IL247946A0 - מטליזציה באמצעות כתיבה ישירה בלייזר דפקים (פולסים) - Google Patents
מטליזציה באמצעות כתיבה ישירה בלייזר דפקים (פולסים)Info
- Publication number
- IL247946A0 IL247946A0 IL247946A IL24794616A IL247946A0 IL 247946 A0 IL247946 A0 IL 247946A0 IL 247946 A IL247946 A IL 247946A IL 24794616 A IL24794616 A IL 24794616A IL 247946 A0 IL247946 A0 IL 247946A0
- Authority
- IL
- Israel
- Prior art keywords
- pulsed
- write laser
- mode direct
- laser metallization
- metallization
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Powder Metallurgy (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461977766P | 2014-04-10 | 2014-04-10 | |
PCT/IB2015/052476 WO2015155662A1 (en) | 2014-04-10 | 2015-04-05 | Pulsed-mode direct-write laser metallization |
Publications (2)
Publication Number | Publication Date |
---|---|
IL247946A0 true IL247946A0 (he) | 2016-11-30 |
IL247946B IL247946B (he) | 2022-08-01 |
Family
ID=54287371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL247946A IL247946B (he) | 2014-04-10 | 2015-04-05 | מטליזציה באמצעות כתיבה ישירה בלייזר דפקים (פולסים) |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3140853A4 (he) |
JP (1) | JP6635313B2 (he) |
KR (1) | KR102345450B1 (he) |
CN (1) | CN106133891B (he) |
IL (1) | IL247946B (he) |
TW (1) | TWI661752B (he) |
WO (1) | WO2015155662A1 (he) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9925797B2 (en) | 2014-08-07 | 2018-03-27 | Orbotech Ltd. | Lift printing system |
US10193004B2 (en) | 2014-10-19 | 2019-01-29 | Orbotech Ltd. | LIFT printing of conductive traces onto a semiconductor substrate |
EP3247816A4 (en) | 2015-01-19 | 2018-01-24 | Orbotech Ltd. | Printing of three-dimensional metal structures with a sacrificial support |
EP3322835A4 (en) | 2015-07-09 | 2019-02-27 | Orbotech Ltd. | LASER-INDUCED FRONT TRANSFER EJECTION ANGLE CONTROL (LIFT) |
IL258026B2 (he) | 2015-11-22 | 2023-03-01 | Orbotech Ltd | בקרת תכונות פני שטח במבנים מודפסים תלת מימדיים |
TW201901887A (zh) | 2017-05-24 | 2019-01-01 | 以色列商奧寶科技股份有限公司 | 於未事先圖樣化基板上電器互連電路元件 |
KR102040530B1 (ko) * | 2018-04-25 | 2019-11-05 | 성균관대학교산학협력단 | 광소결을 이용해 재배선층을 형성하는 방법 |
ES2966467T3 (es) * | 2018-05-08 | 2024-04-22 | Seco Tools Ab | Un método para fabricar un cuerpo sinterizado |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61290796A (ja) * | 1985-06-19 | 1986-12-20 | 沖電気工業株式会社 | 厚膜混成集積回路基板の製造方法 |
JPS63209193A (ja) * | 1987-02-25 | 1988-08-30 | 松下電器産業株式会社 | 導体パタ−ン形成方法 |
JPH11307914A (ja) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | 厚膜配線基板のパターン形成方法 |
US6921626B2 (en) * | 2003-03-27 | 2005-07-26 | Kodak Polychrome Graphics Llc | Nanopastes as patterning compositions for electronic parts |
US7682970B2 (en) * | 2003-07-16 | 2010-03-23 | The Regents Of The University Of California | Maskless nanofabrication of electronic components |
US7294449B1 (en) | 2003-12-31 | 2007-11-13 | Kovio, Inc. | Radiation patternable functional materials, methods of their use, and structures formed therefrom |
JP2006038999A (ja) * | 2004-07-23 | 2006-02-09 | Sumitomo Electric Ind Ltd | レーザ照射を用いた導電性回路形成方法と導電性回路 |
TWI324423B (en) * | 2005-11-01 | 2010-05-01 | Cymer Inc | Laser system |
US20070105395A1 (en) | 2005-11-04 | 2007-05-10 | Edward Kinzel | Laser functionalization and patterning of thick-film inks |
US10231344B2 (en) | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
US8404160B2 (en) | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
US20090120924A1 (en) * | 2007-11-08 | 2009-05-14 | Stephen Moffatt | Pulse train annealing method and apparatus |
US8476552B2 (en) * | 2008-03-31 | 2013-07-02 | Electro Scientific Industries, Inc. | Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes |
JP2009290112A (ja) * | 2008-05-30 | 2009-12-10 | Fujifilm Corp | 導電性無機膜とその製造方法、配線基板、半導体装置 |
US8422197B2 (en) * | 2009-07-15 | 2013-04-16 | Applied Nanotech Holdings, Inc. | Applying optical energy to nanoparticles to produce a specified nanostructure |
KR101114256B1 (ko) * | 2010-07-14 | 2012-03-05 | 한국과학기술원 | 패턴 제조 방법 |
TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
-
2015
- 2015-04-05 JP JP2016552929A patent/JP6635313B2/ja active Active
- 2015-04-05 EP EP15776752.6A patent/EP3140853A4/en active Pending
- 2015-04-05 IL IL247946A patent/IL247946B/he unknown
- 2015-04-05 WO PCT/IB2015/052476 patent/WO2015155662A1/en active Application Filing
- 2015-04-05 KR KR1020167026671A patent/KR102345450B1/ko active IP Right Grant
- 2015-04-05 CN CN201580015581.9A patent/CN106133891B/zh active Active
- 2015-04-09 TW TW104111474A patent/TWI661752B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP6635313B2 (ja) | 2020-01-22 |
KR20160144985A (ko) | 2016-12-19 |
KR102345450B1 (ko) | 2021-12-29 |
IL247946B (he) | 2022-08-01 |
TW201543978A (zh) | 2015-11-16 |
CN106133891B (zh) | 2020-03-03 |
EP3140853A1 (en) | 2017-03-15 |
EP3140853A4 (en) | 2018-01-17 |
WO2015155662A1 (en) | 2015-10-15 |
JP2017513040A (ja) | 2017-05-25 |
TWI661752B (zh) | 2019-06-01 |
CN106133891A (zh) | 2016-11-16 |
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