IL32803A0 - Method and apparatus for uniform multiple lead bonding - Google Patents

Method and apparatus for uniform multiple lead bonding

Info

Publication number
IL32803A0
IL32803A0 IL32803A IL3280369A IL32803A0 IL 32803 A0 IL32803 A0 IL 32803A0 IL 32803 A IL32803 A IL 32803A IL 3280369 A IL3280369 A IL 3280369A IL 32803 A0 IL32803 A0 IL 32803A0
Authority
IL
Israel
Prior art keywords
lead bonding
multiple lead
uniform multiple
uniform
bonding
Prior art date
Application number
IL32803A
Other languages
English (en)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IL32803A0 publication Critical patent/IL32803A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B23K20/025—Bonding tips therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75986—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/7925—Means for applying energy, e.g. heating means
    • H01L2224/793—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/79301—Pressing head
    • H01L2224/79314—Auxiliary members on the pressing surface
    • H01L2224/79318—Shape of the auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/7925—Means for applying energy, e.g. heating means
    • H01L2224/793—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/79301—Pressing head
    • H01L2224/79314—Auxiliary members on the pressing surface
    • H01L2224/7932—Material of the auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/79981—Apparatus chuck
    • H01L2224/79986—Auxiliary members on the pressing surface
    • H01L2224/79987—Shape of the auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/79981—Apparatus chuck
    • H01L2224/79986—Auxiliary members on the pressing surface
    • H01L2224/79988—Material of the auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Measuring Fluid Pressure (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
IL32803A 1968-08-16 1969-08-10 Method and apparatus for uniform multiple lead bonding IL32803A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75323068A 1968-08-16 1968-08-16

Publications (1)

Publication Number Publication Date
IL32803A0 true IL32803A0 (en) 1969-11-12

Family

ID=25029729

Family Applications (1)

Application Number Title Priority Date Filing Date
IL32803A IL32803A0 (en) 1968-08-16 1969-08-10 Method and apparatus for uniform multiple lead bonding

Country Status (8)

Country Link
US (1) US3608809A (xx)
BE (1) BE737486A (xx)
DE (1) DE1940917A1 (xx)
ES (1) ES371016A1 (xx)
FR (1) FR2015819A1 (xx)
GB (1) GB1272959A (xx)
IL (1) IL32803A0 (xx)
NL (1) NL6912455A (xx)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699640A (en) * 1970-12-01 1972-10-24 Western Electric Co Compliant bonding
US3729810A (en) * 1971-12-14 1973-05-01 Western Electric Co Compensating base for lead-frame bonding
USRE28509E (en) * 1971-12-14 1975-08-12 Compensating base for lead-frame bonding
US3804319A (en) * 1971-12-14 1974-04-16 Western Electric Co Compensator base for lead-frame bonding
BE795629A (fr) * 1972-02-18 1973-06-18 Lacrex Brevetti Sa Outil
US3905537A (en) * 1974-07-08 1975-09-16 Western Electric Co Method and apparatus for compensating for substance variations during lead frame bonding
US3896541A (en) * 1974-09-16 1975-07-29 Western Electric Co Method and apparatus for supporting substrates during bonding
DE2542969C2 (de) * 1975-09-26 1984-07-12 Elbatainer Kunststoff- Und Verpackungsgesellschaft Mbh, 7505 Ettlingen Vorrichtung zum flüssigkeitsdichten Einschweißen eines verschließbaren Gießstutzens mittels Ultraschall
FR2416078A2 (fr) * 1976-10-05 1979-08-31 Tocco Stel Presse a braser par induction des pieces metalliques comportant des portions peripheriques incurvees ou relevees
US4438698A (en) * 1982-09-10 1984-03-27 Burroughs Corporation Endorsing apparatus utilizing holding force pressure
US4508326A (en) * 1983-01-11 1985-04-02 Andre Eugene R Pressure chuck for irregular articles
US4534811A (en) * 1983-12-30 1985-08-13 International Business Machines Corporation Apparatus for thermo bonding surfaces
CH666433A5 (de) * 1984-01-28 1988-07-29 Festo Maschf Stoll G Kurzhub-spannelement.
US4687189A (en) * 1985-01-26 1987-08-18 Kurt Stoll Short stroke actuator
US4638937A (en) * 1985-04-22 1987-01-27 Gte Communication Systems Corporation Beam lead bonding apparatus
US4871899A (en) * 1986-02-24 1989-10-03 Unitek Corporation Titiable electric thermode for multiple connection reflow soldering
JPS62256441A (ja) * 1986-04-30 1987-11-09 Hitachi Ltd ダイボンデイング装置
DE3635359C2 (de) * 1986-10-17 1995-05-18 Festo Kg Spannelement
US4875614A (en) * 1988-10-31 1989-10-24 International Business Machines Corporation Alignment device
EP0460286A3 (en) * 1990-06-06 1992-02-26 Siemens Aktiengesellschaft Method and arrangement for bonding a semiconductor component to a substrate or for finishing a semiconductor/substrate connection by contactless pressing
US5068508A (en) * 1990-10-01 1991-11-26 Raytheon Company Complaint hot bar apparatus
US5092510A (en) * 1990-11-20 1992-03-03 International Business Machines Corporation Method and apparatus for circuit board support during component mounting
JP2839215B2 (ja) * 1991-09-04 1998-12-16 株式会社カイジョー ボンディング装置
US5246216A (en) * 1992-10-30 1993-09-21 Oberst E Ernest Vise jaw attachment for irregular shaped workpieces
JPH06342976A (ja) * 1993-06-01 1994-12-13 Nippondenso Co Ltd 基板の接続方法
US5819394A (en) * 1995-02-22 1998-10-13 Transition Automation, Inc. Method of making board matched nested support fixture
US5820117A (en) * 1995-06-28 1998-10-13 Micron Electronics, Inc. Air bladder fixture tooling for supporting circuit board assembly processing
DE19816014B4 (de) * 1998-04-09 2007-10-31 Volkswagen Ag Spannvorrichtung für die Halterung von Karosseriebauteilen
JP2001014625A (ja) * 1999-06-28 2001-01-19 Internatl Business Mach Corp <Ibm> スライダとリード線の超音波接合方法、及び接合検査方法
EP1280196A1 (de) * 2001-07-18 2003-01-29 Abb Research Ltd. Verfahren zum Befestigen von elektronischen Bauelementen auf Substraten
JP4485361B2 (ja) * 2002-08-07 2010-06-23 ザ ペン ステイト リサーチ ファンデーション ワークピースを製造用固定具に対して結合及び分離させる装置及び方法
US20060003548A1 (en) * 2004-06-30 2006-01-05 Kobrinsky Mauro J Highly compliant plate for wafer bonding
US7524390B2 (en) * 2006-03-27 2009-04-28 The Penn State Research Foundation Fixture and method of holding and debonding a workpiece with the fixture
US7525187B2 (en) * 2006-10-13 2009-04-28 Infineon Technologies Ag Apparatus and method for connecting components
US8720767B2 (en) * 2008-11-13 2014-05-13 Orthodyne Electronics Corporation Semiconductor device support for bonding
JP2011009357A (ja) * 2009-06-24 2011-01-13 Fujitsu Ltd 実装装置
GB2474256B (en) * 2009-10-08 2011-09-14 Rolls Royce Plc Fixture for supporting a workpiece
US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
JP6172654B2 (ja) * 2013-03-14 2017-08-02 アルファーデザイン株式会社 部品加圧装置及び部品加圧装置を用いた加熱システム
EP3110611B1 (de) * 2014-02-28 2019-10-16 Herrmann Ultraschalltechnik GmbH & Co. KG Ultraschallbearbeitungsvorrichtung mit kraftsensor
DE102014111634A1 (de) * 2014-08-14 2016-02-18 Atv Technologie Gmbh Vorrichtung zum insbesondere thermischen Verbinden mikro-elektromechanischer Bauteile

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US1453176A (en) * 1921-03-18 1923-04-24 Perrine Lester Compensating jaw for chucks and the like
US1872692A (en) * 1928-06-08 1932-08-23 Libbey Owens Ford Glass Co Apparatus for making laminated glass
GB388891A (en) * 1931-02-11 1933-03-09 Bleriot Aeronautique Improvements in means for holding objects of relatively slight thickness
US2040466A (en) * 1933-09-29 1936-05-12 Wingfoot Corp Universal clamp
US2960147A (en) * 1958-04-15 1960-11-15 Us Rubber Co Heat sealing device
US3440117A (en) * 1965-07-02 1969-04-22 Branson Instr Method of simultaneously securing a plurality of elements to a thermoplastic member using sonic energy
US3483611A (en) * 1966-08-12 1969-12-16 Cavitron Corp Methods and apparatus for assembling parts together by ultrasonic energy
US3433413A (en) * 1967-04-05 1969-03-18 Robertshaw Controls Co Small pneumatic thermostat
US3547599A (en) * 1967-04-27 1970-12-15 North American Rockwell Solid state joining method
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads

Also Published As

Publication number Publication date
NL6912455A (xx) 1970-02-18
FR2015819A1 (xx) 1970-04-30
BE737486A (xx) 1970-01-16
ES371016A1 (es) 1971-08-01
US3608809A (en) 1971-09-28
GB1272959A (en) 1972-05-03
DE1940917A1 (de) 1970-02-26

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