IL299770A - High density capacitor for focal plane arrays - Google Patents

High density capacitor for focal plane arrays

Info

Publication number
IL299770A
IL299770A IL299770A IL29977023A IL299770A IL 299770 A IL299770 A IL 299770A IL 299770 A IL299770 A IL 299770A IL 29977023 A IL29977023 A IL 29977023A IL 299770 A IL299770 A IL 299770A
Authority
IL
Israel
Prior art keywords
focal plane
plane arrays
density capacitor
capacitor
density
Prior art date
Application number
IL299770A
Other languages
English (en)
Hebrew (he)
Original Assignee
Drs Network & Imaging Systems Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Drs Network & Imaging Systems Llc filed Critical Drs Network & Imaging Systems Llc
Publication of IL299770A publication Critical patent/IL299770A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/01Manufacture or treatment
    • H10D1/041Manufacture or treatment of capacitors having no potential barriers
    • H10D1/042Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/191Photoconductor image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
IL299770A 2020-07-13 2021-04-30 High density capacitor for focal plane arrays IL299770A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063051028P 2020-07-13 2020-07-13
US17/244,679 US12094891B2 (en) 2020-07-13 2021-04-29 High-density capacitor for focal plane arrays
PCT/US2021/030143 WO2022015393A1 (en) 2020-07-13 2021-04-30 High-density capacitor for focal plane arrays

Publications (1)

Publication Number Publication Date
IL299770A true IL299770A (en) 2023-03-01

Family

ID=79173073

Family Applications (1)

Application Number Title Priority Date Filing Date
IL299770A IL299770A (en) 2020-07-13 2021-04-30 High density capacitor for focal plane arrays

Country Status (6)

Country Link
US (2) US12094891B2 (https=)
EP (2) EP4676191A2 (https=)
JP (2) JP7767381B2 (https=)
CN (1) CN116195064A (https=)
IL (1) IL299770A (https=)
WO (1) WO2022015393A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102866827B1 (ko) 2020-09-09 2025-09-30 삼성전자주식회사 이미지 센서
US11851785B2 (en) * 2021-05-21 2023-12-26 Raytheon Company Aluminum nitride passivation layer for mercury cadmium telluride in an electrical device
US20230290720A1 (en) * 2022-03-10 2023-09-14 Micron Technology, Inc. Apparatuses including metal-insulator-metal capacitor and methods for forming same
JP2023172505A (ja) * 2022-05-24 2023-12-06 キヤノン株式会社 光電変換装置
US12500186B2 (en) * 2022-07-14 2025-12-16 Micron Technology, Inc. Capacitor having electrodes formed within a substrate
US20250359092A1 (en) * 2024-05-16 2025-11-20 Globalfoundries Singapore Pte. Ltd. Capacitor structures and methods of forming thereof
CN121240471A (zh) * 2025-12-02 2025-12-30 合肥晶合集成电路股份有限公司 电容器结构以及电容器结构的制造方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128534A (en) 1990-07-17 1992-07-07 Hughes Aircraft Company High charge capacity focal plane array readout cell
US5414588A (en) 1993-09-20 1995-05-09 The Regents Of The University Of California High performance capacitors using nano-structure multilayer materials fabrication
WO1996034416A1 (en) 1995-04-28 1996-10-31 Sunnybrook Hospital Active matrix x-ray imaging array
US6531700B1 (en) 1998-09-08 2003-03-11 Lockheed Martin Corporation Integral charge well for QWIP FPA'S
US6710370B2 (en) 2002-01-07 2004-03-23 Xerox Corporation Image sensor with performance enhancing structures
US7786543B2 (en) 2002-08-27 2010-08-31 E-Phocus CDS capable sensor with photon sensing layer on active pixel circuit
US6960796B2 (en) 2002-11-26 2005-11-01 Micron Technology, Inc. CMOS imager pixel designs with storage capacitor
US7453129B2 (en) 2002-12-18 2008-11-18 Noble Peak Vision Corp. Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
KR100548553B1 (ko) * 2002-12-26 2006-02-02 주식회사 하이닉스반도체 캐패시터 형성 방법
KR100957585B1 (ko) 2003-10-15 2010-05-13 삼성전자주식회사 광 감지부를 갖는 전자 디스플레이 장치
US7551059B2 (en) 2005-01-06 2009-06-23 Goodrich Corporation Hybrid infrared detector array and CMOS readout integrated circuit with improved dynamic range
US7473999B2 (en) * 2005-09-23 2009-01-06 Megica Corporation Semiconductor chip and process for forming the same
KR100775058B1 (ko) 2005-09-29 2007-11-08 삼성전자주식회사 픽셀 및 이를 이용한 이미지 센서, 그리고 상기 이미지센서를 포함하는 이미지 처리 시스템
US8279312B2 (en) 2005-11-24 2012-10-02 Stmicroelectronics S.A. Image sensor element with multiple outputs
US7259377B2 (en) 2005-12-15 2007-08-21 General Electric Company Diode design to reduce the effects of radiation damage
US7459686B2 (en) 2006-01-26 2008-12-02 L-3 Communications Corporation Systems and methods for integrating focal plane arrays
US8283632B2 (en) 2006-09-29 2012-10-09 Teledyne Scientific & Imaging, Llc Multi-color read-out integrated circuit
US20090014856A1 (en) 2007-07-10 2009-01-15 International Business Machine Corporation Microbump seal
JP5334199B2 (ja) 2008-01-22 2013-11-06 ルネサスエレクトロニクス株式会社 容量素子を有する半導体装置
US20100044552A1 (en) 2008-08-19 2010-02-25 Lockheed Martin Corporation Automatic simultaneous dual gain readout integrated circuit using threshold voltage shifts of mosfet bulk to source potential
KR20100041179A (ko) 2008-10-13 2010-04-22 매그나칩 반도체 유한회사 유전체, 이를 구비한 캐패시터 및 그 제조방법, 반도체 소자 제조방법
US7795650B2 (en) 2008-12-09 2010-09-14 Teledyne Scientific & Imaging Llc Method and apparatus for backside illuminated image sensors using capacitively coupled readout integrated circuits
WO2013155145A1 (en) 2012-04-10 2013-10-17 Drs Rsta, Inc. High density capacitor integrated into focal plane array processing flow
US9024406B2 (en) * 2012-09-25 2015-05-05 Semiconductor Components Industries, Llc Imaging systems with circuit element in carrier wafer
US9269663B2 (en) * 2012-12-06 2016-02-23 Texas Instruments Incorporated Single pattern high precision capacitor
US10090239B2 (en) * 2013-06-26 2018-10-02 Intel Corporation Metal-insulator-metal on-die capacitor with partial vias
TW201546804A (zh) * 2014-02-05 2015-12-16 Conversant Intellectual Property Man Inc 有可製造的電容的動態隨機存取記憶體裝置
US9398237B2 (en) * 2014-04-30 2016-07-19 Sony Corporation Image sensor with floating diffusion interconnect capacitor
CN111968998B (zh) * 2014-12-26 2024-12-13 松下知识产权经营株式会社 摄像装置
EP3297024A1 (en) * 2016-09-20 2018-03-21 Ipdia 3d-capacitor structure
EP3410485B1 (en) * 2017-05-30 2022-08-03 ams AG Backside illuminated image sensor
CN109920808B (zh) * 2017-12-13 2024-05-14 松下知识产权经营株式会社 摄像装置
CN110164850B (zh) * 2018-02-15 2024-10-11 松下知识产权经营株式会社 电容元件和电容元件的制造方法
CN111656511B (zh) * 2018-04-04 2024-08-27 松下知识产权经营株式会社 电子设备
KR102624610B1 (ko) * 2018-10-04 2024-01-15 삼성전자주식회사 이미지 센서
US11018169B2 (en) * 2019-08-19 2021-05-25 Taiwan Semiconductor Manufacturing Co., Ltd. Metal-insulator-metal capacitor structure to increase capacitance density
JP7627855B2 (ja) * 2019-09-04 2025-02-07 パナソニックIpマネジメント株式会社 撮像装置
KR102795755B1 (ko) * 2019-10-16 2025-04-15 삼성전자주식회사 개별 부품용 디커플링 커패시터 및 이를 포함하는 집적회로 칩 패키지

Also Published As

Publication number Publication date
JP2023534228A (ja) 2023-08-08
US12094891B2 (en) 2024-09-17
US20240405032A1 (en) 2024-12-05
EP4179572A1 (en) 2023-05-17
WO2022015393A1 (en) 2022-01-20
JP2026027310A (ja) 2026-02-18
EP4179572A4 (en) 2024-06-26
JP7767381B2 (ja) 2025-11-11
US20220013555A1 (en) 2022-01-13
CN116195064A (zh) 2023-05-30
EP4676191A2 (en) 2026-01-07

Similar Documents

Publication Publication Date Title
IL299770A (en) High density capacitor for focal plane arrays
EP3888127A4 (en) MEMORY MATRICES
HUE069370T2 (hu) Energiatároló modul
EP3900044A4 (en) THREE-DIMENSIONAL STORAGE ARRAY
HUE072499T2 (hu) Energiatároló modul
CA197007S (en) Beam
HUE072646T2 (hu) Energiatároló modul
HUE069640T2 (hu) Energiatároló modul
PL3849848T3 (pl) Belka zderzaka z wkładką
EP4081889A4 (en) HOST TECHNIQUES FOR STACKED STORAGE SYSTEMS
EP3895165A4 (en) LEAKAGE COMPENSATION FOR MEMORY NETWORKS
EP3857592B8 (en) Multiple module chip manufacturing arrangement
CA228778S (en) Tracking device
CA230000S (en) Bumper
IL280042B (en) Focal plane array having ratioed capacitors
CA227960S (en) Bumper component
PL3804004T3 (pl) Układ montażowy dla modułu magazynowania energii
GB2611954B (en) Solder column grid array capacitors
GB202101187D0 (en) An immunogen
GB2606907B (en) Capacitorless dram cell
PL4047759T3 (pl) Moduł łączący lasera
EP3797443C0 (en) ENERGY STORAGE MODULE
GB2623361B (en) Inductive coil array
PT4419395T (pt) Viga de para-choques
GB202015925D0 (en) Fully reticulated detectors for curved focal plane arrays