IN188605B - - Google Patents

Info

Publication number
IN188605B
IN188605B IN987CA1996A IN188605B IN 188605 B IN188605 B IN 188605B IN 987CA1996 A IN987CA1996 A IN 987CA1996A IN 188605 B IN188605 B IN 188605B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Charles A Poutasse
Richard L Luthy
Original Assignee
Ga Tek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ga Tek Inc filed Critical Ga Tek Inc
Publication of IN188605B publication Critical patent/IN188605B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IN987CA1996 1995-07-24 1996-05-30 IN188605B (he)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/505,741 US5614324A (en) 1995-07-24 1995-07-24 Multi-layer structures containing a silane adhesion promoting layer

Publications (1)

Publication Number Publication Date
IN188605B true IN188605B (he) 2002-10-19

Family

ID=24011633

Family Applications (1)

Application Number Title Priority Date Filing Date
IN987CA1996 IN188605B (he) 1995-07-24 1996-05-30

Country Status (8)

Country Link
US (1) US5614324A (he)
EP (1) EP0756443B1 (he)
JP (2) JP3163011B2 (he)
KR (1) KR100276010B1 (he)
CN (1) CN1076272C (he)
DE (1) DE69625554T2 (he)
IN (1) IN188605B (he)
TW (1) TW440529B (he)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2328322A (en) * 1997-08-12 1999-02-17 Shipley Co Llc Multilayer PCB manufacture with dielectric material matched to photo-resist material
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US6174561B1 (en) 1998-01-30 2001-01-16 James M. Taylor Composition and method for priming substrate materials
US6555170B2 (en) 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
AU2002227426A1 (en) * 2000-08-15 2002-06-24 World Properties Inc. Multi-layer circuits and methods of manufacture thereof
JP2002064277A (ja) * 2000-08-22 2002-02-28 Ibiden Co Ltd 多層プリント配線板および多層プリント配線板の製造方法
JP2002084073A (ja) * 2000-09-07 2002-03-22 Ibiden Co Ltd 多層プリント配線板および多層プリント配線板の製造方法
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby
US20050208278A1 (en) * 2001-08-22 2005-09-22 Landi Vincent R Method for improving bonding of circuit substrates to metal and articles formed thereby
JP4298943B2 (ja) * 2001-10-18 2009-07-22 日鉱金属株式会社 銅箔表面処理剤
CN100376386C (zh) 2001-11-01 2008-03-26 荒川化学工业株式会社 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体
WO2005068185A1 (en) * 2004-01-13 2005-07-28 Ube Industries, Ltd. Polyimide-metal laminated body and polyimide circuit board
DE102004005824A1 (de) * 2004-02-06 2005-08-25 Degussa Ag Organosiliciumeinheiten enthaltende Zubereitung auf Acrylatbasis, deren Herstellung und deren Verwendung
EP1978024A1 (en) * 2007-04-04 2008-10-08 Atotech Deutschland Gmbh Silane compositions comprising novel crosslinking agents
ES2970585T3 (es) * 2009-03-20 2024-05-29 Dow Global Technologies Llc Método para fabricar una estructura multicapa
CN101917826B (zh) * 2010-08-03 2013-08-21 东莞市仁吉电子材料有限公司 印刷电路板基板中,增加导电体与非导电高分子介电层之间结合力的方法
CN104073175B (zh) * 2013-03-25 2016-03-09 中国石油天然气集团公司 一种聚氨酯涂层与三层聚乙烯涂层化学键粘结的方法
CN104073176B (zh) * 2013-03-25 2015-10-14 中国石油天然气集团公司 一种提高三层聚乙烯涂层和液体补口涂层粘结性的方法
EP2857407B1 (en) * 2013-10-03 2017-02-01 Shin-Etsu Chemical Co., Ltd. Organosilicon compound, making method, adhesive composition, and article
JP6523942B2 (ja) * 2014-12-19 2019-06-05 四国化成工業株式会社 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用
DE102014119576A1 (de) * 2014-12-23 2016-06-23 Ernst-Moritz-Arndt-Universität Greifswald Pharmazeutische Arzneimittelform zur Applikation auf Schleimhäuten
AU2016342374B2 (en) 2015-10-23 2022-08-04 Lyndra Therapeutics, Inc. Gastric residence systems for sustained release of therapeutic agents and methods of use thereof
CN106626580B (zh) 2015-10-28 2019-12-24 财团法人工业技术研究院 复合积层板
MY195558A (en) * 2016-05-18 2023-02-01 Isola Usa Corp Method Of Manufacturing Circuit Boards

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3508983A (en) * 1967-04-24 1970-04-28 Schjeldahl Co G T Use of a silane coating to bond copper to plastic in making a printed circuit
US3708458A (en) * 1971-03-16 1973-01-02 Upjohn Co Copolyimides of benzophenone tetracarboxylic acid dianhydride and mixture of diisocyanates
JPS56111289A (en) * 1980-02-07 1981-09-02 Fujitsu Ltd Method of manufacturing copperrlined laminate
DE3208198A1 (de) * 1982-03-06 1983-09-08 Nippon Denkai Co., Ltd., Tokyo Verfahren zur verbindung von kupferfolie mit laminat-formmaterial
JPS6094348A (ja) * 1983-10-28 1985-05-27 松下電工株式会社 銅張積層板の製法
US4624978A (en) * 1983-11-14 1986-11-25 Rogers Corporation High temperature polyimide processing aid
JPS6177535A (ja) * 1984-09-25 1986-04-21 Niles Parts Co Ltd 車両用定速走行装置
JPH062828B2 (ja) * 1986-05-15 1994-01-12 宇部興産株式会社 ポリイミドフイルムの製造法
US4902731A (en) * 1986-08-27 1990-02-20 Hercules Incorporated Organosilicon prepolymers
US4732858A (en) * 1986-09-17 1988-03-22 Brewer Science, Inc. Adhesion promoting product and process for treating an integrated circuit substrate
US5189128A (en) * 1988-06-20 1993-02-23 Ciba-Geigy Corporation Solution stable polyimide resin systems
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
MX166210B (es) * 1988-12-23 1992-12-23 Goodrich Co B F Procedimiento para obtener un laminado y el laminado asi obtenido
US4923734A (en) * 1988-12-23 1990-05-08 The B. F. Goodrich Company Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers
US4923678A (en) * 1989-02-14 1990-05-08 The B. F. Goodrich Company Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2 -C4 monomers
JPH07120564B2 (ja) * 1989-10-02 1995-12-20 日本電解株式会社 抵抗層付導電材料及び抵抗層付プリント回路基板
US5145937A (en) * 1989-11-09 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides with carbonyl and ether connecting groups between the aromatic rings
US5227244A (en) * 1990-09-21 1993-07-13 E. I. Du Pont De Nemours And Company Polyimide film with metal salt coating resulting in improved adhesion
US5114757A (en) * 1990-10-26 1992-05-19 Linde Harold G Enhancement of polyimide adhesion on reactive metals
JPH0539295A (ja) * 1991-08-02 1993-02-19 Nikko Kyodo Co Ltd 金属表面処理剤
JPH06177536A (ja) * 1992-12-09 1994-06-24 Japan Energy Corp 金属表面処理剤
JPH06177535A (ja) * 1992-12-09 1994-06-24 Japan Energy Corp 金属表面処理剤

Also Published As

Publication number Publication date
EP0756443B1 (en) 2003-01-02
CN1076272C (zh) 2001-12-19
CN1145849A (zh) 1997-03-26
JPH0939152A (ja) 1997-02-10
JP3163011B2 (ja) 2001-05-08
US5614324A (en) 1997-03-25
KR100276010B1 (ko) 2000-12-15
DE69625554D1 (de) 2003-02-06
JP2001030428A (ja) 2001-02-06
DE69625554T2 (de) 2003-11-20
EP0756443A1 (en) 1997-01-29
KR970009483A (ko) 1997-02-24
TW440529B (en) 2001-06-16

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