IL210832A - מתקן ליטוגרפי ושיטה לייצור מתקן - Google Patents

מתקן ליטוגרפי ושיטה לייצור מתקן

Info

Publication number
IL210832A
IL210832A IL210832A IL21083211A IL210832A IL 210832 A IL210832 A IL 210832A IL 210832 A IL210832 A IL 210832A IL 21083211 A IL21083211 A IL 21083211A IL 210832 A IL210832 A IL 210832A
Authority
IL
Israel
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
IL210832A
Other languages
English (en)
Other versions
IL210832A0 (en
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of IL210832A0 publication Critical patent/IL210832A0/en
Publication of IL210832A publication Critical patent/IL210832A/he

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
IL210832A 2010-02-19 2011-01-24 מתקן ליטוגרפי ושיטה לייצור מתקן IL210832A (he)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30602010P 2010-02-19 2010-02-19

Publications (2)

Publication Number Publication Date
IL210832A0 IL210832A0 (en) 2011-06-30
IL210832A true IL210832A (he) 2016-11-30

Family

ID=44262516

Family Applications (1)

Application Number Title Priority Date Filing Date
IL210832A IL210832A (he) 2010-02-19 2011-01-24 מתקן ליטוגרפי ושיטה לייצור מתקן

Country Status (6)

Country Link
US (1) US8947630B2 (he)
JP (1) JP5266352B2 (he)
KR (1) KR101226639B1 (he)
CN (1) CN102163000B (he)
IL (1) IL210832A (he)
TW (1) TWI427435B (he)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005997A (en) * 2010-02-19 2011-08-22 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2006336A (en) * 2010-04-29 2011-11-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2009305A (en) 2011-08-31 2013-03-04 Asml Netherlands Bv A method of determining focus corrections, lithographic processing cell and device manufacturing method.
WO2016146217A1 (en) * 2015-03-13 2016-09-22 Asml Netherlands B.V. Lithographic method and lithographic apparatus
WO2016162231A1 (en) 2015-04-10 2016-10-13 Asml Netherlands B.V. Method and apparatus for inspection and metrology
US9733577B2 (en) 2015-09-03 2017-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Intra-field process control for lithography
US10908512B2 (en) * 2015-12-24 2021-02-02 Asml Netherlands B.V. Methods of controlling a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus
KR102439450B1 (ko) * 2016-02-23 2022-09-01 에이에스엠엘 네델란즈 비.브이. 패터닝 프로세스 제어 방법, 리소그래피 장치, 계측 장치 리소그래피 셀 및 연관된 컴퓨터 프로그램
CN112631086A (zh) * 2016-07-11 2021-04-09 Asml荷兰有限公司 用于确定性能参数的指纹的方法和设备
US11294289B2 (en) 2016-10-14 2022-04-05 Asml Netherlands B.V. Selecting a set of locations associated with a measurement or feature on a substrate
CN109891324B (zh) * 2016-10-26 2021-05-25 Asml荷兰有限公司 用于光刻过程的优化的方法
EP3396456A1 (en) * 2017-04-25 2018-10-31 ASML Netherlands B.V. Method of monitoring and device manufacturing method
KR20200125986A (ko) * 2018-03-29 2020-11-05 에이에스엠엘 네델란즈 비.브이. 스캐닝 노광 장치를 위한 제어 방법
JP7171468B2 (ja) 2019-02-20 2022-11-15 キヤノン株式会社 情報処理装置、プログラム、リソグラフィ装置、物品の製造方法、物品の製造システム、及び出力方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336436B2 (ja) * 1991-04-02 2002-10-21 株式会社ニコン リソグラフィシステム、情報収集装置、露光装置、及び半導体デバイス製造方法
US6509952B1 (en) * 2000-05-23 2003-01-21 Silicon Valley Group, Inc. Method and system for selective linewidth optimization during a lithographic process
US20020042664A1 (en) 2000-05-31 2002-04-11 Nikon Corporation Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus
JP4905617B2 (ja) 2001-05-28 2012-03-28 株式会社ニコン 露光方法及びデバイス製造方法
US7261983B2 (en) 2000-12-08 2007-08-28 Litel Instruments Reference wafer and process for manufacturing same
JP2003037051A (ja) * 2001-07-25 2003-02-07 Canon Inc 露光装置及びその制御方法、並びに半導体デバイスの製造方法
US6785638B2 (en) * 2001-08-06 2004-08-31 Timbre Technologies, Inc. Method and system of dynamic learning through a regression-based library generation process
TWI225665B (en) * 2001-10-17 2004-12-21 Canon Kk Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method
JP3626448B2 (ja) * 2001-11-28 2005-03-09 株式会社東芝 露光方法
JP2003203846A (ja) * 2002-01-08 2003-07-18 Canon Inc 位置合わせ方法及びパラメータ選択方法
JP4018438B2 (ja) * 2002-04-30 2007-12-05 キヤノン株式会社 半導体露光装置を管理する管理システム
US7069104B2 (en) * 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
JP2003324055A (ja) * 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
JP4353498B2 (ja) * 2002-04-30 2009-10-28 キヤノン株式会社 管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム
US6915177B2 (en) * 2002-09-30 2005-07-05 Advanced Micro Devices, Inc. Comprehensive integrated lithographic process control system based on product design and yield feedback system
JP2005166951A (ja) 2003-12-02 2005-06-23 Nikon Corp 露光方法、露光装置及びリソグラフィシステム
KR100841423B1 (ko) * 2004-02-23 2008-06-25 에이에스엠엘 네델란즈 비.브이. 스캐터로미터 데이터에 기초한 처리 파라미터 값의 결정방법
US7403264B2 (en) * 2004-07-08 2008-07-22 Asml Netherlands B.V. Lithographic projection apparatus and a device manufacturing method using such lithographic projection apparatus
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
EP1744217B1 (en) * 2005-07-12 2012-03-14 ASML Netherlands B.V. Method of selecting a grid model for correcting grid deformations in a lithographic apparatus and lithographic assembly using the same
TWI345685B (en) * 2005-09-06 2011-07-21 Asml Netherlands Bv Lithographic method
JP5194800B2 (ja) * 2006-01-26 2013-05-08 株式会社ニコン 重ね合わせ管理方法及び装置、処理装置、測定装置及び露光装置、デバイス製造システム及びデバイス製造方法、並びにプログラム及び情報記録媒体
US7446854B2 (en) * 2006-02-07 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007109103A2 (en) * 2006-03-16 2007-09-27 Kla-Tencor Technologies Corporation Method and system for optimizing alignment performance in a fleet of exposure tools
JP2009231564A (ja) 2008-03-24 2009-10-08 Toshiba Corp スキャン露光装置の補正方法
EP2392970A3 (en) 2010-02-19 2017-08-23 ASML Netherlands BV Method and apparatus for controlling a lithographic apparatus
JP5583791B2 (ja) * 2010-02-19 2014-09-03 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイス製造方法
NL2006336A (en) * 2010-04-29 2011-11-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2008285A (en) * 2011-03-11 2012-09-12 Asml Netherlands Bv Method of controlling a lithographic apparatus, device manufacturing method, lithographic apparatus, computer program product and method of improving a mathematical model of a lithographic process.

Also Published As

Publication number Publication date
CN102163000A (zh) 2011-08-24
IL210832A0 (en) 2011-06-30
US20110205511A1 (en) 2011-08-25
KR20110095832A (ko) 2011-08-25
TW201133158A (en) 2011-10-01
TWI427435B (zh) 2014-02-21
JP5266352B2 (ja) 2013-08-21
JP2011187951A (ja) 2011-09-22
KR101226639B1 (ko) 2013-01-25
US8947630B2 (en) 2015-02-03
CN102163000B (zh) 2013-11-27

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