IL299770A - High density capacitor for focal plane arrays - Google Patents
High density capacitor for focal plane arraysInfo
- Publication number
- IL299770A IL299770A IL299770A IL29977023A IL299770A IL 299770 A IL299770 A IL 299770A IL 299770 A IL299770 A IL 299770A IL 29977023 A IL29977023 A IL 29977023A IL 299770 A IL299770 A IL 299770A
- Authority
- IL
- Israel
- Prior art keywords
- focal plane
- plane arrays
- density capacitor
- capacitor
- density
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/041—Manufacture or treatment of capacitors having no potential barriers
- H10D1/042—Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/716—Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063051028P | 2020-07-13 | 2020-07-13 | |
| US17/244,679 US12094891B2 (en) | 2020-07-13 | 2021-04-29 | High-density capacitor for focal plane arrays |
| PCT/US2021/030143 WO2022015393A1 (en) | 2020-07-13 | 2021-04-30 | High-density capacitor for focal plane arrays |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL299770A true IL299770A (en) | 2023-03-01 |
Family
ID=79173073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL299770A IL299770A (en) | 2020-07-13 | 2021-04-30 | High density capacitor for focal plane arrays |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12094891B2 (https=) |
| EP (2) | EP4676191A2 (https=) |
| JP (2) | JP7767381B2 (https=) |
| CN (1) | CN116195064A (https=) |
| IL (1) | IL299770A (https=) |
| WO (1) | WO2022015393A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102866827B1 (ko) | 2020-09-09 | 2025-09-30 | 삼성전자주식회사 | 이미지 센서 |
| US11851785B2 (en) * | 2021-05-21 | 2023-12-26 | Raytheon Company | Aluminum nitride passivation layer for mercury cadmium telluride in an electrical device |
| US20230290720A1 (en) * | 2022-03-10 | 2023-09-14 | Micron Technology, Inc. | Apparatuses including metal-insulator-metal capacitor and methods for forming same |
| JP2023172505A (ja) * | 2022-05-24 | 2023-12-06 | キヤノン株式会社 | 光電変換装置 |
| US12500186B2 (en) * | 2022-07-14 | 2025-12-16 | Micron Technology, Inc. | Capacitor having electrodes formed within a substrate |
| US20250359092A1 (en) * | 2024-05-16 | 2025-11-20 | Globalfoundries Singapore Pte. Ltd. | Capacitor structures and methods of forming thereof |
| CN121240471A (zh) * | 2025-12-02 | 2025-12-30 | 合肥晶合集成电路股份有限公司 | 电容器结构以及电容器结构的制造方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5128534A (en) | 1990-07-17 | 1992-07-07 | Hughes Aircraft Company | High charge capacity focal plane array readout cell |
| US5414588A (en) | 1993-09-20 | 1995-05-09 | The Regents Of The University Of California | High performance capacitors using nano-structure multilayer materials fabrication |
| WO1996034416A1 (en) | 1995-04-28 | 1996-10-31 | Sunnybrook Hospital | Active matrix x-ray imaging array |
| US6531700B1 (en) | 1998-09-08 | 2003-03-11 | Lockheed Martin Corporation | Integral charge well for QWIP FPA'S |
| US6710370B2 (en) | 2002-01-07 | 2004-03-23 | Xerox Corporation | Image sensor with performance enhancing structures |
| US7786543B2 (en) | 2002-08-27 | 2010-08-31 | E-Phocus | CDS capable sensor with photon sensing layer on active pixel circuit |
| US6960796B2 (en) | 2002-11-26 | 2005-11-01 | Micron Technology, Inc. | CMOS imager pixel designs with storage capacitor |
| US7453129B2 (en) | 2002-12-18 | 2008-11-18 | Noble Peak Vision Corp. | Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry |
| KR100548553B1 (ko) * | 2002-12-26 | 2006-02-02 | 주식회사 하이닉스반도체 | 캐패시터 형성 방법 |
| KR100957585B1 (ko) | 2003-10-15 | 2010-05-13 | 삼성전자주식회사 | 광 감지부를 갖는 전자 디스플레이 장치 |
| US7551059B2 (en) | 2005-01-06 | 2009-06-23 | Goodrich Corporation | Hybrid infrared detector array and CMOS readout integrated circuit with improved dynamic range |
| US7473999B2 (en) * | 2005-09-23 | 2009-01-06 | Megica Corporation | Semiconductor chip and process for forming the same |
| KR100775058B1 (ko) | 2005-09-29 | 2007-11-08 | 삼성전자주식회사 | 픽셀 및 이를 이용한 이미지 센서, 그리고 상기 이미지센서를 포함하는 이미지 처리 시스템 |
| US8279312B2 (en) | 2005-11-24 | 2012-10-02 | Stmicroelectronics S.A. | Image sensor element with multiple outputs |
| US7259377B2 (en) | 2005-12-15 | 2007-08-21 | General Electric Company | Diode design to reduce the effects of radiation damage |
| US7459686B2 (en) | 2006-01-26 | 2008-12-02 | L-3 Communications Corporation | Systems and methods for integrating focal plane arrays |
| US8283632B2 (en) | 2006-09-29 | 2012-10-09 | Teledyne Scientific & Imaging, Llc | Multi-color read-out integrated circuit |
| US20090014856A1 (en) | 2007-07-10 | 2009-01-15 | International Business Machine Corporation | Microbump seal |
| JP5334199B2 (ja) | 2008-01-22 | 2013-11-06 | ルネサスエレクトロニクス株式会社 | 容量素子を有する半導体装置 |
| US20100044552A1 (en) | 2008-08-19 | 2010-02-25 | Lockheed Martin Corporation | Automatic simultaneous dual gain readout integrated circuit using threshold voltage shifts of mosfet bulk to source potential |
| KR20100041179A (ko) | 2008-10-13 | 2010-04-22 | 매그나칩 반도체 유한회사 | 유전체, 이를 구비한 캐패시터 및 그 제조방법, 반도체 소자 제조방법 |
| US7795650B2 (en) | 2008-12-09 | 2010-09-14 | Teledyne Scientific & Imaging Llc | Method and apparatus for backside illuminated image sensors using capacitively coupled readout integrated circuits |
| WO2013155145A1 (en) | 2012-04-10 | 2013-10-17 | Drs Rsta, Inc. | High density capacitor integrated into focal plane array processing flow |
| US9024406B2 (en) * | 2012-09-25 | 2015-05-05 | Semiconductor Components Industries, Llc | Imaging systems with circuit element in carrier wafer |
| US9269663B2 (en) * | 2012-12-06 | 2016-02-23 | Texas Instruments Incorporated | Single pattern high precision capacitor |
| US10090239B2 (en) * | 2013-06-26 | 2018-10-02 | Intel Corporation | Metal-insulator-metal on-die capacitor with partial vias |
| TW201546804A (zh) * | 2014-02-05 | 2015-12-16 | Conversant Intellectual Property Man Inc | 有可製造的電容的動態隨機存取記憶體裝置 |
| US9398237B2 (en) * | 2014-04-30 | 2016-07-19 | Sony Corporation | Image sensor with floating diffusion interconnect capacitor |
| CN111968998B (zh) * | 2014-12-26 | 2024-12-13 | 松下知识产权经营株式会社 | 摄像装置 |
| EP3297024A1 (en) * | 2016-09-20 | 2018-03-21 | Ipdia | 3d-capacitor structure |
| EP3410485B1 (en) * | 2017-05-30 | 2022-08-03 | ams AG | Backside illuminated image sensor |
| CN109920808B (zh) * | 2017-12-13 | 2024-05-14 | 松下知识产权经营株式会社 | 摄像装置 |
| CN110164850B (zh) * | 2018-02-15 | 2024-10-11 | 松下知识产权经营株式会社 | 电容元件和电容元件的制造方法 |
| CN111656511B (zh) * | 2018-04-04 | 2024-08-27 | 松下知识产权经营株式会社 | 电子设备 |
| KR102624610B1 (ko) * | 2018-10-04 | 2024-01-15 | 삼성전자주식회사 | 이미지 센서 |
| US11018169B2 (en) * | 2019-08-19 | 2021-05-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-insulator-metal capacitor structure to increase capacitance density |
| JP7627855B2 (ja) * | 2019-09-04 | 2025-02-07 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| KR102795755B1 (ko) * | 2019-10-16 | 2025-04-15 | 삼성전자주식회사 | 개별 부품용 디커플링 커패시터 및 이를 포함하는 집적회로 칩 패키지 |
-
2021
- 2021-04-29 US US17/244,679 patent/US12094891B2/en active Active
- 2021-04-30 EP EP25215912.4A patent/EP4676191A2/en active Pending
- 2021-04-30 EP EP21843390.2A patent/EP4179572A4/en active Pending
- 2021-04-30 JP JP2023501760A patent/JP7767381B2/ja active Active
- 2021-04-30 CN CN202180047890.XA patent/CN116195064A/zh active Pending
- 2021-04-30 WO PCT/US2021/030143 patent/WO2022015393A1/en not_active Ceased
- 2021-04-30 IL IL299770A patent/IL299770A/en unknown
-
2024
- 2024-08-13 US US18/802,277 patent/US20240405032A1/en active Pending
-
2025
- 2025-10-29 JP JP2025182710A patent/JP2026027310A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023534228A (ja) | 2023-08-08 |
| US12094891B2 (en) | 2024-09-17 |
| US20240405032A1 (en) | 2024-12-05 |
| EP4179572A1 (en) | 2023-05-17 |
| WO2022015393A1 (en) | 2022-01-20 |
| JP2026027310A (ja) | 2026-02-18 |
| EP4179572A4 (en) | 2024-06-26 |
| JP7767381B2 (ja) | 2025-11-11 |
| US20220013555A1 (en) | 2022-01-13 |
| CN116195064A (zh) | 2023-05-30 |
| EP4676191A2 (en) | 2026-01-07 |
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