IL144077A - Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module - Google Patents

Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module

Info

Publication number
IL144077A
IL144077A IL14407799A IL14407799A IL144077A IL 144077 A IL144077 A IL 144077A IL 14407799 A IL14407799 A IL 14407799A IL 14407799 A IL14407799 A IL 14407799A IL 144077 A IL144077 A IL 144077A
Authority
IL
Israel
Prior art keywords
circuit card
card module
stiffening frame
extended width
interchangeable
Prior art date
Application number
IL14407799A
Other languages
English (en)
Other versions
IL144077A0 (en
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of IL144077A0 publication Critical patent/IL144077A0/xx
Publication of IL144077A publication Critical patent/IL144077A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/76—Joints and connections having a cam, wedge, or tapered portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
IL14407799A 1998-12-30 1999-12-16 Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module IL144077A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/223,288 US6246582B1 (en) 1998-12-30 1998-12-30 Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
PCT/US1999/030191 WO2000041449A1 (fr) 1998-12-30 1999-12-16 Cadre de renforcement interchangeable a pince d'ancrage de grande largeur destine a s'utiliser dans un module de carte imprimee

Publications (2)

Publication Number Publication Date
IL144077A0 IL144077A0 (en) 2002-05-23
IL144077A true IL144077A (en) 2005-08-31

Family

ID=22835865

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14407799A IL144077A (en) 1998-12-30 1999-12-16 Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module

Country Status (7)

Country Link
US (1) US6246582B1 (fr)
EP (1) EP1149520B1 (fr)
JP (1) JP2002534817A (fr)
CA (1) CA2358349A1 (fr)
DE (1) DE69906583T2 (fr)
IL (1) IL144077A (fr)
WO (1) WO2000041449A1 (fr)

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US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6768642B2 (en) * 2002-12-16 2004-07-27 Lockheed Martin Corporation VME circuit host card with triple mezzanine configuration
US6839235B2 (en) * 2002-12-19 2005-01-04 Dy 4 Systems Inc. Embedded heat pipe for a conduction cooled circuit card assembly
US6771504B2 (en) * 2002-12-23 2004-08-03 Eastman Kodak Company Thermal transport element for use with a heat dissipating electrical assemblage
US20050213306A1 (en) * 2004-03-25 2005-09-29 Lockheed Martin Corporation Environmental control method and apparatus for electronic device enclosures
JP4444771B2 (ja) * 2004-09-14 2010-03-31 株式会社沖データ 部材固定具及び電子機器
US20060109631A1 (en) * 2004-11-02 2006-05-25 Data Device Corporation Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
WO2006124212A2 (fr) * 2005-05-19 2006-11-23 Bae Systems Information And Electronic Systems Integration Inc. Dispositif de retention de cartes haute densite
US7505251B2 (en) * 2005-10-28 2009-03-17 International Business Machines Corporation Actuation mechanism for mating electronic card interconnect systems
US8703278B2 (en) * 2006-03-28 2014-04-22 Honeywell International Inc. Light weight printed wiring board
US7646609B2 (en) * 2006-04-19 2010-01-12 International Business Machines Corporation Method and apparatus for achieving rigid attachments for computer components
US20070253169A1 (en) * 2006-05-01 2007-11-01 Honeywell International Inc. Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis
US7391610B2 (en) 2006-09-29 2008-06-24 Rockwell Automation Technologies, Inc. Thermal cooling of industrial electronic module by conductive structure
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
US8223494B2 (en) * 2007-12-31 2012-07-17 General Electric Company Conduction cooled circuit board assembly
US20090147472A1 (en) * 2007-12-11 2009-06-11 Honeywell International Inc. Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
JP4829279B2 (ja) * 2008-08-27 2011-12-07 株式会社東芝 回路ユニットの放熱構造
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US9078357B2 (en) * 2009-08-17 2015-07-07 Seagate Technology Llc Internal cover thermal conduction
US8526184B2 (en) * 2009-09-09 2013-09-03 Curtiss-Wright Controls, Inc. Devices having a thermal interface and methods of forming the same
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US8270172B2 (en) * 2010-04-23 2012-09-18 GE Intelligent Platforms Embedded Systems, Inc. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
US8477500B2 (en) 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
JP2012023329A (ja) * 2010-06-14 2012-02-02 Toshiba Corp 基板ユニット及び電子装置
US8233279B2 (en) 2010-11-04 2012-07-31 Ge Intelligent Platforms, Inc. Wedge lock for use with a single board computer and method of assembling a computer system
US20120170224A1 (en) * 2010-12-29 2012-07-05 Src, Inc. Circuit board frame with integral heat sink for enhanced thermal transfer
US8854818B1 (en) * 2012-06-15 2014-10-07 Lockheed Martin Corporation Retaining and cooling system for line replaceable units
US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
DE102014201483B4 (de) 2014-01-28 2016-04-07 Wago Verwaltungsgesellschaft Mbh Quaderförmiges Gehäuse für ein Elektronikmodul, Elektronikmodul und Anordnung zur Kühlung wenigstens eines Elektronikmoduls
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) * 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US10182515B2 (en) * 2014-05-02 2019-01-15 The Boeing Company Conduction cooled module
WO2016004528A1 (fr) * 2014-07-08 2016-01-14 Adc Technologies Inc. Paroi d'enceinte refroidie résistant aux fuites, capable de redondance et robuste
US10136557B2 (en) 2015-12-04 2018-11-20 General Electric Company Thermal management systems and methods for heat generating electronics
CA3070742A1 (fr) * 2016-07-29 2018-02-01 Adc Technologies Inc. Appareil electronique refroidi par rail sans ventilateur
US10809774B2 (en) 2016-08-12 2020-10-20 Hypertechnologie Ciara Inc. Fluid flow tunnelling in a non-metallic computer chassis
JP6809294B2 (ja) * 2017-03-02 2021-01-06 三菱電機株式会社 パワーモジュール
US11997815B2 (en) * 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
US12075587B2 (en) 2022-02-17 2024-08-27 Hamilton Sundstrand Corporation Heat transfer interfaces for circuit card assembly (CCA) modules

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US4298904A (en) 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
JPS59200495A (ja) 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
GB2167906B (en) 1984-11-23 1988-08-10 Gec Avionics Rack mounted circuit module
US4777561A (en) 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
US4751963A (en) * 1986-07-03 1988-06-21 Hughes Aircraft Company Thermal conductance retainer for electronic printed circuit boards and the like
US4879634A (en) * 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US4916575A (en) 1988-08-08 1990-04-10 Asten Francis C Van Multiple circuit board module
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US4971570A (en) 1989-08-31 1990-11-20 Hughes Aircraft Company Wedge clamp thermal connector
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DE4028003A1 (de) 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
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US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
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Also Published As

Publication number Publication date
DE69906583T2 (de) 2004-01-08
IL144077A0 (en) 2002-05-23
US6246582B1 (en) 2001-06-12
EP1149520B1 (fr) 2003-04-02
JP2002534817A (ja) 2002-10-15
EP1149520A1 (fr) 2001-10-31
WO2000041449A1 (fr) 2000-07-13
DE69906583D1 (de) 2003-05-08
CA2358349A1 (fr) 2000-07-13

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Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees