IL132907A0 - Nanoporous polymer films for exteme low and interlayer dielectrics - Google Patents
Nanoporous polymer films for exteme low and interlayer dielectricsInfo
- Publication number
- IL132907A0 IL132907A0 IL13290799A IL13290799A IL132907A0 IL 132907 A0 IL132907 A0 IL 132907A0 IL 13290799 A IL13290799 A IL 13290799A IL 13290799 A IL13290799 A IL 13290799A IL 132907 A0 IL132907 A0 IL 132907A0
- Authority
- IL
- Israel
- Prior art keywords
- exteme
- low
- polymer films
- interlayer dielectrics
- nanoporous polymer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/04—Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
- C08J2201/05—Elimination by evaporation or heat degradation of a liquid phase
- C08J2201/0502—Elimination by evaporation or heat degradation of a liquid phase the liquid phase being organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/04—Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
- C08J2201/054—Precipitating the polymer by adding a non-solvent or a different solvent
- C08J2201/0542—Precipitating the polymer by adding a non-solvent or a different solvent from an organic solvent-based polymer composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/665—Porous materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
Landscapes
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Formation Of Insulating Films (AREA)
- Organic Insulating Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/196,452 US6187248B1 (en) | 1998-11-19 | 1998-11-19 | Nanoporous polymer films for extreme low and interlayer dielectrics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL132907A0 true IL132907A0 (en) | 2001-03-19 |
Family
ID=22725482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL13290799A IL132907A0 (en) | 1998-11-19 | 1999-11-12 | Nanoporous polymer films for exteme low and interlayer dielectrics |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6187248B1 (de) |
| EP (1) | EP1002830A3 (de) |
| JP (1) | JP2000154268A (de) |
| KR (1) | KR20000035596A (de) |
| IL (1) | IL132907A0 (de) |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030129379A1 (en) * | 1999-04-23 | 2003-07-10 | Shigeru Yao | Porous insulating film and its laminates |
| EP1094506A3 (de) | 1999-10-18 | 2004-03-03 | Applied Materials, Inc. | Schutzschicht für Filme mit besonders kleiner Dielektrizitätskonstante |
| US6156743A (en) * | 1999-10-18 | 2000-12-05 | Whitcomb; John E. | Method of decreasing fatigue |
| US6875687B1 (en) | 1999-10-18 | 2005-04-05 | Applied Materials, Inc. | Capping layer for extreme low dielectric constant films |
| US6342454B1 (en) * | 1999-11-16 | 2002-01-29 | International Business Machines Corporation | Electronic devices with dielectric compositions and method for their manufacture |
| US6420262B1 (en) * | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
| US6376370B1 (en) * | 2000-01-18 | 2002-04-23 | Micron Technology, Inc. | Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy |
| US6576568B2 (en) | 2000-04-04 | 2003-06-10 | Applied Materials, Inc. | Ionic additives for extreme low dielectric constant chemical formulations |
| US7265062B2 (en) * | 2000-04-04 | 2007-09-04 | Applied Materials, Inc. | Ionic additives for extreme low dielectric constant chemical formulations |
| KR100559056B1 (ko) * | 2000-09-25 | 2006-03-10 | 주식회사 동진쎄미켐 | 저유전성 반도체용 절연막, 그 제조방법 및 절연막을형성하기 위한 전구물질 조성물 |
| KR100545125B1 (ko) * | 2000-09-25 | 2006-01-24 | 주식회사 동진쎄미켐 | 유기-무기 복합체로 이루어진 반도체용 절연막 및 그제조방법 |
| NL1016779C2 (nl) | 2000-12-02 | 2002-06-04 | Cornelis Johannes Maria V Rijn | Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs. |
| KR100373215B1 (ko) * | 2001-02-01 | 2003-02-25 | 주식회사 엘지화학 | 반도체 소자용 저 유전 절연재료의 제조방법 |
| US6899857B2 (en) * | 2001-11-13 | 2005-05-31 | Chartered Semiconductors Manufactured Limited | Method for forming a region of low dielectric constant nanoporous material using a microemulsion technique |
| US6602801B2 (en) * | 2001-11-13 | 2003-08-05 | Chartered Semiconductor Manufacturing Ltd. | Method for forming a region of low dielectric constant nanoporous material |
| KR100440488B1 (ko) * | 2001-12-27 | 2004-07-14 | 주식회사 엘지화학 | 반도체의 절연막 형성용 유기실리케이트 고분자 및 이를포함하는 저유전 절연막 |
| US6765030B2 (en) * | 2002-03-22 | 2004-07-20 | The University Of North Carolina At Chapel Hill | Methods of forming polymeric structures using carbon dioxide and polymeric structures formed therapy |
| US20040033371A1 (en) * | 2002-05-16 | 2004-02-19 | Hacker Nigel P. | Deposition of organosilsesquioxane films |
| US6699729B1 (en) | 2002-10-25 | 2004-03-02 | Omnivision International Holding Ltd | Method of forming planar color filters in an image sensor |
| US7120443B2 (en) * | 2003-05-12 | 2006-10-10 | Qualcomm Incorporated | Method and apparatus for fast link setup in a wireless communication system |
| US7220665B2 (en) * | 2003-08-05 | 2007-05-22 | Micron Technology, Inc. | H2 plasma treatment |
| US20050218504A1 (en) * | 2004-03-30 | 2005-10-06 | International Business Machines Corporation | Filled cavities semiconductor devices |
| US7378136B2 (en) * | 2004-07-09 | 2008-05-27 | 3M Innovative Properties Company | Optical film coating |
| US20060044206A1 (en) * | 2004-08-27 | 2006-03-02 | Moskowitz Paul A | Shielding wireless transponders |
| US8067402B2 (en) * | 2005-12-12 | 2011-11-29 | Allaccem, Inc. | Methods and systems for coating an oral surface |
| US20100244306A1 (en) * | 2006-12-18 | 2010-09-30 | Uop Llc | Asymmetric gas separation membranes with superior capabilities for gas separation |
| US20080143014A1 (en) * | 2006-12-18 | 2008-06-19 | Man-Wing Tang | Asymmetric Gas Separation Membranes with Superior Capabilities for Gas Separation |
| CA2683383C (en) | 2007-02-21 | 2016-01-05 | Allaccem, Incorporated | Bridged polycyclic compound based compositions for the inhibition and amelioration of disease |
| US8153617B2 (en) * | 2007-08-10 | 2012-04-10 | Allaccem, Inc. | Bridged polycyclic compound based compositions for coating oral surfaces in humans |
| US8153618B2 (en) * | 2007-08-10 | 2012-04-10 | Allaccem, Inc. | Bridged polycyclic compound based compositions for topical applications for pets |
| US8188068B2 (en) * | 2007-08-10 | 2012-05-29 | Allaccem, Inc. | Bridged polycyclic compound based compositions for coating oral surfaces in pets |
| US20090074833A1 (en) * | 2007-08-17 | 2009-03-19 | Whiteford Jeffery A | Bridged polycyclic compound based compositions for controlling bone resorption |
| US20100004218A1 (en) * | 2008-06-20 | 2010-01-07 | Whiteford Jeffery A | Bridged polycyclic compound based compositions for renal therapy |
| US20100016270A1 (en) * | 2008-06-20 | 2010-01-21 | Whiteford Jeffery A | Bridged polycyclic compound based compositions for controlling cholesterol levels |
| CN102458819B (zh) | 2009-04-15 | 2014-09-03 | 3M创新有限公司 | 回射光学构造 |
| US9291752B2 (en) | 2013-08-19 | 2016-03-22 | 3M Innovative Properties Company | Retroreflecting optical construction |
| TWI491930B (zh) | 2009-04-15 | 2015-07-11 | 3M新設資產公司 | 光學膜 |
| US9464179B2 (en) | 2009-04-15 | 2016-10-11 | 3M Innovative Properties Company | Process and apparatus for a nanovoided article |
| JP5671003B2 (ja) | 2009-04-15 | 2015-02-18 | スリーエム イノベイティブ プロパティズ カンパニー | ナノ中空物品用プロセス及び装置 |
| US9308511B2 (en) | 2009-10-14 | 2016-04-12 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University | Fabricating porous materials using thixotropic gels |
| US8922733B2 (en) | 2009-10-24 | 2014-12-30 | 3M Innovative Properties Company | Light source and display system incorporating same |
| WO2011068830A2 (en) | 2009-12-01 | 2011-06-09 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Porous geopolymer materials |
| US8950924B2 (en) | 2009-12-08 | 2015-02-10 | 3M Innovative Properties Company | Optical constructions incorporating a light guide and low refractive index films |
| EP2558290B1 (de) | 2010-04-15 | 2019-01-23 | 3M Innovative Properties Company | Rückstrahlende artikel mit optisch aktiven bereichen und optisch inaktiven bereichen |
| MX341955B (es) | 2010-04-15 | 2016-09-08 | 3M Innovative Properties Co | Articulos retrorreflectantes que incluyen areas opticamente activas y areas opticamente inactivas. |
| US9791604B2 (en) | 2010-04-15 | 2017-10-17 | 3M Innovative Properties Company | Retroreflective articles including optically active areas and optically inactive areas |
| US9365691B2 (en) | 2010-08-06 | 2016-06-14 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University | Fabricating porous materials using intrepenetrating inorganic-organic composite gels |
| WO2012141925A1 (en) * | 2011-04-13 | 2012-10-18 | 3M Innovative Properties Company | Method of detecting volatile organic compounds |
| GB201112404D0 (en) * | 2011-07-19 | 2011-08-31 | Surface Innovations Ltd | Method |
| CN109776032A (zh) | 2011-09-21 | 2019-05-21 | 亚利桑那州立大学董事会(代理及代表亚利桑那州立大学的法人团体) | 地聚合物树脂材料、地聚合物材料及由其制备的材料 |
| KR101358988B1 (ko) * | 2012-03-30 | 2014-02-11 | 한국과학기술원 | 3차원 나노구조를 이용한 물질 고유 한계 이상의 고신축성 재료 및 이의 제조방법 |
| US8455140B1 (en) * | 2012-05-17 | 2013-06-04 | GM Global Technology Operations LLC | Porous polymer separator layer having a non-uniform cross sectional thickness for use in a secondary liquid electrolyte battery |
| KR101949561B1 (ko) | 2012-10-12 | 2019-02-18 | 코닝 인코포레이티드 | 잔류 강도를 갖는 제품 |
| WO2015006010A2 (en) | 2013-06-21 | 2015-01-15 | Dong-Kyun Seo | Metal oxides from acidic solutions |
| WO2015191962A1 (en) | 2014-06-12 | 2015-12-17 | Arizona Board Of Regents On Behalf Of Arizona State University | Carbon dioxide adsorbents |
| KR101728100B1 (ko) | 2015-01-21 | 2017-04-18 | 에스케이씨코오롱피아이 주식회사 | 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름 |
| US10829382B2 (en) | 2017-01-20 | 2020-11-10 | Skysong Innovations | Aluminosilicate nanorods |
| KR20190025072A (ko) * | 2017-08-02 | 2019-03-11 | 에스케이씨코오롱피아이 주식회사 | 흄드 실리카 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름 |
| CN112770610B (zh) * | 2021-01-15 | 2023-06-16 | 上海闻泰信息技术有限公司 | 石墨烯散热膜的制备方法和石墨烯散热膜 |
| JP7751974B2 (ja) * | 2021-02-15 | 2025-10-09 | 太陽ホールディングス株式会社 | 多孔質膜形成用ポリマー組成物、多孔質膜の製造方法、多孔質膜、フレキシブル金属張積層板及び電子基板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4717393A (en) | 1986-10-27 | 1988-01-05 | E. I. Du Pont De Nemours And Company | Polyimide gas separation membranes |
| US5658994A (en) | 1995-07-13 | 1997-08-19 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ether) dielectrics |
| US5874516A (en) * | 1995-07-13 | 1999-02-23 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ethers) |
| KR970020169A (ko) * | 1995-10-28 | 1997-05-28 | 김은영 | 수증기 또는 유기 증기 흡착을 이용한 다공성 분리막의 제조 방법 |
-
1998
- 1998-11-19 US US09/196,452 patent/US6187248B1/en not_active Expired - Fee Related
-
1999
- 1999-11-11 EP EP99122008A patent/EP1002830A3/de not_active Withdrawn
- 1999-11-12 IL IL13290799A patent/IL132907A0/xx unknown
- 1999-11-19 JP JP11329794A patent/JP2000154268A/ja active Pending
- 1999-11-19 KR KR1019990051635A patent/KR20000035596A/ko not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1002830A2 (de) | 2000-05-24 |
| JP2000154268A (ja) | 2000-06-06 |
| US6187248B1 (en) | 2001-02-13 |
| KR20000035596A (ko) | 2000-06-26 |
| EP1002830A3 (de) | 2001-11-28 |
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