IN165184B - - Google Patents

Info

Publication number
IN165184B
IN165184B IN929/DEL/85A IN929DE1985A IN165184B IN 165184 B IN165184 B IN 165184B IN 929DE1985 A IN929DE1985 A IN 929DE1985A IN 165184 B IN165184 B IN 165184B
Authority
IN
India
Application number
IN929/DEL/85A
Other languages
English (en)
Inventor
Chi Chung Yang
Ralph Mohr
Stephen Hudgens
Annette Johncock
Prem Nath
Original Assignee
Sovonics Solar Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sovonics Solar Systems filed Critical Sovonics Solar Systems
Publication of IN165184B publication Critical patent/IN165184B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G5/00Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
    • G03G5/02Charge-receiving layers
    • G03G5/04Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
    • G03G5/08Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
    • G03G5/082Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
    • G03G5/08214Silicon-based
    • G03G5/08264Silicon-based comprising seven or more silicon-based layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G5/00Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
    • G03G5/02Charge-receiving layers
    • G03G5/04Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
    • G03G5/08Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
    • G03G5/082Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
    • G03G5/08214Silicon-based
    • G03G5/08278Depositing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02425Conductive materials, e.g. metallic silicides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/0245Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02505Layer structure consisting of more than two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02529Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • H01L21/02579P-type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
IN929/DEL/85A 1984-11-05 1985-11-06 IN165184B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/668,435 US4624862A (en) 1984-11-05 1984-11-05 Boron doped semiconductor materials and method for producing same

Publications (1)

Publication Number Publication Date
IN165184B true IN165184B (es) 1989-08-26

Family

ID=24682293

Family Applications (1)

Application Number Title Priority Date Filing Date
IN929/DEL/85A IN165184B (es) 1984-11-05 1985-11-06

Country Status (11)

Country Link
US (1) US4624862A (es)
EP (1) EP0181113A3 (es)
JP (1) JPH07123112B2 (es)
CN (1) CN1008574B (es)
AU (1) AU4900285A (es)
BR (1) BR8505510A (es)
CA (1) CA1263731A (es)
ES (1) ES8702954A1 (es)
IN (1) IN165184B (es)
MX (1) MX169093B (es)
ZA (1) ZA858137B (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891330A (en) * 1987-07-27 1990-01-02 Energy Conversion Devices, Inc. Method of fabricating n-type and p-type microcrystalline semiconductor alloy material including band gap widening elements
JP2692683B2 (ja) * 1988-04-05 1997-12-17 富士通株式会社 半導体装置とその製造方法
US5180692A (en) * 1988-03-30 1993-01-19 Tokyo Electron Limited Method for the manufacture of boron-containing films by CVD or epitaxial techniques using boron trifluoride
JP2727106B2 (ja) * 1988-03-30 1998-03-11 東京エレクトロン株式会社 膜形成方法
JP2719036B2 (ja) * 1990-08-10 1998-02-25 株式会社富士電機総合研究所 非晶質光電変換装置およびその製造方法
US5162239A (en) * 1990-12-27 1992-11-10 Xerox Corporation Laser crystallized cladding layers for improved amorphous silicon light-emitting diodes and radiation sensors
JP3659512B2 (ja) * 1993-12-20 2005-06-15 キヤノン株式会社 光起電力素子及びその形成方法及びその形成装置
JP3370806B2 (ja) * 1994-11-25 2003-01-27 株式会社半導体エネルギー研究所 Mis型半導体装置の作製方法
US6287888B1 (en) 1997-12-26 2001-09-11 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and process for producing photoelectric conversion device
JP4293385B2 (ja) * 1998-01-27 2009-07-08 株式会社半導体エネルギー研究所 光電変換装置の作製方法
JP3913123B2 (ja) * 2001-06-28 2007-05-09 キヤノン株式会社 電子写真感光体の製造方法
US8222072B2 (en) * 2002-12-20 2012-07-17 The Trustees Of Princeton University Methods of fabricating devices by low pressure cold welding
US20040142104A1 (en) * 2003-01-07 2004-07-22 Woolley Christopher P. Apparatus and method for depositing environmentally sensitive thin film materials
US7179543B2 (en) * 2003-10-06 2007-02-20 The Trustees Of Princeton University Doping of organic opto-electronic devices to extend reliability
TW200825563A (en) * 2006-12-11 2008-06-16 Innolux Display Corp Light supply device and liquid crystal display device using the same
US9908282B2 (en) 2010-05-25 2018-03-06 Mossey Creek Technologies, Inc. Method for producing a semiconductor using a vacuum furnace
WO2011150058A2 (en) 2010-05-25 2011-12-01 Mossey Creek Solar, LLC Method of producing a semiconductor
US9620664B2 (en) 2010-05-25 2017-04-11 Mossey Creek Technologies, Inc. Coating of graphite tooling for manufacture of semiconductors
US8728831B2 (en) * 2010-12-30 2014-05-20 Stmicroelectronics Pte. Ltd. Reconstituted wafer warpage adjustment
US8828791B2 (en) 2011-07-20 2014-09-09 Mossey Creek Solar, LLC Substrate for use in preparing solar cells
US9543493B2 (en) 2011-11-22 2017-01-10 Mossey Creek Technologies, Inc. Packaging for thermoelectric subcomponents
US20140305478A1 (en) 2013-04-15 2014-10-16 Mossey Creek Solar, LLC Method for Producting a Thermoelectric Material

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969163A (en) * 1974-09-19 1976-07-13 Texas Instruments Incorporated Vapor deposition method of forming low cost semiconductor solar cells including reconstitution of the reacted gases
GB2033355B (en) * 1978-09-07 1982-05-06 Standard Telephones Cables Ltd Semiconductor processing
US4410558A (en) * 1980-05-19 1983-10-18 Energy Conversion Devices, Inc. Continuous amorphous solar cell production system
JPS574053A (en) * 1980-06-09 1982-01-09 Canon Inc Photoconductive member
US4394425A (en) * 1980-09-12 1983-07-19 Canon Kabushiki Kaisha Photoconductive member with α-Si(C) barrier layer
US4557987A (en) * 1980-12-23 1985-12-10 Canon Kabushiki Kaisha Photoconductive member having barrier layer and amorphous silicon charge generation and charge transport layers
GB2095030B (en) * 1981-01-08 1985-06-12 Canon Kk Photoconductive member
DE3200376A1 (de) * 1981-01-09 1982-11-04 Canon K.K., Tokyo Fotoleitfaehiges element
JPS5891683A (ja) * 1981-11-26 1983-05-31 Canon Inc 光導電部材
US4465750A (en) * 1981-12-22 1984-08-14 Canon Kabushiki Kaisha Photoconductive member with a -Si having two layer regions
US4483911A (en) * 1981-12-28 1984-11-20 Canon Kabushiki Kaisha Photoconductive member with amorphous silicon-carbon surface layer
US4409424A (en) * 1982-06-21 1983-10-11 Genevieve Devaud Compensated amorphous silicon solar cell

Also Published As

Publication number Publication date
EP0181113A2 (en) 1986-05-14
ES8702954A1 (es) 1987-01-16
CN85108824A (zh) 1986-08-06
US4624862A (en) 1986-11-25
ES548500A0 (es) 1987-01-16
CN1008574B (zh) 1990-06-27
AU4900285A (en) 1986-05-15
MX169093B (es) 1993-06-22
EP0181113A3 (en) 1987-04-22
ZA858137B (en) 1986-06-25
JPS61180426A (ja) 1986-08-13
BR8505510A (pt) 1986-08-05
JPH07123112B2 (ja) 1995-12-25
CA1263731A (en) 1989-12-05

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