IN2014CN03129A - - Google Patents
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- Publication number
- IN2014CN03129A IN2014CN03129A IN3129CHN2014A IN2014CN03129A IN 2014CN03129 A IN2014CN03129 A IN 2014CN03129A IN 3129CHN2014 A IN3129CHN2014 A IN 3129CHN2014A IN 2014CN03129 A IN2014CN03129 A IN 2014CN03129A
- Authority
- IN
- India
- Prior art keywords
- compounds
- compositions
- adhesive
- useful
- applications
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0233—Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161552494P | 2011-10-28 | 2011-10-28 | |
PCT/US2012/061865 WO2013063236A1 (en) | 2011-10-28 | 2012-10-25 | Amine/epoxy curing of benzoxazines |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN03129A true IN2014CN03129A (ru) | 2015-07-03 |
Family
ID=47178335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN3129CHN2014 IN2014CN03129A (ru) | 2011-10-28 | 2012-10-25 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9695273B2 (ru) |
EP (1) | EP2771402B1 (ru) |
JP (1) | JP2015502416A (ru) |
KR (1) | KR101951266B1 (ru) |
CN (1) | CN104024331B (ru) |
IN (1) | IN2014CN03129A (ru) |
SG (1) | SG11201401641WA (ru) |
WO (1) | WO2013063236A1 (ru) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2691457B1 (en) * | 2011-03-28 | 2014-11-19 | 3M Innovative Properties Company | Curable composition, article, method of curing, and tack-free reaction product |
US10301471B2 (en) * | 2014-06-13 | 2019-05-28 | Dic Corporation | Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product |
EP3233811B1 (en) | 2014-12-18 | 2020-09-09 | 3M Innovative Properties Company | Curable benzoxazine compositions with improved thermal stability |
US20160297994A1 (en) * | 2015-04-10 | 2016-10-13 | Eastman Chemical Company | Curable benzoxazine-based phenolic resins and coating compositions thereof |
WO2016200557A1 (en) | 2015-06-09 | 2016-12-15 | 3M Innovative Properties Company | Ammonium salt catalyzed benzoxazine polymerization |
EP3498750A1 (de) | 2017-12-15 | 2019-06-19 | HILTI Aktiengesellschaft | Härterkomponente für mehrkomponenten-epoxidharzmasse und mehrkomponenten-epoxidharzmasse |
EP3775004A4 (en) * | 2018-03-30 | 2022-01-19 | Toray Industries, Inc. | COMPOSITION OF EPOXY RESIN, PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL |
ES2923248T3 (es) * | 2018-09-19 | 2022-09-26 | Hilti Ag | Composición endurecedora para una masa de resina epóxica, masa de resina epóxica y sistema de resina epóxica multicomponente |
US20230159705A1 (en) * | 2020-04-15 | 2023-05-25 | Kaneka Corporation | Synthesis, purification, and properties of ring-opened benzoxazine thermoplastic |
JP2023543292A (ja) * | 2020-09-29 | 2023-10-13 | 株式会社カネカ | 溶融重合による自己修復性ベンゾオキサジンポリマーの合成 |
CN115232583A (zh) * | 2022-09-23 | 2022-10-25 | 武汉市三选科技有限公司 | 高储存性底部填充胶、其制备方法及芯片封装结构 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
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US3018262A (en) | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
US3298998A (en) | 1961-03-07 | 1967-01-17 | Eastman Kodak Co | Bisglycidyl ethers of bisphenols |
US3496250A (en) | 1967-02-21 | 1970-02-17 | Borg Warner | Blends of epoxy resins and acrylonitrile butadiene-styrene graft copolymers |
US3890272A (en) | 1973-05-25 | 1975-06-17 | Univ Notre Dame Du Lac | Polymerizing bis-maleimides |
US4501864A (en) | 1983-12-22 | 1985-02-26 | Monsanto Company | Polymerizable compositions comprising polyamines and poly(dihydrobenzoxazines) |
US4503211A (en) | 1984-05-31 | 1985-03-05 | Minnesota Mining And Manufacturing Co. | Epoxy resin curing agent, process and composition |
US4719253A (en) | 1986-08-01 | 1988-01-12 | The Glidden Company | Self-curable benzoxazine functional cathodic electrocoat resins and process |
US5543516A (en) | 1994-05-18 | 1996-08-06 | Edison Polymer Innovation Corporation | Process for preparation of benzoxazine compounds in solventless systems |
US20020006484A1 (en) * | 1998-05-20 | 2002-01-17 | Balasubramaniam Ramalingam | Adhesive and coating formulations for flexible packaging |
JP3965786B2 (ja) * | 1998-06-25 | 2007-08-29 | 日立化成工業株式会社 | 熱硬化性樹脂組成物及びプリプレグ、プリント配線板用積層板 |
US6207586B1 (en) | 1998-10-28 | 2001-03-27 | Lucent Technologies Inc. | Oxide/nitride stacked gate dielectric and associated methods |
AU1518800A (en) * | 1998-11-03 | 2000-05-22 | Lubrizol Corporation, The | Lubricants having overbased metal salts and organic phosphites |
US6207786B1 (en) | 1998-11-10 | 2001-03-27 | Edison Polymer Innovation Corporation | Ternary systems of benzoxazine, epoxy, and phenolic resins |
US6376080B1 (en) | 1999-06-07 | 2002-04-23 | Loctite Corporation | Method for preparing polybenzoxazine |
JP2001288339A (ja) * | 2000-02-03 | 2001-10-16 | Nec Corp | エポキシ樹脂組成物の難燃化方法および難燃性エポキシ樹脂組成物 |
US6437026B1 (en) | 2001-01-05 | 2002-08-20 | Cookson Singapore Pte Ltd. | Hardener for epoxy molding compounds |
DE60108271T2 (de) | 2001-01-22 | 2006-03-02 | Huntsman Advanced Materials (Switzerland) Gmbh | Mittel zur flammschutzausrüstung |
TW584644B (en) | 2001-03-12 | 2004-04-21 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
CA2379505A1 (en) * | 2001-04-02 | 2002-10-02 | Hidenori Tanaka | Coating composition containing benzoxazine compound |
JP2003147165A (ja) * | 2001-08-29 | 2003-05-21 | Osaka City | 熱硬化性樹脂組成物 |
US6743852B2 (en) | 2001-11-13 | 2004-06-01 | Henkel Corporation | Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof |
CN1333015C (zh) * | 2002-02-06 | 2007-08-22 | 积水化学工业株式会社 | 树脂组合物 |
US7157545B2 (en) * | 2002-08-27 | 2007-01-02 | Acushnet Company | Compositions for golf equipment |
WO2004037878A2 (en) * | 2002-10-22 | 2004-05-06 | Henkel Corporation | Co-curable compositions |
US6894133B2 (en) * | 2002-12-11 | 2005-05-17 | 3M Innovative Properties Company | Azlactone initiators for atom transfer radical polymerization |
US20060102871A1 (en) * | 2003-04-08 | 2006-05-18 | Xingwu Wang | Novel composition |
US20050216075A1 (en) * | 2003-04-08 | 2005-09-29 | Xingwu Wang | Materials and devices of enhanced electromagnetic transparency |
US7157509B2 (en) | 2003-06-27 | 2007-01-02 | Henkel Corporation | Curable compositions |
JP4112586B2 (ja) * | 2003-12-08 | 2008-07-02 | 積水化学工業株式会社 | 熱硬化性樹脂組成物、樹脂シートおよび絶縁基板用樹脂シート |
US20070191555A1 (en) * | 2004-03-30 | 2007-08-16 | Hatsuo Ishida | Thermosetting resin composition and its article |
US20060134901A1 (en) * | 2004-12-22 | 2006-06-22 | National Starch And Chemical Investment Holding Corporation | Hot-Melt Underfill Composition and Methos of Application |
US7759435B2 (en) * | 2006-09-26 | 2010-07-20 | Loctite (R&D) Limited | Adducts and curable compositions using same |
US20100007018A1 (en) * | 2006-12-08 | 2010-01-14 | Derek Wyatt | Process for coating a bumped semiconductor wafer |
JP4976957B2 (ja) * | 2007-08-20 | 2012-07-18 | 積水化学工業株式会社 | 熱硬化性樹脂組成物及びその製造方法 |
US7847034B2 (en) * | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
JP2009227884A (ja) * | 2008-03-25 | 2009-10-08 | Showa Highpolymer Co Ltd | 熱硬化性樹脂組成物、それを用いた硬化物および積層板 |
CN102439088A (zh) * | 2009-02-12 | 2012-05-02 | 吉坤日矿日石能源株式会社 | 苯并*嗪树脂组合物 |
US7842401B2 (en) * | 2009-03-24 | 2010-11-30 | Iteq Corporation | Halogen-free varnish and prepreg thereof |
JP5627196B2 (ja) * | 2009-04-28 | 2014-11-19 | 国立大学法人横浜国立大学 | エポキシ樹脂組成物及びその硬化物 |
US8383706B2 (en) | 2009-06-05 | 2013-02-26 | 3M Innovative Properties Company | Benzoxazine-thiol adducts |
JP5813112B2 (ja) | 2010-08-04 | 2015-11-17 | スリーエム イノベイティブ プロパティズ カンパニー | ベンゾオキサジン−チオールポリマーフィルムの製造方法 |
EP2691457B1 (en) | 2011-03-28 | 2014-11-19 | 3M Innovative Properties Company | Curable composition, article, method of curing, and tack-free reaction product |
JP5972353B2 (ja) | 2011-03-28 | 2016-08-17 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性組成物、物品、硬化方法、及び反応生成物 |
WO2013048851A1 (en) | 2011-09-28 | 2013-04-04 | 3M Innovative Properties Company | Amine/thiol curing of benzoxazines |
-
2012
- 2012-10-25 JP JP2014538996A patent/JP2015502416A/ja active Pending
- 2012-10-25 US US14/345,258 patent/US9695273B2/en active Active
- 2012-10-25 EP EP12784828.1A patent/EP2771402B1/en not_active Not-in-force
- 2012-10-25 KR KR1020147013932A patent/KR101951266B1/ko active IP Right Grant
- 2012-10-25 IN IN3129CHN2014 patent/IN2014CN03129A/en unknown
- 2012-10-25 SG SG11201401641WA patent/SG11201401641WA/en unknown
- 2012-10-25 WO PCT/US2012/061865 patent/WO2013063236A1/en active Application Filing
- 2012-10-25 CN CN201280051619.4A patent/CN104024331B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2013063236A1 (en) | 2013-05-02 |
SG11201401641WA (en) | 2014-05-29 |
KR101951266B1 (ko) | 2019-02-22 |
US20150045528A1 (en) | 2015-02-12 |
CN104024331B (zh) | 2016-10-19 |
US9695273B2 (en) | 2017-07-04 |
EP2771402B1 (en) | 2018-06-27 |
KR20140084268A (ko) | 2014-07-04 |
CN104024331A (zh) | 2014-09-03 |
JP2015502416A (ja) | 2015-01-22 |
EP2771402A1 (en) | 2014-09-03 |
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