IL45045A - Thin-film electrical circuit - Google Patents
Thin-film electrical circuitInfo
- Publication number
- IL45045A IL45045A IL45045A IL4504574A IL45045A IL 45045 A IL45045 A IL 45045A IL 45045 A IL45045 A IL 45045A IL 4504574 A IL4504574 A IL 4504574A IL 45045 A IL45045 A IL 45045A
- Authority
- IL
- Israel
- Prior art keywords
- tantalum
- layer
- aluminium
- thin
- content
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims description 20
- 239000010410 layer Substances 0.000 claims description 114
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 claims description 54
- 229910052715 tantalum Inorganic materials 0.000 claims description 39
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 39
- 239000003990 capacitor Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 22
- 229910000838 Al alloy Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 17
- VQLOCUKZAJRPAO-UHFFFAOYSA-N aluminum oxygen(2-) tantalum(5+) Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Ta+5] VQLOCUKZAJRPAO-UHFFFAOYSA-N 0.000 claims description 15
- 230000003647 oxidation Effects 0.000 claims description 15
- 238000007254 oxidation reaction Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 13
- PQLZZALLLYUAKL-UHFFFAOYSA-N [Au].[Cr].[Ni] Chemical compound [Au].[Cr].[Ni] PQLZZALLLYUAKL-UHFFFAOYSA-N 0.000 claims description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- 230000000873 masking effect Effects 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000011260 aqueous acid Substances 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims 1
- 229960004889 salicylic acid Drugs 0.000 claims 1
- 239000002966 varnish Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- UEJQQMLXZQUJHF-UHFFFAOYSA-L [K+].[I+].[I-].[I-] Chemical compound [K+].[I+].[I-].[I-] UEJQQMLXZQUJHF-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- OVBPIULPVIDEAO-LBPRGKRZSA-N folic acid Chemical compound C=1N=C2NC(N)=NC(=O)C2=NC=1CNC1=CC=C(C(=O)N[C@@H](CCC(O)=O)C(O)=O)C=C1 OVBPIULPVIDEAO-LBPRGKRZSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19732331586 DE2331586C3 (de) | 1973-06-20 | Aluminium-Tantal-Schichten für Dünnschichtschaltungen sowie diskrete Widerstände und Kondensatoren |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL45045A0 IL45045A0 (en) | 1974-09-10 |
| IL45045A true IL45045A (en) | 1977-04-29 |
Family
ID=5884643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL45045A IL45045A (en) | 1973-06-20 | 1974-06-17 | Thin-film electrical circuit |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US3949275A (it) |
| JP (1) | JPS5346266B2 (it) |
| AT (1) | AT342733B (it) |
| BE (1) | BE816632R (it) |
| CA (1) | CA1007382A (it) |
| CH (1) | CH574200A5 (it) |
| DK (1) | DK143084C (it) |
| FR (1) | FR2234638B2 (it) |
| GB (1) | GB1424980A (it) |
| IE (1) | IE39514B1 (it) |
| IL (1) | IL45045A (it) |
| IT (1) | IT1019657B (it) |
| LU (1) | LU70349A1 (it) |
| NL (1) | NL7408158A (it) |
| NO (1) | NO139021C (it) |
| SE (1) | SE405052B (it) |
| YU (2) | YU40428B (it) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51108469A (ja) * | 1975-03-19 | 1976-09-25 | Hitachi Metals Ltd | Gokanchoryukonbeya |
| US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
| DE2823881C3 (de) * | 1978-05-31 | 1982-03-18 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen |
| DE2906813C2 (de) * | 1979-02-22 | 1982-06-03 | Robert Bosch Gmbh, 7000 Stuttgart | Elektronische Dünnschichtschaltung |
| US4200502A (en) * | 1979-03-12 | 1980-04-29 | Siemens Aktiengesellschaft | Method for producing an electrical thin layer circuit |
| US4654680A (en) * | 1980-09-24 | 1987-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Sidewall gate IGFET |
| US4602192A (en) * | 1983-03-31 | 1986-07-22 | Matsushita Electric Industrial Co., Ltd. | Thin film integrated device |
| JPS6045008A (ja) * | 1983-08-22 | 1985-03-11 | 松下電器産業株式会社 | 薄膜コンデンサの製造方法 |
| JPS60147462U (ja) * | 1984-03-13 | 1985-09-30 | 長谷川化学工業株式会社 | 竹刀 |
| EP0428730B1 (en) * | 1989-02-28 | 1995-07-12 | Canon Kabushiki Kaisha | Ink jet head having heat-generating resistor constituted of non-monocrystalline substance containing iridium, tantalum and aluminum, and ink jet device equipped with said head |
| US5027253A (en) * | 1990-04-09 | 1991-06-25 | Ibm Corporation | Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
| US5419787A (en) * | 1994-06-24 | 1995-05-30 | The United States Of America As Represented By The Secretary Of The Air Force | Stress reduced insulator |
| CN1046817C (zh) * | 1994-08-26 | 1999-11-24 | 罗姆股份有限公司 | 片式厚膜无源组合元件 |
| US5598131A (en) * | 1995-11-16 | 1997-01-28 | Emc Technology, Inc. | AC coupled termination |
| US5977582A (en) * | 1997-05-23 | 1999-11-02 | Lucent Technologies Inc. | Capacitor comprising improved TaOx -based dielectric |
| KR100359860B1 (ko) * | 1998-12-31 | 2003-02-20 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 형성방법 |
| DE19902865A1 (de) * | 1999-01-25 | 2000-07-27 | Philips Corp Intellectual Pty | Zero-IF-Konverter mit RC-Filter |
| US6278356B1 (en) * | 2000-05-17 | 2001-08-21 | Compeq Manufacturing Company Limited | Flat, built-in resistors and capacitors for a printed circuit board |
| DE10039710B4 (de) * | 2000-08-14 | 2017-06-22 | United Monolithic Semiconductors Gmbh | Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2179960A (en) * | 1931-11-28 | 1939-11-14 | Schwarzkopf Paul | Agglomerated material in particular for electrical purposes and shaped bodies made therefrom |
| US3217209A (en) * | 1960-05-12 | 1965-11-09 | Xerox Corp | Printed circuits with resistive and capacitive elements |
| US3386011A (en) * | 1962-10-23 | 1968-05-28 | Philco Ford Corp | Thin-film rc circuits on single substrate |
| US3172196A (en) * | 1963-01-22 | 1965-03-09 | Brush Beryllium Co | Sintered intermetallic compoundcomposition bodies |
| US3198628A (en) * | 1963-06-13 | 1965-08-03 | Dow Chemical Co | Uranium-tantalum-aluminum alloy |
| US3406043A (en) * | 1964-11-09 | 1968-10-15 | Western Electric Co | Integrated circuit containing multilayer tantalum compounds |
| US3387952A (en) * | 1964-11-09 | 1968-06-11 | Western Electric Co | Multilayer thin-film coated substrate with metallic parting layer to permit selectiveequential etching |
| US3423821A (en) * | 1965-03-18 | 1969-01-28 | Hitachi Ltd | Method of producing thin film integrated circuits |
| FR1537897A (fr) * | 1967-07-19 | 1968-08-30 | Europ Composants Electron | Procédé de fabrication de circuits électriques en couches minces |
| US3616282A (en) * | 1968-11-14 | 1971-10-26 | Hewlett Packard Co | Method of producing thin-film circuit elements |
| US3607679A (en) * | 1969-05-05 | 1971-09-21 | Bell Telephone Labor Inc | Method for the fabrication of discrete rc structure |
| US3718565A (en) * | 1970-11-27 | 1973-02-27 | Bell Telephone Labor Inc | Technique for the fabrication of discrete rc structure |
| US3781610A (en) * | 1972-05-22 | 1973-12-25 | G Bodway | Thin film circuits and method for manufacture |
-
1974
- 1974-06-07 GB GB2540174A patent/GB1424980A/en not_active Expired
- 1974-06-10 NO NO742086A patent/NO139021C/no unknown
- 1974-06-10 AT AT476974A patent/AT342733B/de not_active IP Right Cessation
- 1974-06-17 IL IL45045A patent/IL45045A/en unknown
- 1974-06-17 CH CH823974A patent/CH574200A5/xx not_active IP Right Cessation
- 1974-06-17 SE SE7407961A patent/SE405052B/xx not_active IP Right Cessation
- 1974-06-18 LU LU70349A patent/LU70349A1/xx unknown
- 1974-06-18 FR FR7421128A patent/FR2234638B2/fr not_active Expired
- 1974-06-18 NL NL7408158A patent/NL7408158A/xx not_active Application Discontinuation
- 1974-06-18 DK DK325474A patent/DK143084C/da active
- 1974-06-18 CA CA202,758A patent/CA1007382A/en not_active Expired
- 1974-06-19 IE IE1283/74A patent/IE39514B1/xx unknown
- 1974-06-19 IT IT24145/74A patent/IT1019657B/it active
- 1974-06-19 US US05/480,826 patent/US3949275A/en not_active Expired - Lifetime
- 1974-06-20 YU YU1732/74A patent/YU40428B/xx unknown
- 1974-06-20 JP JP7073674A patent/JPS5346266B2/ja not_active Expired
- 1974-06-20 BE BE145686A patent/BE816632R/xx not_active IP Right Cessation
-
1980
- 1980-11-10 YU YU02869/80A patent/YU286980A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BE816632R (fr) | 1974-10-16 |
| GB1424980A (en) | 1976-02-11 |
| NO742086L (it) | 1975-01-13 |
| IE39514L (en) | 1974-12-20 |
| YU40428B (en) | 1986-02-28 |
| LU70349A1 (it) | 1974-10-17 |
| NO139021B (no) | 1978-09-11 |
| JPS5032474A (it) | 1975-03-29 |
| FR2234638A2 (it) | 1975-01-17 |
| DE2331586A1 (de) | 1975-01-09 |
| AT342733B (de) | 1978-04-25 |
| CH574200A5 (it) | 1976-03-31 |
| ATA476974A (de) | 1977-08-15 |
| SE405052B (sv) | 1978-11-13 |
| US3949275A (en) | 1976-04-06 |
| DK143084B (da) | 1981-03-23 |
| AU7019474A (en) | 1975-12-18 |
| YU173274A (en) | 1982-02-28 |
| IL45045A0 (en) | 1974-09-10 |
| IE39514B1 (en) | 1978-10-25 |
| JPS5346266B2 (it) | 1978-12-12 |
| SE7407961L (it) | 1974-12-23 |
| DE2331586B2 (de) | 1976-11-25 |
| DK143084C (da) | 1981-10-26 |
| CA1007382A (en) | 1977-03-22 |
| FR2234638B2 (it) | 1978-08-04 |
| DK325474A (it) | 1975-02-17 |
| YU286980A (en) | 1982-10-31 |
| NL7408158A (it) | 1974-12-24 |
| NO139021C (no) | 1978-12-20 |
| IT1019657B (it) | 1977-11-30 |
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