BR8302014A - Dispositivo de sujeicao para diversos componentes semicondutores em forma de discos - Google Patents

Dispositivo de sujeicao para diversos componentes semicondutores em forma de discos

Info

Publication number
BR8302014A
BR8302014A BR8302014A BR8302014A BR8302014A BR 8302014 A BR8302014 A BR 8302014A BR 8302014 A BR8302014 A BR 8302014A BR 8302014 A BR8302014 A BR 8302014A BR 8302014 A BR8302014 A BR 8302014A
Authority
BR
Brazil
Prior art keywords
pressure element
recess
semiconductor components
walls
lateral surfaces
Prior art date
Application number
BR8302014A
Other languages
English (en)
Portuguese (pt)
Inventor
Kurt Grossmann
Jurgen Bliesner
Joachim Schikor
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR8302014A publication Critical patent/BR8302014A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Load-Engaging Elements For Cranes (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Lubricants (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
BR8302014A 1982-04-23 1983-04-19 Dispositivo de sujeicao para diversos componentes semicondutores em forma de discos BR8302014A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823215192 DE3215192A1 (de) 1982-04-23 1982-04-23 Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente

Publications (1)

Publication Number Publication Date
BR8302014A true BR8302014A (pt) 1983-12-27

Family

ID=6161750

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8302014A BR8302014A (pt) 1982-04-23 1983-04-19 Dispositivo de sujeicao para diversos componentes semicondutores em forma de discos

Country Status (7)

Country Link
US (1) US4638404A (enExample)
EP (1) EP0092720B1 (enExample)
JP (1) JPS58192400A (enExample)
AT (1) ATE15733T1 (enExample)
BR (1) BR8302014A (enExample)
DE (2) DE3215192A1 (enExample)
IN (1) IN158361B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446569C2 (de) * 1984-12-20 1996-05-02 Siemens Ag Einspannvorrichtung für mehrere, scheibenförmige Halbleiterbauelemente
US4792204A (en) * 1987-06-08 1988-12-20 Siemens Aktiengesellschaft Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
US5060115A (en) * 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
IT1292590B1 (it) * 1997-05-30 1999-02-08 El Bo Mec S R L Dissipatore di calore, in particolare per componenti elettronici.
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
US6304449B1 (en) * 1999-07-06 2001-10-16 Chaojiong Zhang Heat sink mounting for power semiconductors
TWI303973B (en) * 2006-09-06 2008-12-01 Delta Electronics Inc Heat sink fastening device and manufacturing method thereof
JP5634621B2 (ja) * 2011-11-30 2014-12-03 三菱電機株式会社 半導体装置、及び車載用電力変換装置
DE102015206992A1 (de) * 2015-04-17 2016-10-20 Zf Friedrichshafen Ag Anbindung eines Leistungsbauteils an einen Kühlkörper
US11076477B2 (en) * 2017-10-03 2021-07-27 Mks Instruments, Inc. Cooling and compression clamp for short lead power devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439304B2 (de) * 1963-10-31 1972-02-24 Siemens AG, 1000 Berlin u. 8000 München Halbleiterbauelement
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
US3735206A (en) * 1971-10-28 1973-05-22 Nasa Circuit board package with wedge shaped covers
BE814391A (fr) * 1973-05-14 1974-08-16 Module semi-conducteur
DE2602589C2 (de) * 1976-01-22 1982-02-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines Scheibenthyristors zwischen zwei Kühlkörpern
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
SU997140A1 (ru) * 1981-06-22 1983-02-15 За витель Полупроводникова выпр мительна установка
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
EP0103068B1 (de) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen

Also Published As

Publication number Publication date
EP0092720A1 (de) 1983-11-02
JPS6327861B2 (enExample) 1988-06-06
JPS58192400A (ja) 1983-11-09
EP0092720B1 (de) 1985-09-18
IN158361B (enExample) 1986-10-25
US4638404A (en) 1987-01-20
DE3360822D1 (en) 1985-10-24
ATE15733T1 (de) 1985-10-15
DE3215192A1 (de) 1983-10-27

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Legal Events

Date Code Title Description
MM Lapse due to non-payment of fees (art. 50)