IL105924A - Photoconform mask for three-dimensional printed circuit board technology - Google Patents
Photoconform mask for three-dimensional printed circuit board technologyInfo
- Publication number
- IL105924A IL105924A IL10592493A IL10592493A IL105924A IL 105924 A IL105924 A IL 105924A IL 10592493 A IL10592493 A IL 10592493A IL 10592493 A IL10592493 A IL 10592493A IL 105924 A IL105924 A IL 105924A
- Authority
- IL
- Israel
- Prior art keywords
- light blocking
- blocking material
- predetermined pattern
- portions
- reusable
- Prior art date
Links
- 238000005516 engineering process Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 54
- 230000000903 blocking effect Effects 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 35
- 229920002120 photoresistant polymer Polymers 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000003384 imaging method Methods 0.000 claims description 10
- 238000002679 ablation Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 4
- 238000007590 electrostatic spraying Methods 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000003856 thermoforming Methods 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims 4
- 230000001427 coherent effect Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920001774 Perfluoroether Polymers 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 1
- 241000422980 Marietta Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/904,948 US5344729A (en) | 1992-06-26 | 1992-06-26 | Conformal photomask for three-dimensional printed circuit board technology |
Publications (2)
Publication Number | Publication Date |
---|---|
IL105924A0 IL105924A0 (en) | 1993-10-20 |
IL105924A true IL105924A (en) | 1996-06-18 |
Family
ID=25420026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL10592493A IL105924A (en) | 1992-06-26 | 1993-06-07 | Photoconform mask for three-dimensional printed circuit board technology |
Country Status (5)
Country | Link |
---|---|
US (1) | US5344729A (ja) |
EP (1) | EP0575849A3 (ja) |
JP (1) | JPH06324476A (ja) |
IL (1) | IL105924A (ja) |
TW (1) | TW218433B (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5468409A (en) | 1993-11-03 | 1995-11-21 | The Boeing Company | Copper etchant useful for making fine-line copper elements |
US5395718A (en) * | 1992-11-18 | 1995-03-07 | The Boeing Company | Conformal photolithographic method and mask for manufacturing parts with patterned curved surfaces |
US5650249A (en) * | 1992-11-18 | 1997-07-22 | The Boeing Company | Method for making precision radomes |
US5476644A (en) * | 1994-04-13 | 1995-12-19 | Sterling Winthrop Inc. | Cyclic triamine chelating agents |
US5712613A (en) * | 1995-05-05 | 1998-01-27 | Mcdonnell Douglas Corporation | Computer-aided method for producing resistive tapers and resistive taper produced thereby |
US5600325A (en) * | 1995-06-07 | 1997-02-04 | Hughes Electronics | Ferro-electric frequency selective surface radome |
JPH10312945A (ja) * | 1997-03-12 | 1998-11-24 | Canon Inc | 球状デバイス露光装置及び製造方法 |
US6046098A (en) | 1998-02-23 | 2000-04-04 | Micron Technology, Inc. | Process of forming metal silicide interconnects |
JP2004345286A (ja) * | 2003-05-23 | 2004-12-09 | Sony Corp | 金型表面装飾方法及び金型 |
US7161552B2 (en) * | 2003-08-08 | 2007-01-09 | Lockheed Martin Corporation | Electromagnetic interference protection for radomes |
US7626185B2 (en) * | 2006-08-11 | 2009-12-01 | Battelle Memorial Institute | Patterning compositions, masks, and methods |
US8017308B2 (en) * | 2006-08-11 | 2011-09-13 | Battelle Memorial Institute | Patterning non-planar surfaces |
US9035849B2 (en) * | 2009-04-15 | 2015-05-19 | Fractal Antenna Systems, Inc. | Methods and apparatus for enhanced radiation characteristics from antennas and related components |
US10283872B2 (en) | 2009-04-15 | 2019-05-07 | Fractal Antenna Systems, Inc. | Methods and apparatus for enhanced radiation characteristics from antennas and related components |
KR101260221B1 (ko) * | 2011-12-01 | 2013-05-06 | 주식회사 엘지화학 | 마스크 |
US8802333B2 (en) * | 2012-03-15 | 2014-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reflective lithography masks and systems and methods |
US9427909B2 (en) | 2013-03-15 | 2016-08-30 | Ii-Vi Incorporated | Method of generating patterns on doubly-curved surfaces |
CN103395205B (zh) * | 2013-07-19 | 2015-06-10 | 中国科学院长春光学精密机械与物理研究所 | 立体打印技术制作曲面频率选择表面的方法 |
CN103700949A (zh) * | 2013-11-18 | 2014-04-02 | 北京理工大学 | 双曲频率选择面分光镜 |
CN104968152B (zh) * | 2015-07-06 | 2017-08-04 | 江苏本川智能电路科技股份有限公司 | 一种利用3d打印技术制作pcb板的方法 |
US11268837B1 (en) | 2018-05-30 | 2022-03-08 | Fractal Antenna Systems, Inc. | Conformal aperture engine sensors and mesh network |
US12103234B2 (en) | 2021-07-21 | 2024-10-01 | Honeywell Federal Manufacturing & Technologies, Llc | System and process for using a conductive, non-stick coating for automating tool touch-off |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS552257A (en) * | 1978-06-19 | 1980-01-09 | Ntn Toyo Bearing Co Ltd | Photo mask used when grooves of specified shapes are photoetched on curved face and production thereof |
US4388388A (en) * | 1981-06-04 | 1983-06-14 | General Dynamics Electronics Division | Method of forming metallic patterns on curved surfaces |
ATE56050T1 (de) * | 1987-04-24 | 1990-09-15 | Siemens Ag | Verfahren zur herstellung von leiterplatten. |
US4842677A (en) * | 1988-02-05 | 1989-06-27 | General Electric Company | Excimer laser patterning of a novel resist using masked and maskless process steps |
US4780177A (en) * | 1988-02-05 | 1988-10-25 | General Electric Company | Excimer laser patterning of a novel resist |
JPH02251959A (ja) * | 1989-03-27 | 1990-10-09 | Nippon Mektron Ltd | 立体回路露光用マスク |
US4985116A (en) * | 1990-02-23 | 1991-01-15 | Mint-Pac Technologies, Inc. | Three dimensional plating or etching process and masks therefor |
DE9107163U1 (de) * | 1991-06-11 | 1991-11-14 | Römer, Michael, Dr.rer.nat., 6080 Groß-Gerau | Fotomaske zur Herstellung von Leiterbahnen auf einer nicht ebenen drei-dimensional geformten Oberfläche |
-
1992
- 1992-06-26 US US07/904,948 patent/US5344729A/en not_active Expired - Lifetime
-
1993
- 1993-06-07 IL IL10592493A patent/IL105924A/en not_active IP Right Cessation
- 1993-06-14 EP EP19930109461 patent/EP0575849A3/en not_active Withdrawn
- 1993-06-25 JP JP15475893A patent/JPH06324476A/ja active Pending
- 1993-07-19 TW TW082105714A patent/TW218433B/zh active
Also Published As
Publication number | Publication date |
---|---|
IL105924A0 (en) | 1993-10-20 |
EP0575849A3 (en) | 1994-05-18 |
EP0575849A2 (en) | 1993-12-29 |
US5344729A (en) | 1994-09-06 |
JPH06324476A (ja) | 1994-11-25 |
TW218433B (ja) | 1994-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
RH1 | Patent not in force |