IN2014DE00517A - - Google Patents

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Publication number
IN2014DE00517A
IN2014DE00517A IN517DE2014A IN2014DE00517A IN 2014DE00517 A IN2014DE00517 A IN 2014DE00517A IN 517DE2014 A IN517DE2014 A IN 517DE2014A IN 2014DE00517 A IN2014DE00517 A IN 2014DE00517A
Authority
IN
India
Prior art keywords
fastening
circuit substrate
resin sealing
substrate
sealing member
Prior art date
Application number
Other languages
English (en)
Inventor
Niwa Masahiro
Ueno Yukiyasu
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of IN2014DE00517A publication Critical patent/IN2014DE00517A/en

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
IN517DE2014 2013-03-01 2014-02-25 IN2014DE00517A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013040713A JP5892088B2 (ja) 2013-03-01 2013-03-01 車両用電子制御ユニット

Publications (1)

Publication Number Publication Date
IN2014DE00517A true IN2014DE00517A (de) 2015-06-19

Family

ID=51439995

Family Applications (1)

Application Number Title Priority Date Filing Date
IN517DE2014 IN2014DE00517A (de) 2013-03-01 2014-02-25

Country Status (3)

Country Link
JP (1) JP5892088B2 (de)
CN (1) CN104023496B (de)
IN (1) IN2014DE00517A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017005059A (ja) * 2015-06-08 2017-01-05 株式会社ジャパンディスプレイ 固定構造および固定方法
JP6636363B2 (ja) * 2016-03-17 2020-01-29 日立オートモティブシステムズ株式会社 取付部材の取付構造および電子制御装置の取付構造
JP2019029371A (ja) * 2017-07-25 2019-02-21 ソニー株式会社 電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608611A (en) * 1995-10-03 1997-03-04 United Technologies Automotive, Inc./Ford Motor Company Vehicle electronic module with integral mounting and grounding means
JPH1051158A (ja) * 1996-08-02 1998-02-20 Denso Corp 回路装置
WO1999059225A1 (en) * 1998-05-08 1999-11-18 Ut Automotive Dearborn, Inc. Foamed housing for a circuit board
JP4182834B2 (ja) * 2003-07-23 2008-11-19 トヨタ自動車株式会社 車載用電子制御装置
JP4585828B2 (ja) * 2004-10-06 2010-11-24 日立オートモティブシステムズ株式会社 制御装置およびその製造方法
CN2840538Y (zh) * 2005-11-11 2006-11-22 康佳集团股份有限公司 按键防水装置
CN201064022Y (zh) * 2007-06-04 2008-05-21 保音股份有限公司 控制器壳体防水装置
US7616448B2 (en) * 2007-09-14 2009-11-10 Delphi Technologies, Inc. Wrap-around overmold for electronic assembly
CN201119173Y (zh) * 2007-10-08 2008-09-17 颜玲明 电路板的防水装置
JP2009158793A (ja) * 2007-12-27 2009-07-16 Hitachi Ltd 電子機器の樹脂封止成形方法
JP4884406B2 (ja) * 2008-01-28 2012-02-29 日立オートモティブシステムズ株式会社 樹脂封止型電子モジュール及びその樹脂封止成形方法
CN201204773Y (zh) * 2008-02-22 2009-03-04 嘉兴市鸿道通讯科技有限公司 一种数据采集装置壳体
JP2009284705A (ja) * 2008-05-23 2009-12-03 Autonetworks Technologies Ltd 電気接続箱の放熱構造
CN201243426Y (zh) * 2008-06-24 2009-05-20 英华达股份有限公司 手持电子装置的防水结构
CN201393351Y (zh) * 2009-03-17 2010-01-27 苏州大方特种车辆有限公司 一种控制器的封装
JP5621217B2 (ja) * 2009-06-11 2014-11-12 シンフォニアテクノロジー株式会社 電子モジュールの製造方法及び電子モジュール並びに車両
JP2011187666A (ja) * 2010-03-08 2011-09-22 Denso Corp 車載用防水装置の固定構造
US8387457B2 (en) * 2011-01-11 2013-03-05 Delphi Technologies, Inc. Collision sensor housing and module

Also Published As

Publication number Publication date
CN104023496B (zh) 2018-03-27
CN104023496A (zh) 2014-09-03
JP5892088B2 (ja) 2016-03-23
JP2014168987A (ja) 2014-09-18

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