IE48684B1 - A machine for soldering a connector to a printed circuit board - Google Patents
A machine for soldering a connector to a printed circuit boardInfo
- Publication number
- IE48684B1 IE48684B1 IE1697/79A IE169779A IE48684B1 IE 48684 B1 IE48684 B1 IE 48684B1 IE 1697/79 A IE1697/79 A IE 1697/79A IE 169779 A IE169779 A IE 169779A IE 48684 B1 IE48684 B1 IE 48684B1
- Authority
- IE
- Ireland
- Prior art keywords
- connector
- printed circuit
- circuit board
- soldering
- board
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 18
- 230000000712 assembly Effects 0.000 claims abstract description 11
- 238000000429 assembly Methods 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 2
- 238000013021 overheating Methods 0.000 abstract 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Molten Solder (AREA)
Abstract
A printed circuit board 1 has tabs tinned with solder and plugged into a connector 3. The machine includes means (8 to 16) for driving such plugged together assemblies past hot air nozzles 23, 24 for melting the tinned layer of solder and so soldering the board to the connector. There is a danger of damaging the connector, the board or components 2 on the board by over heating, particularly in places where there are no tabs to be soldered. This danger is mitigated by moving the nozzles away from the board in a plane perpendicular to the plane in which the board moves, except for moments when soldering is actually required. A sensor controls this movement and a jack 30 is used as a nozzle movement actuator.
Description
The present invention relates to a machine for soldering a plug on connector to a printed circuit board.
A connector is plugged on the circuit board and is soldered thereto by re-melting a thin layer of tin-lead alloy which has previously been deposited on tabs printed on the printed circuit board.
Machines for soldering connectors to printed circuit boards are already known. In this type of machine» the printed circuit board on which a connector has been plugged is placed in two streams of air supplied by two nozzles which move together along the edge of the printed circuit board at a constant spacing apart while the board ts held fixed.
Such machines have a disadvantage in that since the nozzles are spaced at a constant and fixed distance apart, there is a danger of heat damaging the corners of the connector or the electronic components disposed on the printed circuit board in the vicinity of the connector.
In reality, if this type of soldering machine is used, it is necessary to exclude components from a portion of printed circuit boards.
Preferred embodiments of the invention also provide a machine which allows a connector to be soldered on a printed circuit board without danger of damaging the connector or the components, even if the components are close to the connector or disposed on the edge of the printed circuit board on either side of the solder tabs.
The present invention provides a machine for soldering together an assembly comprising a printed circuit board and a connector plugged onto the board, the connector and the board having co-operating contact tabs and those of the board being tinned with a layer of solder, wherein the machine comprises means for conveying the printed circuit board and connector assembly through a heating unit
- 3 which includes two hot air nozzles, the hot air nozzles being mounted to move in a plane perpendicular to the direction of movement of the assembly between a first, soldering position in which the ends of the nozzles are sufficiently close to the tabs of passing assemblies, in operation, for the hot air to melt the layer of solder tinning, and a second, open position in which the ends of the nozzles are moved apart from each other and away from passing assemblies, the nozzles being moved between the said second and first positions by at least one jack controlled by a unit for detecting when a printed circuit board and connector assembly is in place ready for soldering.
An embodiment of the invention is described hereinbelow with reference to the accompanying drawing, in which:
- figure 1 is a perspective view of the main components of the machine; and
- figure 2 is a side view of part of the machine.
A machine in accordance with the invention is intended to receive assemblies comprising a printed circuit board (whether or not it is equipped with electronic components) and a connector plugged onto the printed circuit board. The printed circuit board has tabs tinned with a layer of solder; the connector has contacts which co-operate with the tabs.
Figure 1 shows a printed circuit board and connector assembly. The board 1 is equipped with its components such as 2 and is fitted to a connector 3.
Figure 2 shows contacts 4 of the connector 3.
The machine includes means for conveying the assemblies towards a heating unit for melting the solder on the tabs.
The figure shows two guide strips 6 and 7 along which the assembly to be soldered can be slid by pushing.
The assemblies are set side by side on the inlet guide strips and are pushed to the right, where a conveyor system conveys them towards the heating unit.
- 4 The conveyor system includes:
- a drive belt 8, guided by two rollers 9 and 10 and a guide strip 11, the roller 9 being made to rotate at an adjustable constant speed by an electric motor 12, and
- a free-running belt 13 guided by two idler rollers and 15 and a guide strip 16.
The speed of the motor is adjustable (e.g. by means of a potentiometer) so as to cause the belt 8 to move at a constant speed lying between 2 and 8 mm/sec.
The guide strip 16 is urged towards the guide strip by a spring 17 so as to provide sufficient friction between the base of the connector and the belts to drive the printed circuit board and connector assembly.
When the assemblies have been soldered, they are conveyed by two outlet guide strips 21 and 22, whence they are manually collected.
During its movement, the printed circuit board 1 presses against a push bar 20 whose height is adjustable, allowing the machine to be used on printed circuit boards of different lengths.
It is observed that during its movement, the printed circuit board and connector assembly is at a nonzero angle with respect to the vertical. If the printed circuit board were vertical, the weight of the components with which it is equipped would cause a tilting torque which would be detrimental to its balance. Further, to avoid any danger of tilting, the push bar 20 is not placed in the vertical plane which passes through the trajectory of the printed circuit board. The guide strips 6, 7, 11,
16, 21 and 22 are oriented accordingly.
Heating is provided by two nozzles 23 and 24 which have a common point of articulation 25. They are disposed in a plane perpendicular to the direction in which the assemblies are conveyed.
They receive air from a pipe 26. The air is heated by a resistance element 27 disposed round the pipe.
- 5 Air flow and temperature are regulated in a known way by means which are not shown.
The nozzles are moveable between an open position (see Figure 2, the nozzles 23' and 24' shown by dashed lines), and an adjustable soldering position against two adjustable stops 28 and 29 (see Figure 2, the nozzles 23 and 24 shown by continuous lines).
The nozzles are moved by a jack 30 which is operated by electric contacts, not shown, disposed on the path of the printed circuit board and connector assemblies, the electric contacts indicating respectively the arrival and the departure of a connector.
The air flow rate can be about 400 litres per minute at a temperature close to 300°C.
A hood referenced 40 covers the device; only the push bar 20 and the printed circuit board path are visible outside of the hood.
A machine as described has many advantages:
- printed circuit boards are handled (plugging in, loading on the machine, unloading from the machine) while other boards are being soldered.
Thus, the hourly soldering rate reaches, for example:
Two hundred 89-mm cards with 50 soldering points each; or
Eighty 222.5-mm cards with 98 soldering points each.
- Moving the nozzles eliminates the risk of heating the ends of the connector; there is no danger of damaging components which can therefore be placed anywhere on the whole surface of the printed circuit board except for a thin strip (e,g. 5 mm wide) around the tabs,
- Since the nozzles are moveable, they allow the air to be heated to a higher temperature than in known machines, while nevertheless reducing the heating power required.
- Printed circuit boards of any size (in practice, the width ranges from 89 to 267 mm) and all types of connectors (38 to 98 contacts) can be inserted in the machine without modifying it.
- The compressed air system of the factory can be used to operate the machine. In which case, low pressure is used for the heating air and medium pressure is used for the air of the jacks,
- The machine does not require any particular arrangement and can be mounted on a standard work bench. Ventilating means, not illustrated, allow the hot air to be driven out towards the back of the machine to ensure operator comfort.
Claims (4)
1. CLAIMS:1. A machine for soldering together an assembly comprising a printed circuit board and a connector plugged onto the board, the connector and the board having cooperating contact tabs and those of the board being tinned with a layer of solder, wherein the machine comprises means for conveying the printed circuit board and connector assembly through a heating unit which includes two hot air nozzles, the hot air nozzles being mounted to move in a plane perpendicular to the direction of movement of the assembly between a first, soldering position in which the ends of the nozzles are sufficiently close to the tabs of passing assemblies, in operation, for the hot air to melt the layer of solder tinning, and a second, open position in which the ends of the nozzles are moved apart from each other and away from passing assemblies, the nozzles being moved between the said second and first positions by at least one jack controlled by a unit for detecting when a printed circuit board and connector assembly is in place ready for soldering.
2. A machine according to claim 1, wherein the soldering position, the distance between each nozzle and the assembly to be soldered is adjustable by means of an adjustable stop.
3. A machine according to claim 1 or 2, wherein the conveying means include a driven belt and a free-running belt which co-operates by friction with a base of the connector of the assembly.
4. A machine according to claim 1 for soldering a printed circuit board to a connector, substantially as herein described with reference to and as illustrated in the accompanying drawing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7825748A FR2435884A1 (en) | 1978-09-07 | 1978-09-07 | WELDING MACHINE FOR A CONNECTOR TO A PRINTED CIRCUIT PLATE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE791697L IE791697L (en) | 1980-03-07 |
| IE48684B1 true IE48684B1 (en) | 1985-04-17 |
Family
ID=9212414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE1697/79A IE48684B1 (en) | 1978-09-07 | 1979-09-06 | A machine for soldering a connector to a printed circuit board |
Country Status (8)
| Country | Link |
|---|---|
| BE (1) | BE878382A (en) |
| DE (1) | DE2932932B2 (en) |
| FR (1) | FR2435884A1 (en) |
| GB (1) | GB2029750B (en) |
| IE (1) | IE48684B1 (en) |
| IT (1) | IT1121474B (en) |
| LU (1) | LU81646A1 (en) |
| NL (1) | NL7906597A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2475842A1 (en) * | 1980-02-08 | 1981-08-14 | Cit Alcatel | Soldering appts. for mounting components on printed circuit board - using streams of hot air to heat joints, and where board is rotated so it can be soldered on both sides |
| DE3006431C2 (en) * | 1980-02-21 | 1981-07-02 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Method for soldering connection pins arranged on carrier strips to circuit boards and immersion soldering bath for carrying out the method |
| GB2154921B (en) * | 1984-02-24 | 1988-06-08 | Pace Inc | Device for attaching modular electronic components to or removing them from an insulative substrate |
| JPS614870U (en) * | 1984-06-08 | 1986-01-13 | 千住金属工業株式会社 | reflow oven |
| DE3737457A1 (en) * | 1987-11-04 | 1989-05-18 | Peter Gammelin | SOLDERING DEVICE |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3474521A (en) * | 1967-04-26 | 1969-10-28 | Ibm | Bonding method |
| DE2258098A1 (en) * | 1972-11-27 | 1974-05-30 | Siemens Ag | DEVICE FOR SOLDERING AND REMOVING COMPONENTS ON EQUIPPED CIRCUIT BOARDS |
| GB1516317A (en) * | 1975-10-09 | 1978-07-05 | Pye Ltd | Soldering components |
-
1978
- 1978-09-07 FR FR7825748A patent/FR2435884A1/en active Granted
-
1979
- 1979-08-14 DE DE2932932A patent/DE2932932B2/en not_active Withdrawn
- 1979-08-20 GB GB7928966A patent/GB2029750B/en not_active Expired
- 1979-08-23 BE BE1/9500A patent/BE878382A/en not_active IP Right Cessation
- 1979-09-03 NL NL7906597A patent/NL7906597A/en not_active Application Discontinuation
- 1979-09-05 LU LU81646A patent/LU81646A1/en unknown
- 1979-09-06 IT IT68774/79A patent/IT1121474B/en active
- 1979-09-06 IE IE1697/79A patent/IE48684B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2029750B (en) | 1982-09-22 |
| BE878382A (en) | 1980-02-25 |
| DE2932932B2 (en) | 1980-07-03 |
| IE791697L (en) | 1980-03-07 |
| GB2029750A (en) | 1980-03-26 |
| FR2435884B1 (en) | 1981-11-06 |
| NL7906597A (en) | 1980-03-11 |
| LU81646A1 (en) | 1980-04-21 |
| DE2932932A1 (en) | 1980-03-20 |
| FR2435884A1 (en) | 1980-04-04 |
| IT7968774A0 (en) | 1979-09-06 |
| IT1121474B (en) | 1986-04-02 |
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