IN2014CN03656A - - Google Patents

Info

Publication number
IN2014CN03656A
IN2014CN03656A IN3656CHN2014A IN2014CN03656A IN 2014CN03656 A IN2014CN03656 A IN 2014CN03656A IN 3656CHN2014 A IN3656CHN2014 A IN 3656CHN2014A IN 2014CN03656 A IN2014CN03656 A IN 2014CN03656A
Authority
IN
India
Prior art keywords
membrane
substrate
collapsed
region
electrode
Prior art date
Application number
Other languages
English (en)
Inventor
Andrew Lee Robinson
John Douglas Fraser
Original Assignee
Koninkl Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Nv filed Critical Koninkl Philips Nv
Publication of IN2014CN03656A publication Critical patent/IN2014CN03656A/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
IN3656CHN2014 2011-11-17 2012-11-05 IN2014CN03656A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161560836P 2011-11-17 2011-11-17
PCT/IB2012/056152 WO2013072803A1 (en) 2011-11-17 2012-11-05 Pre-collapsed capacitive micro-machined transducer cell with annular-shaped collapsed region

Publications (1)

Publication Number Publication Date
IN2014CN03656A true IN2014CN03656A (ja) 2015-10-16

Family

ID=47324242

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3656CHN2014 IN2014CN03656A (ja) 2011-11-17 2012-11-05

Country Status (9)

Country Link
US (2) US9762148B2 (ja)
EP (1) EP2747905B1 (ja)
JP (1) JP6265906B2 (ja)
CN (1) CN103958079B (ja)
BR (1) BR112014011644A2 (ja)
IN (1) IN2014CN03656A (ja)
MX (1) MX2014005795A (ja)
RU (1) RU2609917C2 (ja)
WO (1) WO2013072803A1 (ja)

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CN103917304B (zh) * 2011-10-28 2016-08-17 皇家飞利浦有限公司 具有应力层的预塌陷电容式微加工换能器单元
CN105492129B (zh) * 2013-08-27 2019-07-02 皇家飞利浦有限公司 双模式cmut换能器
JP6474139B2 (ja) * 2013-08-30 2019-02-27 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 容量性マイクロマシン超音波トランスデューサセル
JP6534190B2 (ja) 2013-09-27 2019-06-26 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスデューサアセンブリ並びに超音波を送信及び受信するための方法
US11241715B2 (en) 2015-06-30 2022-02-08 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10656255B2 (en) * 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
CN109640832B (zh) * 2016-08-30 2022-05-27 皇家飞利浦有限公司 具有超声换能器阵列的成像设备
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
WO2019109010A1 (en) 2017-12-01 2019-06-06 Invensense, Inc. Darkfield tracking
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
EP3533386A1 (en) * 2018-02-28 2019-09-04 Koninklijke Philips N.V. Pressure sensing with capacitive pressure sensor
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
CN108793061B (zh) * 2018-05-25 2020-11-27 岭南师范学院 一种全电极凸纹结构cmut器件的制备方法
WO2020030776A1 (en) * 2018-08-09 2020-02-13 Koninklijke Philips N.V. Intraluminal device with capacitive pressure sensor
CN109530194B (zh) * 2018-10-18 2020-07-14 天津大学 一种多电极cmut单元及多频式电容微机械超声换能器
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
CN109909140B (zh) * 2019-03-06 2021-06-04 中国工程物理研究院电子工程研究所 一种压电微机械超声换能器及其制备方法
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
WO2020264046A1 (en) 2019-06-25 2020-12-30 Invensense, Inc. Fake finger detection based on transient features
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
CN115551650A (zh) 2020-03-09 2022-12-30 应美盛公司 具有非均匀厚度的接触层的超声指纹传感器
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
TWI814403B (zh) * 2022-05-26 2023-09-01 佳世達科技股份有限公司 超聲波換能器

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CN100454455C (zh) * 2001-07-17 2009-01-21 Smc株式会社 微机电传感器
JP2007527285A (ja) * 2004-02-27 2007-09-27 ジョージア テック リサーチ コーポレイション 多要素電極ｃｍｕｔ素子及び製作方法
US20060004289A1 (en) 2004-06-30 2006-01-05 Wei-Cheng Tian High sensitivity capacitive micromachined ultrasound transducer
JP4724505B2 (ja) * 2005-09-09 2011-07-13 株式会社日立製作所 超音波探触子およびその製造方法
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
JP5260650B2 (ja) * 2007-07-31 2013-08-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 高ｋ誘電体を有するｃｍｕｔ
CN101969856B (zh) * 2007-09-17 2013-06-05 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用
JP5408935B2 (ja) 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
CN101873830B (zh) 2007-12-03 2013-03-20 科隆科技公司 双模式操作微机械超声换能器
US8787116B2 (en) * 2007-12-14 2014-07-22 Koninklijke Philips N.V. Collapsed mode operable cMUT including contoured substrate
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
CN102159334A (zh) 2008-09-16 2011-08-17 皇家飞利浦电子股份有限公司 电容性微机械加工的超声换能器
EP2400893B1 (en) 2009-02-27 2017-01-04 Koninklijke Philips N.V. Pre-collapsed cmut with mechanical collapse retention
EP2269746B1 (en) * 2009-07-02 2014-05-14 Nxp B.V. Collapsed mode capacitive sensor
JP2012095112A (ja) * 2010-10-27 2012-05-17 Olympus Corp 超音波発生ユニット

Also Published As

Publication number Publication date
RU2014124363A (ru) 2015-12-27
RU2609917C2 (ru) 2017-02-07
US20140265721A1 (en) 2014-09-18
CN103958079B (zh) 2016-08-24
US9762148B2 (en) 2017-09-12
CN103958079A (zh) 2014-07-30
JP2014533907A (ja) 2014-12-15
BR112014011644A2 (pt) 2017-05-02
MX2014005795A (es) 2014-05-30
EP2747905B1 (en) 2021-10-20
US20170353129A1 (en) 2017-12-07
EP2747905A1 (en) 2014-07-02
WO2013072803A1 (en) 2013-05-23
US10128777B2 (en) 2018-11-13
JP6265906B2 (ja) 2018-01-24

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