IL73171A - Semiconductor package with internal heat exchanger - Google Patents

Semiconductor package with internal heat exchanger

Info

Publication number
IL73171A
IL73171A IL73171A IL7317184A IL73171A IL 73171 A IL73171 A IL 73171A IL 73171 A IL73171 A IL 73171A IL 7317184 A IL7317184 A IL 7317184A IL 73171 A IL73171 A IL 73171A
Authority
IL
Israel
Prior art keywords
heat exchanger
semiconductor package
internal heat
internal
package
Prior art date
Application number
IL73171A
Other languages
English (en)
Other versions
IL73171A0 (en
Original Assignee
Sundstrand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundstrand Corp filed Critical Sundstrand Corp
Publication of IL73171A0 publication Critical patent/IL73171A0/xx
Publication of IL73171A publication Critical patent/IL73171A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IL73171A 1983-11-04 1984-10-04 Semiconductor package with internal heat exchanger IL73171A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/549,208 US4559580A (en) 1983-11-04 1983-11-04 Semiconductor package with internal heat exchanger

Publications (2)

Publication Number Publication Date
IL73171A0 IL73171A0 (en) 1985-01-31
IL73171A true IL73171A (en) 1988-11-30

Family

ID=24192076

Family Applications (1)

Application Number Title Priority Date Filing Date
IL73171A IL73171A (en) 1983-11-04 1984-10-04 Semiconductor package with internal heat exchanger

Country Status (8)

Country Link
US (1) US4559580A (xx)
EP (1) EP0161282B1 (xx)
JP (1) JPS61500342A (xx)
CA (1) CA1221473A (xx)
DE (1) DE3481576D1 (xx)
IL (1) IL73171A (xx)
IT (1) IT1178189B (xx)
WO (1) WO1985002087A1 (xx)

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US4910642A (en) * 1988-12-05 1990-03-20 Sundstrand Corporation Coolant activated contact compact high intensity cooler
DE4101205A1 (de) * 1990-02-09 1991-08-14 Asea Brown Boveri Gekuehltes hochleistungshalbleiterbauelement
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US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5038857A (en) * 1990-06-19 1991-08-13 Sundstrand Corporation Method of diffusion bonding and laminated heat exchanger formed thereby
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US5749413A (en) * 1991-09-23 1998-05-12 Sundstrand Corporation Heat exchanger for high power electrical component and package incorporating same
US5159531A (en) * 1992-02-28 1992-10-27 International Business Machines Corporation Multiple radial finger contact cooling device
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FR2701554B1 (fr) * 1993-02-12 1995-05-12 Transcal Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
FR2732184B1 (fr) * 1995-03-21 1997-04-30 Asulab Sa Module electrique de puissance
WO1996041068A1 (en) * 1995-06-07 1996-12-19 National Research Council Of Canada Anti-fretting barrier
US5901783A (en) * 1995-10-12 1999-05-11 Croyogen, Inc. Cryogenic heat exchanger
US5768103A (en) * 1996-08-30 1998-06-16 Motorola, Inc. Circuit board apparatus and apparatus and method for spray-cooling an electronic component
JP3816194B2 (ja) * 1996-11-22 2006-08-30 ファナック株式会社 冷却装置、光源装置、面発光装置、およびその製造方法
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
DE19744281A1 (de) * 1997-10-07 1999-06-02 Fraunhofer Ges Forschung Vorrichtung zum Kühlen von Halbleiterbauelementen und ihre Verwendung
US6167952B1 (en) 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
FR2832944B1 (fr) * 2001-12-05 2004-01-16 Commissariat Energie Atomique Procede d'assemblage de deux pieces ayant des cotes precises et application au brasage d'un accelerateur linac rfq
US6980450B2 (en) * 2002-01-24 2005-12-27 Inverters Unlimited, Inc. High power density inverter and components thereof
US6840308B2 (en) * 2002-05-31 2005-01-11 General Electric Co. Heat sink assembly
DE102004059963A1 (de) * 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
JP2005217211A (ja) * 2004-01-30 2005-08-11 Tecnisco Ltd 半導体用冷却器及び半導体用冷却器積層体
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7492595B2 (en) * 2005-03-31 2009-02-17 Tecnisco Limited Semiconductor cooling device and stack of semiconductor cooling devices
JP4608641B2 (ja) * 2005-04-27 2011-01-12 株式会社豊田自動織機 パワーモジュール用ヒートシンク
WO2007036963A1 (en) * 2005-09-30 2007-04-05 Gianni Candio Method for manufacturing a plate heat exchanger having plates connected through melted contact points and heat exchanger obtained using said method
JP4694514B2 (ja) * 2007-02-08 2011-06-08 トヨタ自動車株式会社 半導体素子の冷却構造
JP5178274B2 (ja) * 2008-03-26 2013-04-10 日本モレックス株式会社 ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
TW200947188A (en) * 2008-05-01 2009-11-16 Acer Inc Liquid cooling heat dissipating device
US20090307646A1 (en) * 2008-06-06 2009-12-10 Winter Bradley J Systems, devices, and methods for semiconductor device temperature management
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US8931546B2 (en) * 2010-03-29 2015-01-13 Hamilton Sundstrand Space Sytems International, Inc. Compact two sided cold plate with threaded inserts
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
DE102017217537B4 (de) * 2017-10-02 2021-10-21 Danfoss Silicon Power Gmbh Leistungsmodul mit integrierter Kühleinrichtung

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Also Published As

Publication number Publication date
IL73171A0 (en) 1985-01-31
EP0161282A4 (en) 1987-01-20
CA1221473A (en) 1987-05-05
US4559580A (en) 1985-12-17
IT1178189B (it) 1987-09-09
EP0161282A1 (en) 1985-11-21
EP0161282B1 (en) 1990-03-07
IT8449106A1 (it) 1986-05-02
WO1985002087A1 (en) 1985-05-09
IT8449106A0 (it) 1984-11-02
DE3481576D1 (de) 1990-04-12
JPS61500342A (ja) 1986-02-27

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