IE55621B1 - Light-weight support for electronic components - Google Patents

Light-weight support for electronic components

Info

Publication number
IE55621B1
IE55621B1 IE713/84A IE71384A IE55621B1 IE 55621 B1 IE55621 B1 IE 55621B1 IE 713/84 A IE713/84 A IE 713/84A IE 71384 A IE71384 A IE 71384A IE 55621 B1 IE55621 B1 IE 55621B1
Authority
IE
Ireland
Prior art keywords
support
light
electronic components
pack
sheets
Prior art date
Application number
IE713/84A
Other versions
IE840713L (en
Original Assignee
Imphy Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imphy Sa filed Critical Imphy Sa
Publication of IE840713L publication Critical patent/IE840713L/en
Publication of IE55621B1 publication Critical patent/IE55621B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

1. Light-weight support intende to received electronic components in leadless chipcarrier and formed from pack-rolled metal materials to adjust the coefficient of thermal expansion of the support to that the housings, characterized in that the support is composed of a corrugated metal sheet (12) fixed between two smooth sheets (10, 11), of which at least one receive the electronic components, and in that the two smooth sheets and the corrugated sheet are of pack-rolled metal materials. [EP0124428A1]

Description

The invention relates to a light-weight support for electronic components and, more particularly, for electronic components in a leadless aluminium housing.
The growth in number and in complexity of the functions required of electronics used leads to the grouping of an increasing number of electronic components on one and the same support. However, this trend exacerbates problems of size, reliability, heat dissipation and weight.
Although the widespread use of leadless housings has contributed to the reduction in size, it has given rise to problems with respect to the support. In fact, this support must have a coefficient of expansion adapted to that of the .housings since it is no longer possible to rely on the flexibility of the connection leads in order to compensate for differences in expansion. Moreover, the trend of increasing the number of housings imposes increasingly greater size and heat removal requirements on the support.
In order to make it possible to remove heat, it has been proposed, for example in the document FR-A-1,481,645, to produce the component support in the form of a hollow plate - 3 - equipped, on the inside, with a packing of fins and in which a coolant fluid circulates.
Aluminium supports are an excellent choice for adapting the coefficient of expansion to that of the housing, but when the 5 number of components used becomes too large, price and size limits are quickly encountered, in connection particularly with their fragility.
Supports formed by a board of pack-rolled metal materials are also known (for example, as the document "ELECTRONICS 10 INTERNATIONAL" vol. 54, no. 12, June 1981, page 46 describes). These boards consist, for example, of a layer of slightly dilatable metal, of the type sold under the brand name "INVAR”, surrounded by two layers of copper. If necessary, radiators with heat dissipation fins may be attached to one of 15 these copper layers. This solution eliminates the size problems whilst at the same time permitting a precise adaption of the coefficient of expansion and a good heat conductivity, but it presents a drawback, however, for the materials used. In fact, the thickness of the support necessary to obtain the 20 desired rigidity involves a fairly high weight per unit of surface, and this weight is further increased when it is necessary to attach a cooling radiator, as referred to in the document FR-A-2,511,193.
On the other hand, the densification of the materials used leads to as great a reduction as possible of the size of the radiators, often leading to the adaptation of forced convection cooling which involves the assembly of complex 5 exchanger devices.
In order to respond to these problems, the present invention proposes a support structure which is perfectly suited to cooling by means of forced convection whilst at the same time combining the desired conditions of dilatability, rigidity, 10 lightness and simplicity.
According to the invention there is provided a light-weight support intended to receive electronic components in a leadless housing and formed from pack-rolled metal materials to adjust the coefficient of thermal expansion of the support 15 to that of the housings, wherein the support is composed of a corrugated metal sheet fixed between two smooth sheets of which at least one receives the electronic components, and in that the two smooth sheets and the corrugated sheet are of pack-rolled metal materials.
The invention will be better understood with the aid of the following description referring to an embodiment which is given by way of example and by referring to the appended drawings which represent: 5 Figure 1. a diagrammatic perspective view of an electronic board comprising a support according to the invention; and Figure 2. a transverse sectional view on a larger scale 5 of the support of the electronic board.
Referring first of all to Figure 1, the electronic board consists of a support designated overall by the reference 1 and of electronic components 2.
The support 1 is formed from two smooth metal sheets 10 and 11 10 which surround a corrugated metal sheet 12 forming the core of the support 1. These three sheets (10-11-12) are assembled together by brazing or welding.
The corrugated sheet 12 therefore forms, between the two smooth sheets, channels 13 for the circulation of a cooling 15 fluid throughout the electronic board.
The electronic components 2 are formed by small aluminium housings 20 each containing a dice or chip 21, these housings being directly connected to one or to both faces (10-11) by means of connection points 4 of a very thin multilayer 20 insulating film 3.
The two smooth sheets (10-11) and the corrugated sheet 12 are each in pack-rolled metal materials, for example two layers of copper Cx - C2 surrounding a layer of "INVAR" C3. The ratios between the thicknesses of this pack-rolled assembly are chosen so that the resulting coefficient of expansion is in the neighbourhood of that of the aluminium housings 20 of the electric components 2. The thickness of the sheets (10-11-12) of the support 1 is generally chosen between 100 and 300 microns and is not necessarily the same for the three sheets. The gap between the two sheets (10-11) of the support 1 may be chosen around 2 mm.
This support structure, which is extremely simple to produce, ensures a very good heat removal by virtue of the good conductivity of the copper layers and the possibility of cooling by circulation of fluid in the corrugations. Moreover, with a light weight, it makes it possible to obtain good rigidity even for large sizes and also to attach the components on both faces of the support.
"INVAR" is a Trade Mark of Imphy S.A. and is an Ni alloy with a very low expansion coefficient.

Claims (1)

1. Light-weight support intended to receive electronic components in a leadless housing and formed from pack-rolled metal materials to adjust the coefficient of thermal expansion of the support to that of the housings, wherein the support is composed of a corrugated metal sheet fixed between two smooth sheets of which at least one receives the electronic components, and in that the two smooth sheets and the corrugated sheet are of pack-rolled metal materials. Light-wight support according to claim 1, wherein the ratios between the thicknesses of the pack-rolled metal materials of the sheets are set to obtain a resulting coefficient of expansion adjusted to that of the housings of the components. Light-weight support according to Claim 1 and 2, wherein the pack-rolled metal materials of the sheets are formed from a layer of "INVAR" (Trade Mark) surrounded by two layers of copper. A light-weight support substantially as hereinbefore described with reference to the drawings.
IE713/84A 1983-04-21 1984-03-23 Light-weight support for electronic components IE55621B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8306544A FR2544917B1 (en) 1983-04-21 1983-04-21 LIGHT SUPPORT FOR ELECTRONIC COMPONENTS

Publications (2)

Publication Number Publication Date
IE840713L IE840713L (en) 1984-10-21
IE55621B1 true IE55621B1 (en) 1990-11-21

Family

ID=9288078

Family Applications (1)

Application Number Title Priority Date Filing Date
IE713/84A IE55621B1 (en) 1983-04-21 1984-03-23 Light-weight support for electronic components

Country Status (7)

Country Link
EP (1) EP0124428B1 (en)
JP (1) JPS59201492A (en)
CA (1) CA1218739A (en)
DE (1) DE3474082D1 (en)
FR (1) FR2544917B1 (en)
IE (1) IE55621B1 (en)
IL (1) IL71393A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7417857B2 (en) * 2003-10-31 2008-08-26 Valeo Equipements Electriques Moteur Power-electronic-cooling device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201397U (en) * 1985-06-07 1986-12-17
JPH0423356Y2 (en) * 1986-12-12 1992-05-29
US4839227A (en) * 1987-03-12 1989-06-13 Minnesota Mining And Manufacturing Company Resilient electrically and thermally conductive flexible composite
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
US4871623A (en) * 1988-02-19 1989-10-03 Minnesota Mining And Manufacturing Company Sheet-member containing a plurality of elongated enclosed electrodeposited channels and method
US5070606A (en) * 1988-07-25 1991-12-10 Minnesota Mining And Manufacturing Company Method for producing a sheet member containing at least one enclosed channel
US5249358A (en) * 1992-04-28 1993-10-05 Minnesota Mining And Manufacturing Company Jet impingment plate and method of making
US5317805A (en) * 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
DE4334127C1 (en) * 1993-10-07 1995-03-23 Mtu Muenchen Gmbh Metal core circuit board for insertion into the housing of an electronic device
GB2324200A (en) * 1997-04-08 1998-10-14 Option Technologies Int Limite Strengthening and venting of multi-layer printed circuit boards
WO2002097881A2 (en) * 2001-05-30 2002-12-05 Ats Automation Tooling Systems Inc. Folded-fin heat sink assembly and method of manufacturing same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1481645A (en) * 1966-05-31 1967-05-19 Trane Co heat exchanger
FR2511193A1 (en) * 1981-08-07 1983-02-11 Thomson Csf Laminated support for cooling semiconductor - has three metal layers including one rigid layer to avoid bi-metallic bending with changing temp.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7417857B2 (en) * 2003-10-31 2008-08-26 Valeo Equipements Electriques Moteur Power-electronic-cooling device

Also Published As

Publication number Publication date
FR2544917B1 (en) 1986-09-26
EP0124428A1 (en) 1984-11-07
IL71393A (en) 1988-08-31
IL71393A0 (en) 1984-06-29
CA1218739A (en) 1987-03-03
FR2544917A1 (en) 1984-10-26
EP0124428B1 (en) 1988-09-14
JPS59201492A (en) 1984-11-15
DE3474082D1 (en) 1988-10-20
IE840713L (en) 1984-10-21

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MM4A Patent lapsed