IL79429A0 - Apparatus and method for controlling plating induced stress in electroforming and electroplating processes - Google Patents

Apparatus and method for controlling plating induced stress in electroforming and electroplating processes

Info

Publication number
IL79429A0
IL79429A0 IL79429A IL7942986A IL79429A0 IL 79429 A0 IL79429 A0 IL 79429A0 IL 79429 A IL79429 A IL 79429A IL 7942986 A IL7942986 A IL 7942986A IL 79429 A0 IL79429 A0 IL 79429A0
Authority
IL
Israel
Prior art keywords
electroforming
induced stress
electroplating processes
controlling plating
plating induced
Prior art date
Application number
IL79429A
Other languages
English (en)
Original Assignee
Martin Marietta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Martin Marietta Corp filed Critical Martin Marietta Corp
Publication of IL79429A0 publication Critical patent/IL79429A0/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Molecular Biology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IL79429A 1985-07-18 1986-07-16 Apparatus and method for controlling plating induced stress in electroforming and electroplating processes IL79429A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/756,214 US4648944A (en) 1985-07-18 1985-07-18 Apparatus and method for controlling plating induced stress in electroforming and electroplating processes

Publications (1)

Publication Number Publication Date
IL79429A0 true IL79429A0 (en) 1986-10-31

Family

ID=25042504

Family Applications (1)

Application Number Title Priority Date Filing Date
IL79429A IL79429A0 (en) 1985-07-18 1986-07-16 Apparatus and method for controlling plating induced stress in electroforming and electroplating processes

Country Status (4)

Country Link
US (1) US4648944A (de)
EP (1) EP0210011A3 (de)
JP (1) JPS6270591A (de)
IL (1) IL79429A0 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786376A (en) * 1988-01-05 1988-11-22 The United States Of America As Represented By The Secretary Of The Air Force Electrodeposition without internal deposit stress
US4986130A (en) * 1989-10-19 1991-01-22 Engelhaupt Darell E Apparatus and method for monitoring stress as a coating is applied
GB9303202D0 (en) * 1993-02-17 1993-03-31 Pritchard Declan N Electrolysis module
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
JP2000002598A (ja) * 1998-06-15 2000-01-07 Yamamoto Mekki Shikenki:Kk 高速電気めっきの内部応力試験装置
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6406611B1 (en) 1999-12-08 2002-06-18 University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
TW527444B (en) * 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
CN1122552C (zh) 1999-05-21 2003-10-01 崔凤奎 玩具汽车
US6238539B1 (en) * 1999-06-25 2001-05-29 Hughes Electronics Corporation Method of in-situ displacement/stress control in electroplating
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US7347572B1 (en) * 2000-05-23 2008-03-25 Media Lario S.R.L. Telescope mirror for high bandwidth free space optical data transmission
AU2001259504A1 (en) * 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2001282879A1 (en) * 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
EP1481114A4 (de) 2001-08-31 2005-06-22 Semitool Inc Vorrichtung und verfahren zur elektrochemischen verarbeitung von mikroelektronischen werkstücken
US6630360B2 (en) 2002-01-10 2003-10-07 Advanced Micro Devices, Inc. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20030159921A1 (en) * 2002-02-22 2003-08-28 Randy Harris Apparatus with processing stations for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
JP4074592B2 (ja) * 2004-02-03 2008-04-09 株式会社山本鍍金試験器 電極カートリッジ及びめっき内部応力測定システム
JP2005281803A (ja) * 2004-03-30 2005-10-13 Yamamoto Mekki Shikenki:Kk めっき内部応力測定プログラムおよびめっき内部応力測定システム
WO2011123896A1 (en) * 2010-04-07 2011-10-13 Mipac Pty Ltd Monitoring device
US8425751B1 (en) * 2011-02-03 2013-04-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Systems and methods for the electrodeposition of a nickel-cobalt alloy
JP6177065B2 (ja) * 2013-09-11 2017-08-09 株式会社クラレ 金属レプリカ及びスタンパの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2568713A (en) * 1949-04-06 1951-09-25 Brenner Abner Instrument for use in determining the stress in an electrodeposit
US2829517A (en) * 1954-01-06 1958-04-08 Joseph B Kushner Measuring stress in an electrodeposit or other coating
US3215609A (en) * 1962-12-04 1965-11-02 Conversion Chem Corp Electroplating test cell and method
US3356597A (en) * 1965-02-18 1967-12-05 Gen Electric Method and apparatus for measuring electrofinishing stresses
US3437568A (en) * 1966-07-18 1969-04-08 Electro Optical Systems Inc Apparatus and method for determining and controlling stress in an electroformed part
US3356605A (en) * 1967-03-02 1967-12-05 Gen Electric Electrodeposition monitor
US3570449A (en) * 1969-03-13 1971-03-16 United Aircraft Corp Sensor system for a vacuum deposition apparatus
US4086153A (en) * 1975-10-09 1978-04-25 Toyo Kohan Co., Ltd. Method of producing a composite coated steel sheet
US4086154A (en) * 1976-07-26 1978-04-25 The Boeing Company Apparatus for determining stress in an electrodeposit
US4479980A (en) * 1983-12-16 1984-10-30 International Business Machines Corporation Plating rate monitor

Also Published As

Publication number Publication date
EP0210011A2 (de) 1987-01-28
EP0210011A3 (de) 1989-04-26
US4648944A (en) 1987-03-10
JPS6270591A (ja) 1987-04-01

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