SG11201700009XA - Laser annealing device - Google Patents

Laser annealing device

Info

Publication number
SG11201700009XA
SG11201700009XA SG11201700009XA SG11201700009XA SG11201700009XA SG 11201700009X A SG11201700009X A SG 11201700009XA SG 11201700009X A SG11201700009X A SG 11201700009XA SG 11201700009X A SG11201700009X A SG 11201700009XA SG 11201700009X A SG11201700009X A SG 11201700009XA
Authority
SG
Singapore
Prior art keywords
laser annealing
annealing device
laser
annealing
Prior art date
Application number
SG11201700009XA
Inventor
Chunfeng Song
Pengli Zhang
Hailiang Lu
Original Assignee
Shanghai Microelectronics Equi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Microelectronics Equi filed Critical Shanghai Microelectronics Equi
Publication of SG11201700009XA publication Critical patent/SG11201700009XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/704—Beam dispersers, e.g. beam wells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
SG11201700009XA 2014-07-04 2015-07-03 Laser annealing device SG11201700009XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410243344.5A CN105448681B (en) 2014-07-04 2014-07-04 Laser anneal device
PCT/CN2015/083250 WO2016000650A1 (en) 2014-07-04 2015-07-03 Laser annealing device

Publications (1)

Publication Number Publication Date
SG11201700009XA true SG11201700009XA (en) 2017-02-27

Family

ID=55018475

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700009XA SG11201700009XA (en) 2014-07-04 2015-07-03 Laser annealing device

Country Status (5)

Country Link
US (1) US20170144251A1 (en)
CN (1) CN105448681B (en)
SG (1) SG11201700009XA (en)
TW (1) TWI555063B (en)
WO (1) WO2016000650A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102490081B1 (en) * 2016-03-23 2023-01-18 삼성디스플레이 주식회사 Laser crystallization device and method
CN106238905B (en) * 2016-06-14 2019-06-21 昆山国显光电有限公司 A kind of laser energy automatic compensating method and equipment
TW201821203A (en) * 2016-12-06 2018-06-16 財團法人工業技術研究院 Laser stabilized energy cleaning apparatus and method
CN107552975A (en) * 2017-09-28 2018-01-09 惠州市洛玛科技有限公司 The method of cutter device and cutting products
CN108048913A (en) * 2017-12-14 2018-05-18 友达光电（昆山）有限公司 A kind of amorphous silicon is the crystal laser device and method of polysilicon
CN110600367A (en) * 2019-09-19 2019-12-20 京东方科技集团股份有限公司 Laser annealing device and laser annealing equipment
CN111952159B (en) * 2020-08-17 2024-01-26 北京中科镭特电子有限公司 Laser annealing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001222241A1 (en) * 2000-01-19 2001-07-31 Hamamatsu Photonics K.K. Laser machinning device
US6583876B2 (en) * 2001-05-24 2003-06-24 Therma-Wave, Inc. Apparatus for optical measurements of nitrogen concentration in thin films
JP4660074B2 (en) * 2003-05-26 2011-03-30 富士フイルム株式会社 Laser annealing equipment
US20050189329A1 (en) * 2003-09-02 2005-09-01 Somit Talwar Laser thermal processing with laser diode radiation
TWI272149B (en) * 2004-02-26 2007-02-01 Ultratech Inc Laser scanning apparatus and methods for thermal processing
US7564552B2 (en) * 2004-05-14 2009-07-21 Kla-Tencor Technologies Corp. Systems and methods for measurement of a specimen with vacuum ultraviolet light
JP2007110064A (en) * 2005-09-14 2007-04-26 Ishikawajima Harima Heavy Ind Co Ltd Laser annealing method and device thereof
CN102564613B (en) * 2010-12-31 2014-05-21 上海微电子装备有限公司 Wavelength tracker
FR2972447B1 (en) * 2011-03-08 2019-06-07 Saint-Gobain Glass France PROCESS FOR OBTAINING A SUBSTRATE WITH A COATING
SG195515A1 (en) * 2012-06-11 2013-12-30 Ultratech Inc Laser annealing systems and methods with ultra-short dwell times
US8937770B2 (en) * 2012-07-24 2015-01-20 Coherent Gmbh Excimer laser apparatus projecting a beam with a selectively variable short-axis beam profile
CN103578943B (en) * 2012-07-25 2017-05-31 上海微电子装备有限公司 A kind of laser anneal device and laser anneal method
CN103777476B (en) * 2012-10-19 2016-01-27 上海微电子装备有限公司 A kind of off-axis alignment system and alignment methods

Also Published As

Publication number Publication date
CN105448681B (en) 2018-11-09
TW201604939A (en) 2016-02-01
US20170144251A1 (en) 2017-05-25
TWI555063B (en) 2016-10-21
CN105448681A (en) 2016-03-30
WO2016000650A1 (en) 2016-01-07

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