IN2013CH06152A - - Google Patents

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Publication number
IN2013CH06152A
IN2013CH06152A IN6152CH2013A IN2013CH06152A IN 2013CH06152 A IN2013CH06152 A IN 2013CH06152A IN 6152CH2013 A IN6152CH2013 A IN 6152CH2013A IN 2013CH06152 A IN2013CH06152 A IN 2013CH06152A
Authority
IN
India
Prior art keywords
composition
k2sif6
combinations
formula
water solubility
Prior art date
Application number
Other languages
English (en)
Inventor
Ravikumar Hanumantha
Prasanth Kumar Nammalwar
Anant Achyut Setlur
Robert Joseph Lyous
James Edward Murphy
Florencio Garcia
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to MYPI2016701852A priority Critical patent/MY174459A/en
Priority to EP14828089.4A priority patent/EP3090030B1/en
Priority to US15/109,267 priority patent/US10131835B2/en
Priority to KR1020167019884A priority patent/KR102443826B1/ko
Priority to CA2934249A priority patent/CA2934249C/en
Priority to PCT/US2014/070465 priority patent/WO2015102876A1/en
Priority to TW103143909A priority patent/TWI659087B/zh
Priority to IN6152CH2013 priority patent/IN2013CH06152A/en
Application filed by Gen Electric filed Critical Gen Electric
Priority to AU2014374223A priority patent/AU2014374223B2/en
Priority to MX2016008668A priority patent/MX2016008668A/es
Priority to JP2016542720A priority patent/JP6496738B2/ja
Priority to CN201480071866.XA priority patent/CN105849226A/zh
Publication of IN2013CH06152A publication Critical patent/IN2013CH06152A/en
Priority to PH12016500972A priority patent/PH12016500972A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
IN6152CH2013 2013-12-30 2014-12-16 IN2013CH06152A (zh)

Priority Applications (13)

Application Number Priority Date Filing Date Title
TW103143909A TWI659087B (zh) 2013-12-30 2014-12-16 耐濕氣之磷光體組成物及相關方法
US15/109,267 US10131835B2 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
KR1020167019884A KR102443826B1 (ko) 2013-12-30 2014-12-16 내습성 인광체 조성물 및 관련 방법
CA2934249A CA2934249C (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
PCT/US2014/070465 WO2015102876A1 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
MYPI2016701852A MY174459A (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
IN6152CH2013 IN2013CH06152A (zh) 2013-12-30 2014-12-16
EP14828089.4A EP3090030B1 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
AU2014374223A AU2014374223B2 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
MX2016008668A MX2016008668A (es) 2013-12-30 2014-12-16 Composiciones de fosforo resistentes a la humedad y metodos asociados.
JP2016542720A JP6496738B2 (ja) 2013-12-30 2014-12-16 耐湿性蛍光体組成物及び関連する方法
CN201480071866.XA CN105849226A (zh) 2013-12-30 2014-12-16 耐水分的磷光体组合物及相关方法
PH12016500972A PH12016500972A1 (en) 2013-12-30 2016-05-25 Moisture-resistant phosphor compositions and associate methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN6152CH2013 IN2013CH06152A (zh) 2013-12-30 2014-12-16

Publications (1)

Publication Number Publication Date
IN2013CH06152A true IN2013CH06152A (zh) 2015-07-03

Family

ID=52358983

Family Applications (1)

Application Number Title Priority Date Filing Date
IN6152CH2013 IN2013CH06152A (zh) 2013-12-30 2014-12-16

Country Status (13)

Country Link
US (1) US10131835B2 (zh)
EP (1) EP3090030B1 (zh)
JP (1) JP6496738B2 (zh)
KR (1) KR102443826B1 (zh)
CN (1) CN105849226A (zh)
AU (1) AU2014374223B2 (zh)
CA (1) CA2934249C (zh)
IN (1) IN2013CH06152A (zh)
MX (1) MX2016008668A (zh)
MY (1) MY174459A (zh)
PH (1) PH12016500972A1 (zh)
TW (1) TWI659087B (zh)
WO (1) WO2015102876A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6549070B2 (ja) * 2015-09-10 2019-07-24 株式会社東芝 蛍光体及びその製造方法、並びに発光装置
US10883045B2 (en) * 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
KR20190022798A (ko) * 2016-06-27 2019-03-06 제네럴 일렉트릭 컴퍼니 코팅된 망간 도핑 인광체
US10193030B2 (en) 2016-08-08 2019-01-29 General Electric Company Composite materials having red emitting phosphors
WO2018093832A2 (en) * 2016-11-17 2018-05-24 General Electric Company Coated red line emitting phosphors
US11193059B2 (en) 2016-12-13 2021-12-07 Current Lighting Solutions, Llc Processes for preparing color stable red-emitting phosphor particles having small particle size
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
CN111171815B (zh) * 2018-11-13 2021-12-17 厦门稀土材料研究所 一种氟化物发光材料的表面改性方法及其制备得到的氟化物发光材料
CN113214825B (zh) * 2021-04-26 2022-11-15 云南民族大学 一种固态照明led用多氟化物红光材料及其制备方法和应用
KR20220151076A (ko) * 2021-05-04 2022-11-14 삼성전자주식회사 발광장치 및 식물생장용 조명장치
JPWO2022255221A1 (zh) * 2021-05-31 2022-12-08

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4714701A (en) * 1999-12-07 2001-06-18 Global Products Sales And Marketing, Llc. Long persistent phosphor incorporated within a fabric material
JP2004155617A (ja) 2002-11-07 2004-06-03 Konica Minolta Holdings Inc 無機化合物の製造方法
US7648649B2 (en) 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US7358542B2 (en) 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US20070125984A1 (en) 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US20090162667A1 (en) 2007-12-20 2009-06-25 Lumination Llc Lighting device having backlighting, illumination and display applications
JP5396849B2 (ja) 2008-12-22 2014-01-22 住友金属鉱山株式会社 表面被覆層を有する硫化物蛍光体粒子とその製造方法
JP2010232381A (ja) * 2009-03-26 2010-10-14 Mitsubishi Chemicals Corp 半導体発光装置、並びに画像表示装置及び照明装置
JP5446511B2 (ja) 2009-06-30 2014-03-19 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP5250520B2 (ja) * 2009-09-25 2013-07-31 パナソニック株式会社 被覆蛍光体及びｌｅｄ発光装置
JP5795771B2 (ja) * 2009-12-17 2015-10-14 コーニンクレッカ フィリップス エヌ ヴェ 光源および波長変換構成要素を含む照明デバイス
US8377334B2 (en) 2009-12-23 2013-02-19 General Electric Company Coated phosphors, methods of making them, and articles comprising the same
US8057706B1 (en) 2010-07-27 2011-11-15 General Electric Company Moisture-resistant phosphor and associated method
JP4974310B2 (ja) 2010-10-15 2012-07-11 三菱化学株式会社 白色発光装置及び照明器具
US8252613B1 (en) 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors
MY167700A (en) * 2011-04-08 2018-09-21 Shinetsu Chemical Co Preparation of complex fluoride and complex fluoride phosphor
US9580643B2 (en) * 2012-02-16 2017-02-28 Koninklijke Philips N.V. Coated narrow band red-emitting fluorosilicates for semiconductor LEDS

Also Published As

Publication number Publication date
CA2934249C (en) 2022-11-01
AU2014374223B2 (en) 2018-01-04
US10131835B2 (en) 2018-11-20
JP2017503886A (ja) 2017-02-02
CN105849226A (zh) 2016-08-10
WO2015102876A1 (en) 2015-07-09
MX2016008668A (es) 2016-09-26
AU2014374223A1 (en) 2016-07-14
EP3090030A1 (en) 2016-11-09
US20160376499A1 (en) 2016-12-29
PH12016500972B1 (en) 2016-06-20
KR102443826B1 (ko) 2022-09-16
KR20160105430A (ko) 2016-09-06
CA2934249A1 (en) 2015-07-09
EP3090030B1 (en) 2018-02-21
TWI659087B (zh) 2019-05-11
TW201536894A (zh) 2015-10-01
MY174459A (en) 2020-04-20
JP6496738B2 (ja) 2019-04-03
PH12016500972A1 (en) 2016-06-20

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