IL291350B2 - בדיקת מסכה לייצור דגימות מוליכים למחצה - Google Patents

בדיקת מסכה לייצור דגימות מוליכים למחצה

Info

Publication number
IL291350B2
IL291350B2 IL291350A IL29135022A IL291350B2 IL 291350 B2 IL291350 B2 IL 291350B2 IL 291350 A IL291350 A IL 291350A IL 29135022 A IL29135022 A IL 29135022A IL 291350 B2 IL291350 B2 IL 291350B2
Authority
IL
Israel
Prior art keywords
defect
images
focus
image
bank
Prior art date
Application number
IL291350A
Other languages
English (en)
Other versions
IL291350B1 (he
IL291350A (he
Original Assignee
Applied Materials Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Israel Ltd filed Critical Applied Materials Israel Ltd
Priority to IL291350A priority Critical patent/IL291350B2/he
Publication of IL291350A publication Critical patent/IL291350A/en
Publication of IL291350B1 publication Critical patent/IL291350B1/en
Priority to TW112103644A priority patent/TW202407638A/zh
Priority to KR1020230031114A priority patent/KR20230134442A/ko
Priority to CN202310257817.6A priority patent/CN116754580B/zh
Publication of IL291350B2 publication Critical patent/IL291350B2/he

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
IL291350A 2022-03-14 2022-03-14 בדיקת מסכה לייצור דגימות מוליכים למחצה IL291350B2 (he)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IL291350A IL291350B2 (he) 2022-03-14 2022-03-14 בדיקת מסכה לייצור דגימות מוליכים למחצה
TW112103644A TW202407638A (zh) 2022-03-14 2023-02-02 半導體樣品製造的遮罩檢查
KR1020230031114A KR20230134442A (ko) 2022-03-14 2023-03-09 반도체 시편 제조를 위한 마스크 검사
CN202310257817.6A CN116754580B (zh) 2022-03-14 2023-03-10 半导体样品制造的掩模检查

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL291350A IL291350B2 (he) 2022-03-14 2022-03-14 בדיקת מסכה לייצור דגימות מוליכים למחצה

Publications (3)

Publication Number Publication Date
IL291350A IL291350A (he) 2022-04-01
IL291350B1 IL291350B1 (he) 2023-02-01
IL291350B2 true IL291350B2 (he) 2023-06-01

Family

ID=87202470

Family Applications (1)

Application Number Title Priority Date Filing Date
IL291350A IL291350B2 (he) 2022-03-14 2022-03-14 בדיקת מסכה לייצור דגימות מוליכים למחצה

Country Status (4)

Country Link
KR (1) KR20230134442A (he)
CN (1) CN116754580B (he)
IL (1) IL291350B2 (he)
TW (1) TW202407638A (he)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119322426A (zh) * 2024-11-01 2025-01-17 深圳晶源信息技术有限公司 掩膜图形修正方法、装置、设备、介质及产品

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110194752A1 (en) * 2010-02-05 2011-08-11 Linyong Pang Extending the Field of View of a Mask-Inspection Image
US20140086475A1 (en) * 2012-09-24 2014-03-27 Kla-Tencor Corporation Model-Based Registration and Critical Dimension Metrology
US20170018064A1 (en) * 2015-07-13 2017-01-19 Carl Zeiss Smt Gmbh Method and apparatus for determining the position of structure elements of a photolithographic mask
US20180293720A1 (en) * 2017-04-07 2018-10-11 Nuflare Technology, Inc. Pattern inspection apparatus, pattern position measurement apparatus, aerial image measurement system, method for measuring aerial image,pattern position repairing apparatus, method for repairing pattern position, aerial image data processing apparatus, method for processing aerial image data, pattern exposure apparatus, method for exposing pattern, method for manufacturing mask, and mask manufacturing system
US20180342051A1 (en) * 2017-05-23 2018-11-29 Kla-Tencor Corporation Wafer inspection using difference images
US20190130552A1 (en) * 2017-10-30 2019-05-02 Samsung Electronics Co., Ltd. Methods of inspecting defect and methods of fabricating a semiconductor device using the same
US20210073963A1 (en) * 2019-09-11 2021-03-11 Applied Materials Israel Ltd. Mask inspection of a semiconductor specimen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017025373A1 (en) * 2015-08-12 2017-02-16 Asml Netherlands B.V. Inspection apparatus, inspection method and manufacturing method
DE102017203879B4 (de) * 2017-03-09 2023-06-07 Carl Zeiss Smt Gmbh Verfahren zum Analysieren einer defekten Stelle einer photolithographischen Maske
TWI755453B (zh) * 2017-05-18 2022-02-21 美商克萊譚克公司 鑑定一光微影光罩合格性之方法及系統
US10460434B2 (en) * 2017-08-22 2019-10-29 Applied Materials Israel Ltd. Method of defect detection and system thereof
KR102427648B1 (ko) * 2017-11-03 2022-08-01 삼성전자주식회사 결함 검사 방법 및 결함 검사 장치
US11049745B2 (en) * 2018-10-19 2021-06-29 Kla Corporation Defect-location determination using correction loop for pixel alignment
US10853932B2 (en) * 2019-01-16 2020-12-01 Applied Material Israel, Ltd. Method of defect detection on a specimen and system thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110194752A1 (en) * 2010-02-05 2011-08-11 Linyong Pang Extending the Field of View of a Mask-Inspection Image
US20140086475A1 (en) * 2012-09-24 2014-03-27 Kla-Tencor Corporation Model-Based Registration and Critical Dimension Metrology
US20170018064A1 (en) * 2015-07-13 2017-01-19 Carl Zeiss Smt Gmbh Method and apparatus for determining the position of structure elements of a photolithographic mask
US20180293720A1 (en) * 2017-04-07 2018-10-11 Nuflare Technology, Inc. Pattern inspection apparatus, pattern position measurement apparatus, aerial image measurement system, method for measuring aerial image,pattern position repairing apparatus, method for repairing pattern position, aerial image data processing apparatus, method for processing aerial image data, pattern exposure apparatus, method for exposing pattern, method for manufacturing mask, and mask manufacturing system
US20180342051A1 (en) * 2017-05-23 2018-11-29 Kla-Tencor Corporation Wafer inspection using difference images
US20190130552A1 (en) * 2017-10-30 2019-05-02 Samsung Electronics Co., Ltd. Methods of inspecting defect and methods of fabricating a semiconductor device using the same
US20210073963A1 (en) * 2019-09-11 2021-03-11 Applied Materials Israel Ltd. Mask inspection of a semiconductor specimen

Also Published As

Publication number Publication date
CN116754580B (zh) 2025-12-05
TW202407638A (zh) 2024-02-16
IL291350B1 (he) 2023-02-01
IL291350A (he) 2022-04-01
KR20230134442A (ko) 2023-09-21
CN116754580A (zh) 2023-09-15

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