DE69906583D1 - Austauschbar versteifungsleiste mit erweitertes keilschloss in einem kartenmodul - Google Patents

Austauschbar versteifungsleiste mit erweitertes keilschloss in einem kartenmodul

Info

Publication number
DE69906583D1
DE69906583D1 DE69906583T DE69906583T DE69906583D1 DE 69906583 D1 DE69906583 D1 DE 69906583D1 DE 69906583 T DE69906583 T DE 69906583T DE 69906583 T DE69906583 T DE 69906583T DE 69906583 D1 DE69906583 D1 DE 69906583D1
Authority
DE
Germany
Prior art keywords
card module
reinforcement strip
wedge lock
extended wedge
interchangeable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69906583T
Other languages
English (en)
Other versions
DE69906583T2 (de
Inventor
D Habing
A Odegard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of DE69906583D1 publication Critical patent/DE69906583D1/de
Application granted granted Critical
Publication of DE69906583T2 publication Critical patent/DE69906583T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/76—Joints and connections having a cam, wedge, or tapered portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE69906583T 1998-12-30 1999-12-16 Austauschbar versteifungsleiste mit erweitertes keilschloss in einem kartenmodul Expired - Fee Related DE69906583T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US223288 1998-12-30
US09/223,288 US6246582B1 (en) 1998-12-30 1998-12-30 Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
PCT/US1999/030191 WO2000041449A1 (en) 1998-12-30 1999-12-16 Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module

Publications (2)

Publication Number Publication Date
DE69906583D1 true DE69906583D1 (de) 2003-05-08
DE69906583T2 DE69906583T2 (de) 2004-01-08

Family

ID=22835865

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69906583T Expired - Fee Related DE69906583T2 (de) 1998-12-30 1999-12-16 Austauschbar versteifungsleiste mit erweitertes keilschloss in einem kartenmodul

Country Status (7)

Country Link
US (1) US6246582B1 (de)
EP (1) EP1149520B1 (de)
JP (1) JP2002534817A (de)
CA (1) CA2358349A1 (de)
DE (1) DE69906583T2 (de)
IL (1) IL144077A (de)
WO (1) WO2000041449A1 (de)

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US6538884B1 (en) * 2001-09-21 2003-03-25 Motorola, Inc. Method and apparatus for removing heat from a component
US7077526B2 (en) * 2001-09-28 2006-07-18 Texas Instruments Incorporated Mechanically adjustable thermal path for projection display device cooling
US6762939B2 (en) * 2002-02-20 2004-07-13 Intel Corporation Thermal solution for a mezzanine card
US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6768642B2 (en) * 2002-12-16 2004-07-27 Lockheed Martin Corporation VME circuit host card with triple mezzanine configuration
US6839235B2 (en) * 2002-12-19 2005-01-04 Dy 4 Systems Inc. Embedded heat pipe for a conduction cooled circuit card assembly
US6771504B2 (en) * 2002-12-23 2004-08-03 Eastman Kodak Company Thermal transport element for use with a heat dissipating electrical assemblage
US20050213306A1 (en) * 2004-03-25 2005-09-29 Lockheed Martin Corporation Environmental control method and apparatus for electronic device enclosures
JP4444771B2 (ja) * 2004-09-14 2010-03-31 株式会社沖データ 部材固定具及び電子機器
US20060109631A1 (en) * 2004-11-02 2006-05-25 Data Device Corporation Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7483271B2 (en) * 2005-05-19 2009-01-27 Bae Systems Information And Electronic Systems Integration Inc. High density card retention device
US7505251B2 (en) * 2005-10-28 2009-03-17 International Business Machines Corporation Actuation mechanism for mating electronic card interconnect systems
US8703278B2 (en) * 2006-03-28 2014-04-22 Honeywell International Inc. Light weight printed wiring board
US7646609B2 (en) * 2006-04-19 2010-01-12 International Business Machines Corporation Method and apparatus for achieving rigid attachments for computer components
US20070253169A1 (en) * 2006-05-01 2007-11-01 Honeywell International Inc. Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis
US7391610B2 (en) 2006-09-29 2008-06-24 Rockwell Automation Technologies, Inc. Thermal cooling of industrial electronic module by conductive structure
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
US8223494B2 (en) * 2007-12-31 2012-07-17 General Electric Company Conduction cooled circuit board assembly
US20090147472A1 (en) * 2007-12-11 2009-06-11 Honeywell International Inc. Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
JP4829279B2 (ja) * 2008-08-27 2011-12-07 株式会社東芝 回路ユニットの放熱構造
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US9078357B2 (en) * 2009-08-17 2015-07-07 Seagate Technology Llc Internal cover thermal conduction
US8526184B2 (en) * 2009-09-09 2013-09-03 Curtiss-Wright Controls, Inc. Devices having a thermal interface and methods of forming the same
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US8270172B2 (en) * 2010-04-23 2012-09-18 GE Intelligent Platforms Embedded Systems, Inc. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
US8477500B2 (en) 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
JP2012023329A (ja) * 2010-06-14 2012-02-02 Toshiba Corp 基板ユニット及び電子装置
US8233279B2 (en) 2010-11-04 2012-07-31 Ge Intelligent Platforms, Inc. Wedge lock for use with a single board computer and method of assembling a computer system
US20120170224A1 (en) * 2010-12-29 2012-07-05 Src, Inc. Circuit board frame with integral heat sink for enhanced thermal transfer
US8854818B1 (en) * 2012-06-15 2014-10-07 Lockheed Martin Corporation Retaining and cooling system for line replaceable units
US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
DE102014201483B4 (de) 2014-01-28 2016-04-07 Wago Verwaltungsgesellschaft Mbh Quaderförmiges Gehäuse für ein Elektronikmodul, Elektronikmodul und Anordnung zur Kühlung wenigstens eines Elektronikmoduls
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US10182515B2 (en) * 2014-05-02 2019-01-15 The Boeing Company Conduction cooled module
TW201617765A (zh) * 2014-07-08 2016-05-16 Adc科技股份有限公司 用於伺服器設備的改良軌道冷卻設置
US10136557B2 (en) 2015-12-04 2018-11-20 General Electric Company Thermal management systems and methods for heat generating electronics
WO2018018163A2 (en) * 2016-07-29 2018-02-01 Adc Technologies Inc. Fanless rail cooled electronics apparatus
WO2018027325A1 (en) * 2016-08-12 2018-02-15 Hypertechnologie Ciara Inc. Fluid flow tunnelling in a non-metallic computer chassis
JP6809294B2 (ja) * 2017-03-02 2021-01-06 三菱電機株式会社 パワーモジュール
US11997815B2 (en) * 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
US12075587B2 (en) 2022-02-17 2024-08-27 Hamilton Sundstrand Corporation Heat transfer interfaces for circuit card assembly (CCA) modules

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US4298904A (en) 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
JPS59200495A (ja) 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
GB2167906B (en) 1984-11-23 1988-08-10 Gec Avionics Rack mounted circuit module
US4777561A (en) 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
US4751963A (en) * 1986-07-03 1988-06-21 Hughes Aircraft Company Thermal conductance retainer for electronic printed circuit boards and the like
US4879634A (en) * 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US4916575A (en) 1988-08-08 1990-04-10 Asten Francis C Van Multiple circuit board module
US4853829A (en) 1988-11-09 1989-08-01 Eaton Corporation Electronic module locking mechanism
JP2760829B2 (ja) 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
US4971570A (en) 1989-08-31 1990-11-20 Hughes Aircraft Company Wedge clamp thermal connector
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
DE4028003A1 (de) 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5225964A (en) 1991-10-31 1993-07-06 Rockwell International Corporation Integrated lightweight card rack
US5253963A (en) 1991-12-11 1993-10-19 Honeywell Inc. Snap together wedgelock
FR2686213B1 (fr) 1992-01-14 1994-05-06 Applications Gles Elect Meca Boitier recepteur de composants electroniques dissipateurs.
US5485353A (en) * 1993-02-26 1996-01-16 Eg&G Birtcher, Inc. Retainer assembly
US5414592A (en) * 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US5280411A (en) 1993-05-10 1994-01-18 Southwest Research Institute Packaging for an electronic circuit board
US5482109A (en) 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
US5625227A (en) 1995-01-18 1997-04-29 Dell Usa, L.P. Circuit board-mounted IC package cooling apparatus
US5559675A (en) 1995-03-28 1996-09-24 Twinhead International Corp. Computer CPU heat dissipating and protecting device
US5549155A (en) 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US5892658A (en) * 1998-05-12 1999-04-06 Lockhead Martin Corporation VME eurocard triple printed wiring board single slot module assembly

Also Published As

Publication number Publication date
EP1149520A1 (de) 2001-10-31
CA2358349A1 (en) 2000-07-13
US6246582B1 (en) 2001-06-12
JP2002534817A (ja) 2002-10-15
WO2000041449A1 (en) 2000-07-13
DE69906583T2 (de) 2004-01-08
IL144077A0 (en) 2002-05-23
EP1149520B1 (de) 2003-04-02
IL144077A (en) 2005-08-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee