh) * | 2011-07-28 | 2015-02-21 | Richwave Technology Corp | 可調整頻率響應之濾波器 |
-
2013
- 2013-07-01 JP JP2013137780A patent/JP6151110B2/ja not_active Expired - Fee Related
-
2014
- 2014-06-25 CN CN201410290817.7A patent/CN104283448B/zh not_active Expired - Fee Related
- 2014-06-30 IN IN1762DE2014 patent/IN2014DE01762A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6151110B2 (ja) | 2017-06-21 |
CN104283448A (zh) | 2015-01-14 |
CN104283448B (zh) | 2017-06-27 |
JP2015012742A (ja) | 2015-01-19 |
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