IL80226A - Methods for selectively removing adhesives from polyimide substrates - Google Patents

Methods for selectively removing adhesives from polyimide substrates

Info

Publication number
IL80226A
IL80226A IL80226A IL8022686A IL80226A IL 80226 A IL80226 A IL 80226A IL 80226 A IL80226 A IL 80226A IL 8022686 A IL8022686 A IL 8022686A IL 80226 A IL80226 A IL 80226A
Authority
IL
Israel
Prior art keywords
methods
selectively removing
polyimide substrates
removing adhesives
adhesives
Prior art date
Application number
IL80226A
Other languages
English (en)
Other versions
IL80226A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL80226A0 publication Critical patent/IL80226A0/xx
Publication of IL80226A publication Critical patent/IL80226A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • ing And Chemical Polishing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IL80226A 1985-12-09 1986-10-02 Methods for selectively removing adhesives from polyimide substrates IL80226A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/806,874 US4639290A (en) 1985-12-09 1985-12-09 Methods for selectively removing adhesives from polyimide substrates

Publications (2)

Publication Number Publication Date
IL80226A0 IL80226A0 (en) 1987-01-30
IL80226A true IL80226A (en) 1990-09-17

Family

ID=25195022

Family Applications (1)

Application Number Title Priority Date Filing Date
IL80226A IL80226A (en) 1985-12-09 1986-10-02 Methods for selectively removing adhesives from polyimide substrates

Country Status (9)

Country Link
US (1) US4639290A (xx)
EP (1) EP0248029B1 (xx)
JP (1) JPS63502468A (xx)
DE (1) DE3684144D1 (xx)
DK (1) DK377587A (xx)
ES (1) ES2003544A6 (xx)
IL (1) IL80226A (xx)
TR (1) TR23652A (xx)
WO (1) WO1987003773A1 (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2592542B1 (fr) * 1985-12-27 1994-03-25 Dreyfus Bertrand Appareil portatif de photocopie de fragments de documents.
JPS62216259A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 混成集積回路の製造方法および構造
US4758368A (en) * 1986-07-21 1988-07-19 Motorola Inc. Method for etching silicon wafers using a potassium hydroxide and water etching solution
DE3711323A1 (de) * 1986-10-22 1988-05-05 Moeller Hamburg Gmbh Co Kg Verfahren und anordnung zum pneumatischen foerdern von feinkoernigen feststoffen in den feuerraum eines kessels
US4889585A (en) * 1986-10-27 1989-12-26 Hughes Aircraft Company Method for selectively forming small diameter holes in polyimide/Kevlar substrates
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
GB2259812B (en) * 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
US6375859B1 (en) 1999-02-04 2002-04-23 International Business Machines Corporation Process for resist clean up of metal structures on polyimide
FR2834180B1 (fr) 2001-12-20 2004-03-12 Org Europeene De Rech Procede de fabrication d'un module multicouches a circuits imprimes a haute densite
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide
RU2447628C1 (ru) * 2010-12-15 2012-04-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Способ защиты полиимидных материалов при травлении

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1134632A (en) * 1965-02-13 1968-11-27 Elliott Brothers London Ltd Improvements in or relating to the production of printed circuits
US3868720A (en) * 1973-12-17 1975-02-25 Westinghouse Electric Corp High frequency bipolar transistor with integral thermally compensated degenerative feedback resistance
CA1053994A (en) * 1974-07-03 1979-05-08 Amp Incorporated Sensitization of polyimide polymer for electroless metal deposition
US4346125A (en) * 1980-12-08 1982-08-24 Bell Telephone Laboratories, Incorporated Removing hardened organic materials during fabrication of integrated circuits using anhydrous hydrazine solvent
JPS5846652A (ja) * 1981-09-14 1983-03-18 Fujitsu Ltd 多層配線形成方法
US4426253A (en) * 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film

Also Published As

Publication number Publication date
IL80226A0 (en) 1987-01-30
US4639290A (en) 1987-01-27
EP0248029B1 (en) 1992-03-04
DK377587D0 (da) 1987-07-20
TR23652A (tr) 1990-05-29
EP0248029A1 (en) 1987-12-09
DK377587A (da) 1987-07-20
ES2003544A6 (es) 1988-11-01
JPS63502468A (ja) 1988-09-14
WO1987003773A1 (en) 1987-06-18
DE3684144D1 (de) 1992-04-09

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