IE840713L - Support for electronic components - Google Patents

Support for electronic components

Info

Publication number
IE840713L
IE840713L IE840713A IE71384A IE840713L IE 840713 L IE840713 L IE 840713L IE 840713 A IE840713 A IE 840713A IE 71384 A IE71384 A IE 71384A IE 840713 L IE840713 L IE 840713L
Authority
IE
Ireland
Prior art keywords
support
electronic components
pack
metal materials
corrugated
Prior art date
Application number
IE840713A
Other versions
IE55621B1 (en
Original Assignee
Imphy Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imphy Sa filed Critical Imphy Sa
Publication of IE840713L publication Critical patent/IE840713L/en
Publication of IE55621B1 publication Critical patent/IE55621B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

1. Light-weight support intende to received electronic components in leadless chipcarrier and formed from pack-rolled metal materials to adjust the coefficient of thermal expansion of the support to that the housings, characterized in that the support is composed of a corrugated metal sheet (12) fixed between two smooth sheets (10, 11), of which at least one receive the electronic components, and in that the two smooth sheets and the corrugated sheet are of pack-rolled metal materials. [EP0124428A1]
IE713/84A 1983-04-21 1984-03-23 Light-weight support for electronic components IE55621B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8306544A FR2544917B1 (en) 1983-04-21 1983-04-21 LIGHT SUPPORT FOR ELECTRONIC COMPONENTS

Publications (2)

Publication Number Publication Date
IE840713L true IE840713L (en) 1984-10-21
IE55621B1 IE55621B1 (en) 1990-11-21

Family

ID=9288078

Family Applications (1)

Application Number Title Priority Date Filing Date
IE713/84A IE55621B1 (en) 1983-04-21 1984-03-23 Light-weight support for electronic components

Country Status (7)

Country Link
EP (1) EP0124428B1 (en)
JP (1) JPS59201492A (en)
CA (1) CA1218739A (en)
DE (1) DE3474082D1 (en)
FR (1) FR2544917B1 (en)
IE (1) IE55621B1 (en)
IL (1) IL71393A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201397U (en) * 1985-06-07 1986-12-17
JPH0423356Y2 (en) * 1986-12-12 1992-05-29
US4839227A (en) * 1987-03-12 1989-06-13 Minnesota Mining And Manufacturing Company Resilient electrically and thermally conductive flexible composite
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
US4871623A (en) * 1988-02-19 1989-10-03 Minnesota Mining And Manufacturing Company Sheet-member containing a plurality of elongated enclosed electrodeposited channels and method
US5070606A (en) * 1988-07-25 1991-12-10 Minnesota Mining And Manufacturing Company Method for producing a sheet member containing at least one enclosed channel
US5249358A (en) * 1992-04-28 1993-10-05 Minnesota Mining And Manufacturing Company Jet impingment plate and method of making
US5317805A (en) * 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
DE4334127C1 (en) * 1993-10-07 1995-03-23 Mtu Muenchen Gmbh Metal core circuit board for insertion into the housing of an electronic device
GB2324200A (en) * 1997-04-08 1998-10-14 Option Technologies Int Limite Strengthening and venting of multi-layer printed circuit boards
US6854181B2 (en) 2001-05-30 2005-02-15 Tyco Electronics Canada Ltd. Folded-fin heat sink assembly and method of manufacturing same
FR2861894B1 (en) * 2003-10-31 2008-01-18 Valeo Equip Electr Moteur DEVICE FOR COOLING A POWER ELECTRONIC

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1481645A (en) * 1966-05-31 1967-05-19 Trane Co heat exchanger
FR2511193A1 (en) * 1981-08-07 1983-02-11 Thomson Csf Laminated support for cooling semiconductor - has three metal layers including one rigid layer to avoid bi-metallic bending with changing temp.

Also Published As

Publication number Publication date
DE3474082D1 (en) 1988-10-20
IL71393A (en) 1988-08-31
FR2544917A1 (en) 1984-10-26
IL71393A0 (en) 1984-06-29
CA1218739A (en) 1987-03-03
FR2544917B1 (en) 1986-09-26
IE55621B1 (en) 1990-11-21
JPS59201492A (en) 1984-11-15
EP0124428A1 (en) 1984-11-07
EP0124428B1 (en) 1988-09-14

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Legal Events

Date Code Title Description
MM4A Patent lapsed