IL93375A - מוצר הלחמה מורכב - Google Patents
מוצר הלחמה מורכבInfo
- Publication number
- IL93375A IL93375A IL9337590A IL9337590A IL93375A IL 93375 A IL93375 A IL 93375A IL 9337590 A IL9337590 A IL 9337590A IL 9337590 A IL9337590 A IL 9337590A IL 93375 A IL93375 A IL 93375A
- Authority
- IL
- Israel
- Prior art keywords
- solder
- temperature control
- control component
- base solder
- tin
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB898903311A GB8903311D0 (en) | 1989-02-14 | 1989-02-14 | Composite solder article |
Publications (2)
Publication Number | Publication Date |
---|---|
IL93375A0 IL93375A0 (en) | 1990-11-29 |
IL93375A true IL93375A (he) | 1994-01-25 |
Family
ID=10651661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL9337590A IL93375A (he) | 1989-02-14 | 1990-02-13 | מוצר הלחמה מורכב |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0458871A1 (he) |
AU (1) | AU5156790A (he) |
CA (1) | CA2045683A1 (he) |
GB (1) | GB8903311D0 (he) |
IL (1) | IL93375A (he) |
WO (1) | WO1990009255A1 (he) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9203289D0 (en) * | 1992-02-17 | 1992-04-01 | Raychem Sa Nv | Coaxial cable termination arrangement |
US5331113A (en) * | 1992-10-30 | 1994-07-19 | Raychem Corporation | Electrical connector |
DE202005021567U1 (de) * | 2005-08-27 | 2009-01-02 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Lot |
US8410600B2 (en) | 2009-10-02 | 2013-04-02 | Arkansas Power Electronics International, Inc. | Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting film |
US8592986B2 (en) | 2010-11-09 | 2013-11-26 | Rohm Co., Ltd. | High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device |
US9673163B2 (en) | 2011-10-18 | 2017-06-06 | Rohm Co., Ltd. | Semiconductor device with flip chip structure and fabrication method of the semiconductor device |
US9761506B2 (en) | 2012-02-23 | 2017-09-12 | Rohm Co., Ltd. | Semiconductor device and fabrication method for the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2823122C2 (de) * | 1978-05-26 | 1983-11-24 | Nisshin Steel Co., Ltd., Tokyo | Verfahren zum Weichlöten von ineinander gesteckten Rohren aus nichtrostendem Stahl |
GB2036794A (en) * | 1978-11-28 | 1980-07-02 | Semi Alloys Inc | Solder Preform |
US4767471A (en) * | 1986-10-03 | 1988-08-30 | Texas Instruments Incorporated | Delayed reflow alloy mix solder paste |
GB8710489D0 (en) * | 1987-05-02 | 1987-06-03 | Raychem Pontoise Sa | Solder connector device |
GB8817192D0 (en) * | 1988-07-19 | 1988-08-24 | Raychem Pontoise Sa | Solder & connection device incorporating solder |
-
1989
- 1989-02-14 GB GB898903311A patent/GB8903311D0/en active Pending
-
1990
- 1990-02-13 CA CA002045683A patent/CA2045683A1/en not_active Abandoned
- 1990-02-13 WO PCT/GB1990/000234 patent/WO1990009255A1/en not_active Application Discontinuation
- 1990-02-13 IL IL9337590A patent/IL93375A/he not_active IP Right Cessation
- 1990-02-13 EP EP90903622A patent/EP0458871A1/en not_active Withdrawn
- 1990-02-13 AU AU51567/90A patent/AU5156790A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1990009255A1 (en) | 1990-08-23 |
EP0458871A1 (en) | 1991-12-04 |
GB8903311D0 (en) | 1989-04-05 |
IL93375A0 (en) | 1990-11-29 |
CA2045683A1 (en) | 1990-08-15 |
AU5156790A (en) | 1990-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5086967A (en) | Solder connection device | |
US4722471A (en) | Solder connector device | |
US5498850A (en) | Semiconductor electrical heater and method for making same | |
EP0270283B1 (en) | Solder connection device | |
EP0664055B1 (en) | Electrical connector | |
EP0596993B1 (en) | Heat-recoverable soldering device | |
JPH09504406A (ja) | ワイヤコネクタ | |
IL93375A (he) | מוצר הלחמה מורכב | |
JPS63318082A (ja) | ケーブル接続部形成方法およびそのためのアレンジメント | |
US4553809A (en) | Electrical connector | |
GB2071703A (en) | Contact element and process for producing the same | |
JP2667188B2 (ja) | ヒューズ及びその製造方法 | |
WO1990000954A1 (en) | Solder and connection device incorporating solder | |
EP0265878B1 (en) | Method of producing a welded electrical contact assembly | |
JPH04503480A (ja) | 複合はんだ物品 | |
IL97015A (he) | התקן ליצירת חיבורי הלחמה | |
CA1257148A (en) | Solder connector device | |
CA1223457A (en) | Thermocouple | |
FR2621184A1 (fr) | Dispositif de protection contre les surtensions | |
JP2003249155A (ja) | 鉛フリ−合金型温度ヒュ−ズ | |
JPS593017B2 (ja) | 温度ヒユ−ズ | |
JPS593016B2 (ja) | 温度ヒユ−ズ | |
JPH0646536B2 (ja) | ヒューズ並びにヒューズ用低融点チップ及びその製造方法 | |
FR2479054A1 (fr) | Procede pour braser deux pieces metalliques | |
JPS6136681B2 (he) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
KB | Patent renewed | ||
RH | Patent void |