IN158361B - - Google Patents
Info
- Publication number
- IN158361B IN158361B IN380/CAL/83A IN380CA1983A IN158361B IN 158361 B IN158361 B IN 158361B IN 380CA1983 A IN380CA1983 A IN 380CA1983A IN 158361 B IN158361 B IN 158361B
- Authority
- IN
- India
Links
Classifications
-
- H10W40/611—
-
- H10W78/00—
-
- H10W90/00—
-
- H10W40/231—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19823215192 DE3215192A1 (de) | 1982-04-23 | 1982-04-23 | Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN158361B true IN158361B (enExample) | 1986-10-25 |
Family
ID=6161750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN380/CAL/83A IN158361B (enExample) | 1982-04-23 | 1983-03-30 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4638404A (enExample) |
| EP (1) | EP0092720B1 (enExample) |
| JP (1) | JPS58192400A (enExample) |
| AT (1) | ATE15733T1 (enExample) |
| BR (1) | BR8302014A (enExample) |
| DE (2) | DE3215192A1 (enExample) |
| IN (1) | IN158361B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3446569C2 (de) * | 1984-12-20 | 1996-05-02 | Siemens Ag | Einspannvorrichtung für mehrere, scheibenförmige Halbleiterbauelemente |
| US4792204A (en) * | 1987-06-08 | 1988-12-20 | Siemens Aktiengesellschaft | Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment |
| CA1327710C (en) * | 1987-12-07 | 1994-03-15 | Kazuhiko Umezawa | Cooling system for ic package |
| DE68925403T2 (de) * | 1988-09-20 | 1996-05-30 | Nippon Electric Co | Kühlungsstruktur für elektronische Bauelemente |
| US5060115A (en) * | 1990-09-28 | 1991-10-22 | The United States Of America As Represented By The Secretary Of The Navy | Heat sink device for electronics modules packaged in cylindrical casings |
| JP2728105B2 (ja) * | 1991-10-21 | 1998-03-18 | 日本電気株式会社 | 集積回路用冷却装置 |
| JPH05327283A (ja) * | 1992-02-18 | 1993-12-10 | Samsung Electron Co Ltd | 半導体パッケージの垂直実装装置及びその実装方法 |
| US5184281A (en) * | 1992-03-03 | 1993-02-02 | Digital Equipment Corporation | Heat dissipation apparatus |
| IT1292590B1 (it) * | 1997-05-30 | 1999-02-08 | El Bo Mec S R L | Dissipatore di calore, in particolare per componenti elettronici. |
| US6038156A (en) * | 1998-06-09 | 2000-03-14 | Heart Interface Corporation | Power inverter with improved heat sink configuration |
| US6304449B1 (en) * | 1999-07-06 | 2001-10-16 | Chaojiong Zhang | Heat sink mounting for power semiconductors |
| TWI303973B (en) * | 2006-09-06 | 2008-12-01 | Delta Electronics Inc | Heat sink fastening device and manufacturing method thereof |
| EP2787529B1 (en) * | 2011-11-30 | 2018-05-23 | Mitsubishi Electric Corporation | Semiconductor device, and on-board power conversion device |
| DE102015206992A1 (de) * | 2015-04-17 | 2016-10-20 | Zf Friedrichshafen Ag | Anbindung eines Leistungsbauteils an einen Kühlkörper |
| US11076477B2 (en) * | 2017-10-03 | 2021-07-27 | Mks Instruments, Inc. | Cooling and compression clamp for short lead power devices |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1439304B2 (de) * | 1963-10-31 | 1972-02-24 | Siemens AG, 1000 Berlin u. 8000 München | Halbleiterbauelement |
| CH440464A (de) * | 1966-07-14 | 1967-07-31 | Bbc Brown Boveri & Cie | Kühlkörper für Halbleiterelemente |
| US3735206A (en) * | 1971-10-28 | 1973-05-22 | Nasa | Circuit board package with wedge shaped covers |
| BE814391A (fr) * | 1973-05-14 | 1974-08-16 | Module semi-conducteur | |
| DE2602589C2 (de) * | 1976-01-22 | 1982-02-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zum Einspannen eines Scheibenthyristors zwischen zwei Kühlkörpern |
| US4246597A (en) * | 1979-06-29 | 1981-01-20 | International Business Machines Corporation | Air cooled multi-chip module having a heat conductive piston spring loaded against the chips |
| SU997140A1 (ru) * | 1981-06-22 | 1983-02-15 | За витель | Полупроводникова выпр мительна установка |
| US4459639A (en) * | 1982-07-12 | 1984-07-10 | Rockwell International Corporation | Circuit board heatsink clamping assembly and technique |
| ATE39788T1 (de) * | 1982-09-09 | 1989-01-15 | Siemens Ag | Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. |
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1982
- 1982-04-23 DE DE19823215192 patent/DE3215192A1/de not_active Withdrawn
-
1983
- 1983-03-30 IN IN380/CAL/83A patent/IN158361B/en unknown
- 1983-04-08 EP EP83103453A patent/EP0092720B1/de not_active Expired
- 1983-04-08 DE DE8383103453T patent/DE3360822D1/de not_active Expired
- 1983-04-08 AT AT83103453T patent/ATE15733T1/de not_active IP Right Cessation
- 1983-04-11 US US06/483,734 patent/US4638404A/en not_active Expired - Fee Related
- 1983-04-18 JP JP58068253A patent/JPS58192400A/ja active Granted
- 1983-04-19 BR BR8302014A patent/BR8302014A/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0092720B1 (de) | 1985-09-18 |
| ATE15733T1 (de) | 1985-10-15 |
| DE3360822D1 (en) | 1985-10-24 |
| BR8302014A (pt) | 1983-12-27 |
| JPS58192400A (ja) | 1983-11-09 |
| DE3215192A1 (de) | 1983-10-27 |
| JPS6327861B2 (enExample) | 1988-06-06 |
| EP0092720A1 (de) | 1983-11-02 |
| US4638404A (en) | 1987-01-20 |