IN2012DN02446A - - Google Patents

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Publication number
IN2012DN02446A
IN2012DN02446A IN2446DEN2012A IN2012DN02446A IN 2012DN02446 A IN2012DN02446 A IN 2012DN02446A IN 2446DEN2012 A IN2446DEN2012 A IN 2446DEN2012A IN 2012DN02446 A IN2012DN02446 A IN 2012DN02446A
Authority
IN
India
Prior art keywords
substrate
edge
coating
path
laser beam
Prior art date
Application number
Other languages
English (en)
Inventor
Catalano Michael
P Murphy Stephen
Diderich Steve
Original Assignee
First Solar Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by First Solar Inc filed Critical First Solar Inc
Publication of IN2012DN02446A publication Critical patent/IN2012DN02446A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • H10F19/33—Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photovoltaic Devices (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
IN2446DEN2012 2009-09-22 2010-09-21 IN2012DN02446A (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24452409P 2009-09-22 2009-09-22
PCT/US2010/049657 WO2011037921A1 (en) 2009-09-22 2010-09-21 System and method for tracking and removing coating from an edge of a substrate

Publications (1)

Publication Number Publication Date
IN2012DN02446A true IN2012DN02446A (enrdf_load_stackoverflow) 2015-08-21

Family

ID=43796168

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2446DEN2012 IN2012DN02446A (enrdf_load_stackoverflow) 2009-09-22 2010-09-21

Country Status (7)

Country Link
US (1) US8334162B2 (enrdf_load_stackoverflow)
EP (1) EP2480342B1 (enrdf_load_stackoverflow)
CN (1) CN102655949B (enrdf_load_stackoverflow)
IN (1) IN2012DN02446A (enrdf_load_stackoverflow)
MY (1) MY160582A (enrdf_load_stackoverflow)
TW (1) TWI513016B (enrdf_load_stackoverflow)
WO (1) WO2011037921A1 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110308610A1 (en) * 2010-06-18 2011-12-22 Primestar Solar System and method for modifying an article and a modified article
US9024233B2 (en) 2011-11-30 2015-05-05 First Solar, Inc. Side edge cleaning methods and apparatus for thin film photovoltaic devices
AU2013208273B2 (en) 2012-01-10 2015-11-26 Hzo, Inc. Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture
US9146207B2 (en) 2012-01-10 2015-09-29 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
US20130206738A1 (en) * 2012-02-10 2013-08-15 First Solar, Inc. In situ inductive ablation meter
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
EP2943289A4 (en) * 2013-01-08 2016-02-17 Hzo Inc COVERING OF SUBSTRATES FOR APPLYING PROTECTIVE LAYERS
US9908201B2 (en) * 2014-04-22 2018-03-06 Taiwan Semiconductor Manufacturing Company Limited Systems and methods for edge bead removal
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
NL2021701B1 (en) * 2018-09-25 2020-05-07 Suss Microtec Lithography Gmbh Edge bead removal system and method of treating a substrate

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US159634A (en) * 1875-02-09 Improvement in brick-machines
US268963A (en) * 1882-12-12 Speeding device for stamp-mills
US265497A (en) * 1882-10-03 Half to edward w
US234564A (en) * 1880-11-16 Mold for pressed glassware
US77805A (en) * 1868-05-12 Gustaye de villepojx
US127824A (en) * 1872-06-11 Improvement in wheels for vehicles
US189013A (en) * 1877-04-03 Improvement in knob-latches
US20087A (en) * 1858-04-27 Improvement in envelopes for letters
US4931152A (en) * 1984-11-19 1990-06-05 Avco Corporation Method for imparting erosion-resistance to metallic substrate
US6265328B1 (en) * 1998-01-30 2001-07-24 Silicon Genesis Corporation Wafer edge engineering method and device
JP2000052071A (ja) * 1998-08-04 2000-02-22 Sumitomo Heavy Ind Ltd レーザ光を用いた薄膜除去方法
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6660643B1 (en) * 1999-03-03 2003-12-09 Rwe Schott Solar, Inc. Etching of semiconductor wafer edges
DE19933703B4 (de) * 1999-04-07 2005-07-28 Shell Solar Gmbh Vorrichtung und Verfahren zum Abtragen von Schichten auf einer Solarzelle
KR100755810B1 (ko) * 1999-05-14 2007-09-07 쓰리엠 이노베이티브 프로퍼티즈 캄파니 애블레이션 보강층
US6255621B1 (en) 2000-01-31 2001-07-03 International Business Machines Corporation Laser cutting method for forming magnetic recording head sliders
US6423565B1 (en) * 2000-05-30 2002-07-23 Kurt L. Barth Apparatus and processes for the massproduction of photovotaic modules
US6559411B2 (en) * 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
US6874510B2 (en) * 2003-02-07 2005-04-05 Lsi Logic Corporation Method to use a laser to perform the edge clean operation on a semiconductor wafer
DE10318681B4 (de) * 2003-04-24 2006-07-06 Schott Ag Verfahren und Vorrichtung zum Entfernen eines Randbereichs einer Substratschicht und zur Substratbeschichtung sowie Substrat
US20050189013A1 (en) * 2003-12-23 2005-09-01 Oliver Hartley Process for manufacturing photovoltaic cells
EP1730788A1 (en) * 2004-02-24 2006-12-13 BP Corporation North America Inc. Process for manufacturing photovoltaic cells
KR100719367B1 (ko) * 2005-06-24 2007-05-17 삼성전자주식회사 반도체 제조 장치 및 웨이퍼 가공 방법
US7262115B2 (en) * 2005-08-26 2007-08-28 Dynatex International Method and apparatus for breaking semiconductor wafers
IL174003A0 (en) 2006-02-28 2006-08-01 Shafir Production Systems Ltd A method and apparatus for producing blades
DE102006033296A1 (de) * 2006-07-17 2008-01-31 Manz Automation Ag Anlage zur Strukturierung von Solarmodulen
US20080029152A1 (en) * 2006-08-04 2008-02-07 Erel Milshtein Laser scribing apparatus, systems, and methods
JP2010538475A (ja) * 2007-08-31 2010-12-09 アプライド マテリアルズ インコーポレイテッド 多サイズの光起電デバイスを形成するための生産ラインモジュール
US20090212030A1 (en) * 2008-02-25 2009-08-27 Optisolar, Inc., A Delaware Corporation Autofocus for Ablation Laser
CN101527328B (zh) * 2008-03-05 2012-03-14 鸿富锦精密工业（深圳）有限公司 太阳能电池及其制造方法
DE202008006110U1 (de) 2008-05-03 2008-10-16 4Jet Sales + Service Gmbh Vorrichtung zur Randentschichtung bei großflächigen Solarzellen
WO2010080358A2 (en) 2008-12-19 2010-07-15 Applied Materials, Inc. Edge film removal process for thin film solar cell applications
US20100184244A1 (en) * 2009-01-20 2010-07-22 SunPrint, Inc. Systems and methods for depositing patterned materials for solar panel production
US8111390B2 (en) * 2009-04-17 2012-02-07 Applied Materials, Inc. Method and apparatus for residue detection in the edge deleted area of a substrate

Also Published As

Publication number Publication date
CN102655949B (zh) 2014-08-06
CN102655949A (zh) 2012-09-05
MY160582A (en) 2017-03-15
WO2011037921A1 (en) 2011-03-31
TWI513016B (zh) 2015-12-11
US20110095004A1 (en) 2011-04-28
US8334162B2 (en) 2012-12-18
TW201133876A (en) 2011-10-01
EP2480342B1 (en) 2021-02-24
EP2480342A4 (en) 2017-08-02
EP2480342A1 (en) 2012-08-01

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