CN107225303B - Precise reflow welding machine - Google Patents

Abstract

in order to solve the problems that a reflow soldering furnace in the prior art is large in size, large in electric energy consumption and incapable of accurately controlling heating temperature, the invention provides a precise reflow soldering machine which comprises a plurality of reflow soldering boxes, a master control system, an electrified conveying mechanism and an idle return transmission mechanism; the precise reflow soldering machine provided by the invention adopts the single reflow soldering box to perform precise reflow soldering on the single circuit board, and the control of the heating process is more accurate. Its energy consumption is less and therefore more energy efficient. The management of the energy is more precise and reasonable compared with a rough reflow oven. A single reflow soldering box is started one by one in the application, the starting power is low, no impact is caused to a power supply system, the wiring cost of a factory is greatly reduced, when reflow soldering is carried out on circuit boards of the same number, the overall energy consumption is also obviously reduced, and a large amount of energy is saved.

Description

precise reflow welding machine

Technical Field

The present invention relates to a reflow soldering apparatus.

Background

As is well known, the fabrication of a circuit board includes the following steps: the circuit is printed on the substrate, the circuit is punched, and the circuit is fixed on the circuit board through a plug-in or surface mounting mode and then is welded. The circuit board welding method includes resistance welding, reflow welding, ultrasonic welding and the like.

The reflow soldering device is mainly specifically improved, and the conventional reflow soldering device is generally arranged behind a component plugging device (or a surface mounting device) and a soldering flux soaking device; after the components are positioned on the circuit board by a component plugging device (or a surface mounting device), the components are pre-fixed on the circuit board by a flux soaking device, wherein the flux soaking device contains a soft solder composition (such as cream solder), and the soft solder composition contains powder soft solder, a solvent and a welding flux. Finally, the welding is realized in a reflow soldering device.

a reflow soldering apparatus that is commonly used in the related art is a reflow soldering furnace, which generally includes a plurality of furnace bodies arranged in a straight line along a transport path from an input port (inlet) to an output port (outlet). The plurality of furnace bodies include at least a preheating section, a reflow soldering section, a cooling section, and the like according to their functions. The preheating section is a furnace body for preheating the circuit board, the reflow soldering section is a furnace body for melting the solder, and the cooling section is a furnace body for cooling the circuit board.

as described above, in the reflow furnace, the wiring board needs to be heated under a predetermined temperature condition. This temperature condition is referred to as a temperature profile. The temperature is controlled by adopting a sectional heating mode, so that the temperature cannot be accurately controlled, and meanwhile, temperature difference exists among furnace bodies of all sections, and the temperature change is also uncontrollable. For example, when a temperature difference of, for example, 80 ℃ is set between the furnace body located at the end point of the preheating section and the furnace body located at the start point of the reflow soldering section, the temperature of the region adjacent to the reflow soldering furnace becomes too high, and only a temperature difference of 40 ℃ is generated. As a result, a temperature profile having a desired slope of temperature change cannot be set. Meanwhile, the reflow oven is large in size, and a large amount of electric energy is consumed in the starting and using processes.

Disclosure of Invention

The invention provides a precise reflow soldering machine, aiming at solving the problems that a reflow soldering furnace in the prior art is large in size, large in electric energy consumption and incapable of accurately controlling heating temperature.

the invention provides a precise reflow soldering machine which comprises a plurality of reflow soldering boxes, a master control system, an electrified conveying mechanism and an idle return transmission mechanism, wherein the reflow soldering boxes are arranged in the front of the master control system;

The reflow soldering box comprises a box body, and a circuit board conveying device, a heating device, an electric control system, a power supply device and an air circulation device which are arranged in the box body;

The front end and the rear end of the box body are respectively provided with a channel opening for the circuit board to be transmitted in and out;

The power supply device provides electric energy for the heating device, the electric control system, the wind circulating device and the circuit board conveying device;

The heating device, the wind circulating device and the circuit board conveying device are all controlled by the electric control system;

the power supply device comprises a movable conductive mechanism arranged at the bottom of the box body, and the movable conductive mechanism comprises a plurality of conductive electrodes;

The electrified conveying mechanism comprises a conductive track electrically connected with a conductive electrode on the movable conductive mechanism and a conveying device for conveying the reflow soldering box from the starting end to the tail end;

The empty-return conveying mechanism is provided with a conveying device for conveying the reflow soldering box from the tail end of the electrified conveying mechanism back to the starting end of the electrified conveying mechanism;

the master control system is used for controlling the electrified conveying mechanism, the reflow soldering box and the empty-circuit transmission mechanism.

Furthermore, baffle plate mechanisms which can be opened and closed are respectively arranged at the opening of the channel at the front end and the rear end of the box body.

Furthermore, a bottom plate is arranged at the bottom of the reflow soldering box, conductive strips corresponding to the number of the conductive electrodes at the bottom of the reflow soldering box are arranged on the lower surface of the bottom plate, and the conductive strips are electrically connected with the conductive electrodes at the bottom of the reflow soldering box.

further, the master control system comprises a master control computer, an electric cabinet, a keyboard and a mouse; the master control computer comprises standard computer hardware such as a mainboard, a CPU, an internal memory, a hard disk and the like; the main board is provided with a special industrial control board card;

And electric control hardware comprising a power supply, an air switch, a relay, a motor driver and an electromagnetic valve is arranged in the electric cabinet.

Furthermore, the electronic control system of the reflow soldering box and the master control computer or the electronic control box of the master control system are correspondingly provided with communication modules for mutual communication.

furthermore, the electrified conveying mechanism is formed by connecting a plurality of conductive transmission modules in series; the idle return transmission mechanism is formed by connecting a plurality of idle return transmission modules in series.

Further, the number of the conductive transmission modules is the same as that of the idle return transmission modules; the idle return transmission module is arranged at the lower part of the conductive transmission module;

The single conductive transmission module and the single idle return transmission module are combined into a single transmitter, and a plurality of transmitters are connected in series from front to back to form a transmission system;

Meanwhile, the front end and the rear end of the transmission system are respectively provided with a lifting device.

further, the conductive transmission module comprises a protective cover, a conductive track and a first transmission device; the first conveying device is used for conveying the reflow soldering machine loaded with the circuit board; the conductive tracks are electrically connected with conductive electrodes on the reflow soldering box.

further, the air return transmission module comprises a rack and a second conveying device; the second conveying device is mounted on the rack.

Further, the lifting device comprises a housing, a slider guide rail mechanism and a third conveying device;

The sliding block guide rail mechanism and the third conveying device are both arranged in the outer cover; the sliding block guide rail mechanism comprises a lead screw guide rail and a sliding block which can be slidably arranged on the lead screw guide rail; the third conveying device is mounted on the sliding block.

The precise reflow soldering machine provided by the invention adopts the single reflow soldering box to perform precise reflow soldering on the single circuit board, the reflow soldering box has a relatively small structure, and adopts a heating mode of precisely heating the single circuit board according to the preset heating curve in the relatively small heating cavity, so that the control of the heating process is more accurate. Its energy consumption is less and therefore more energy efficient. Meanwhile, in the process of precise reflow soldering in the reflow soldering box, the whole reflow soldering box is transmitted from the previous procedure to the next procedure on the live transmission mechanism, and when the reflow soldering box finishes the reflow soldering action, the reflow soldering box is just transmitted to the next procedure, so that the reflow soldering effect is not influenced. The number of circuit boards subjected to reflow soldering is effectively controlled according to the number of the circuit boards required to be subjected to reflow soldering, and therefore the management of energy is more precise and reasonable compared with that of a rough reflow soldering furnace. The starting power of the integrated reflow soldering furnace in the prior art is generally about 70KW, the impact on a power supply system is large, the power of a single reflow soldering box is about 1.5KW, the reflow soldering furnace is started one by one in the using process, the starting power is small, the impact on the power supply system is avoided, the wiring cost of a factory is greatly reduced, when reflow soldering is carried out on circuit boards of the same number, the overall energy consumption is also obviously reduced, and a large amount of energy is saved.

Drawings

FIG. 1 is a perspective view of a precision reflow soldering apparatus provided in an embodiment of the present invention;

FIG. 2 is a schematic front view of a precision reflow soldering apparatus provided in an embodiment of the present invention;

FIG. 3 is a schematic perspective view of a lift device provided in an embodiment of the present invention;

FIG. 4 is a schematic perspective view of a conveyor provided in an embodiment of the present invention;

FIG. 5 is a schematic perspective view of a reflow oven provided in accordance with an embodiment of the present invention;

FIG. 6 is a schematic side view of a reflow oven provided in accordance with an embodiment of the present invention;

FIG. 7 is a schematic bottom view of a reflow oven provided in accordance with an embodiment of the present invention;

FIG. 8 is a schematic front view of a reflow oven provided in accordance with an embodiment of the present invention;

FIG. 9 is a schematic sectional view taken along line A-A in FIG. 8;

FIG. 10 is a schematic view of the interior of a reflow oven provided in accordance with an embodiment of the present invention with the upper portion of the enclosure removed;

FIG. 11 is a perspective view of a circuit board conveyor according to an embodiment of the present invention;

FIG. 12 is a schematic perspective view of a reflow oven in accordance with a further refinement of the present invention;

Fig. 13 is a schematic perspective view of a conveyor provided in an embodiment of the invention with a protective cover removed.

100, a reflow soldering box; 200. a master control system; 300. a conductive transmission module; 400. a null return transmission module; 500. a lifting device; 101. a base plate; 102. a conductive strip; 201. an electric cabinet; 301. a protective cover; 302. a conductive track; 303. a first conveying device; 304. a conductive pulley; 401. a frame; 402. a second conveying device; 403. a pulley; 501. a housing; 502. a slider guide rail mechanism; 503. a third conveying device; 504. a second pallet; 1. a box body; 2. a channel opening; 3. a baffle mechanism; 4. a fan; 5. a conductive rail; 6. an electronic control system; 7. a heating device; 8. a circuit board transfer device; 9. a circuit board; 10. heating the cavity; 11. an electrically controlled isolation chamber; 81. a drive shaft; 82. a drive chain; 83. and (5) clamping a strip plate.

Detailed Description

in order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example 1

the precise reflow soldering machine disclosed by the embodiment comprises a plurality of reflow soldering boxes 100, a master control system 200, a live transmission mechanism and an idle return transmission mechanism, as shown in fig. 1 and 2;

The reflow soldering box is explained in detail below, and as shown in fig. 5 to 11, the reflow soldering box 100 includes a box body 1, and a circuit board conveying device 8, a heating device 7, an electric control system 6, a power supply device and a wind circulation device which are arranged in the box body 1;

the front end and the rear end of the box body 1 are respectively provided with a channel opening 2 for the circuit board 9 to be transmitted in and out;

The power supply device provides circuits for the heating device 7, the electric control system 6, the wind circulating device and the circuit board conveying device 8;

The heating device 7, the wind circulating device and the circuit board conveying device 8 are all controlled by the electric control system 6.

In this example, as shown in fig. 5, 6, 8, and 9, the case 1 is non-enclosed, and has a rectangular parallelepiped shape including 4 side surfaces (or front and rear end surfaces and left and right side surfaces), a top surface, and a bottom surface; the channel opening 2 at the front end is a circuit board input port, and the channel opening 2 at the rear end is a circuit board output port. The circuit board 9 having completed the previous process (the flux is applied by the flux-dipping device) is conveyed to the circuit board input port by the inter-device conveying device, and is fed into the housing 1 through the circuit board input port. When the circuit board 9 is in the box 1, it can be conveyed backwards by the circuit board conveying device 8 in the box 1, and finally is delivered out through the circuit board outlet and sent to the next process (the quality detection is carried out by the detection device).

As shown in fig. 9, a heating cavity 10 and an electrically controlled isolation cavity 11 are arranged in the box body 1; the electric control system 6 is arranged in the electric control isolation cavity 11, and the heating device 7 is arranged in the heating cavity 10; so set up, it can be effectual with heating device 7 and electrical system 6 isolation, prevents that the high temperature that heating device 7 produced from having an influence to electrical system 6.

The wind circulation device is used to make the air in the heating cavity 10 flow so that the temperature of each position in the heating cavity 10 tends to be average. In this example, the air circulation device comprises a fan 4 and an air duct, wherein the fan 4 is mounted on the box body 1 and is communicated with the heating cavity 10 through the air duct. Specifically, the fan 4 may be installed at an end surface, a side surface, a top surface, or a bottom surface of the case 1. In this example, as shown in fig. 1, 2, and 5, the fan 4 is attached to the left side surface of the casing 1.

As shown in fig. 9, the heating device 7 may adopt various structures known to those skilled in the art, such as an infrared heating tube heater, a PTC heater, a resistance heater, or a semiconductor heater. In this embodiment, as shown in fig. 10, the heating device 7 is an infrared heating tube heater, which is matched with an air circulation system to achieve a good reflow soldering effect. The heating device 7 is fixed in the box body through a fixing structure, the electric control system controls the infrared heating tube heater to work, and the infrared heating tube heater can be arranged in various modes such as above the circuit board, below the circuit board 9, above and below the circuit board 9, and the like, so that the heating effect is ensured.

As shown in fig. 9, a circuit board transfer device 8 is mounted in the lower portion of the inside of the casing 1, and it is possible to adopt various structures known to those skilled in the art, by which the circuit board transfer device 8 is used to transfer a circuit board 9 or a board jig (on which the circuit board 9 is placed). Specifically, as shown in fig. 11, the circuit board conveying device includes a motor (not shown), a transmission shaft 81, a transmission chain 82 (or a high temperature resistant transmission belt may be used for replacement), and a belt plate clamp 83, where the transmission chain 82 is respectively disposed on the left and right sides of the transmission shaft 81, the transmission shaft 81 is driven by the motor, the transmission chain 82 is driven by the transmission shaft 81, the belt plate clamp 83 is lapped on the two transmission chains 82, the circuit board 9 is disposed on the belt plate clamp 83, and the belt plate clamp 83 is driven by the transmission chain 82, so as to realize the conveying of the circuit board 9.

as shown in fig. 8, the electronic control system 6 is embodied as an electronic control board. The device is used for controlling the action of each electric device, and the electric control board is provided with a microprocessor, an inverter, a communication module, a temperature detection control module, a data storage module and the like, in the embodiment, as an optimal mode, device parameters such as a temperature curve, a running speed and the like are transmitted to the electric control board by a main control system through the communication module (a wireless communication module or a wired communication module), so that the accurate control of a backflow process is realized, wherein the device is mainly used for controlling the heating device 7 to work, so that the heating device heats the circuit board 9 according to a preset temperature curve. Meanwhile, the air quantity control device controls the opening and closing of the fan 4 and can also control the air quantity of the fan 4 if needed. At the same time it also controls the board transport means 8 so that it controls the board transport means 8 to activate to transport the boards 9 if necessary.

As shown in fig. 5-9, the front end and the rear end of the box body 1 are provided with a baffle mechanism 3 at the channel opening 2. The shutter mechanism 3 can close or open the passage opening 2 to provide a closed heating environment. The shutter mechanism 3 is also controlled by the electronic control system 6 to achieve its automatic opening or closing.

the power supply device is a device communicated with an external alternating current power supply, and can adopt various structures known to those skilled in the art, in this example, the power supply device comprises a movable conductive mechanism arranged at the bottom of the box body 1, the movable conductive mechanism comprises conductive electrodes serving as a positive connecting end, a negative connecting end and a grounding end, and the conductive electrodes are conductive guide rails or conductive guide grooves. Thus, the reflow soldering chamber 100 of the present disclosure may be mounted on a live transport mechanism having a corresponding conductive track, which includes a conductive guide (when the movable conductive mechanism is a conductive guide) or a conductive guide (when the movable conductive mechanism is a conductive guide), so that the reflow soldering chamber 100 can move on the live transport mechanism, and the live transport mechanism also provides power to the reflow soldering chamber 100. In this example, as shown in fig. 6 to 11, the moving conductive mechanism is 3 conductive rails 5 installed on the bottom of the case 1. The specific structure of the above-described charging transport mechanism will be described later in detail.

in order to prevent energy loss, a heat insulating layer is provided in the tank 1 in this example.

In the using process, if the electronic control system 6 can only perform local control, parameters and the like need to be written again when reflow soldering is performed on different circuit boards 9, and the process is complicated, so that as an improvement, the communication module on the electronic control system 6 adopts a wireless communication module. The operator can carry out wireless communication through the wireless communication module, write parameters and the like in a wireless mode. The operation is simpler.

the reflow soldering chamber 100 disclosed in this embodiment has a relatively small structure, and adopts a heating method for precisely heating a single circuit board 9 according to a predetermined heating curve in a relatively small heating cavity 10, so that the heating process can be controlled more accurately. At the same time, its energy consumption is smaller and therefore more energy-efficient.

The single reflow oven 100 may be used alone or placed on a live conveyor for transport and power and then returned through a dry return conveyor. The master control system 200 may control the heating of each reflow oven 100 and may also control the tape transport mechanism and the empty return transport mechanism. The live transport mechanism, lost motion transport mechanism, and master control system 200 are explained in detail below.

specifically, the electrified conveying mechanism comprises a conductive track electrically connected with a conductive electrode on the movable conductive mechanism and a conveying device for conveying the reflow soldering box from a starting end to a tail end;

The start end refers to an end of the live transfer mechanism where the reflow soldering box with the circuit board enters during operation, and the end refers to a reflow soldering box 100 with the circuit board 9 to transfer the circuit board 9 to the next process, and transfers the reflow soldering box 100 without load (without the circuit board 9) to an end of the idle transfer device.

the idle return transmission mechanism is provided with a transmission device for transmitting the reflow soldering box 100 from the tail end of the electrified transmission mechanism back to the starting end of the electrified transmission mechanism;

The main control system 200 is used for controlling the live transmission mechanism, the reflow soldering box 100 and the idle return mechanism.

Specifically, the master control system 200 includes a master control computer, an electric cabinet 201, a keyboard and a mouse; the main control computer comprises standard computer hardware such as a mainboard, a CPU, a memory, a hard disk and the like, meanwhile, the mainboard is provided with an industrial control special board card (a motion control card, an image acquisition card, a data acquisition card and the like), and main control software is also arranged on the main control computer; the electric cabinet comprises electric control hardware such as a power supply, an air switch, a relay, a motor driver and an electromagnetic valve, a main control program drives the electric control hardware in the electric cabinet 201 through a board card, and the electric control hardware controls an execution element (a motor, an air cylinder and the like) to complete actions. And the peripheral devices such as a display, a keyboard, a mouse and the like are convenient to operate and adjust parameters.

Correspondingly, a communication module, in this example, a wireless communication module, is arranged on the main control computer or the electric control box of the main control system, and the wireless communication module performs wireless communication with the wireless communication module on the electric control system of the reflow soldering box to transmit the above-mentioned equipment parameters, such as the temperature curve, the operating speed and the like, to the reflow soldering box.

The specific structure of the live transmission mechanism is not particularly limited, as long as it can transmit the reflow soldering box 100 with the circuit board 9 inside through the transmission device, and electrically connect with the conductive electrode on the movable conductive mechanism on the reflow soldering box 100 through the conductive track thereon. So, can realize carrying out accurate reflow soldering operation in the reflow soldering box 100, simultaneously, when carrying out this accurate reflow soldering, will have reflow soldering box 100 of circuit board 9 to in time give the entrance of next process through electrified transport mechanism, then convey next process with circuit board 9 to send empty reflow soldering box 100 to empty transport mechanism that returns.

Specifically, as shown in fig. 12, as an improvement, this example discloses a reflow soldering chamber 100 with further improvement, the bottom of the reflow soldering chamber 100 is further provided with a bottom plate 101, the lower surface of the bottom plate 101 is provided with conductive strips 102 corresponding to the number of conductive electrodes at the bottom of the reflow soldering chamber 100, and the conductive strips 102 are electrically connected with the conductive electrodes at the bottom of the reflow soldering chamber 100; by using the bottom plate 101, the influence of the reflow soldering chamber 100 on the live transmission mechanism can be further isolated, and at the same time, the reflow soldering chamber is electrically connected with the conductive tracks on the live transmission mechanism through the conductive strips 102, so as to serve as an intermediate component for transmitting electric energy to the conductive electrodes at the bottom of the reflow soldering chamber 100 through the conductive strips 102. The base plate 101 is made of an insulating material.

however, the specific structure of the empty reflow soldering box transfer mechanism is not particularly limited as long as it can transfer the empty reflow soldering box 100 from the end to the beginning of the above-mentioned live transfer mechanism.

The live transmission mechanism and the idle return transmission mechanism can be of an integral structure or a split structure, the split structure is formed by combining a plurality of modules, and the integral structure is formed in a single integral mode. Due to the relatively large volume of the above-described structure. The live transmission mechanism and the idle return transmission mechanism are designed into a split structure, so that the live transmission mechanism and the idle return transmission mechanism are easier to transport and install. In this example, the above-mentioned electrified transmission mechanism and the idle return transmission mechanism are of a split type. Specifically, as shown in fig. 1 and 2, the live transmission mechanism is formed by connecting a plurality of conductive transmission modules 300 in series; the idle return transmission mechanism is formed by connecting a plurality of idle return transmission modules 400 in series.

in this embodiment, the space positions of the conductive transmission modules 300 and the space positions of the space transmission modules 400 are not particularly limited, for example, the conductive transmission modules may be horizontally arranged and connected end to form a square pattern. It is also possible to arrange them up and down, for example, to place the above-described conductive transfer module 300 on the upper portion and the return-to-empty transfer module 400 on the lower portion; and vice versa. Only then need set up elevating gear 500 at the head and the tail of its conductive transmission mechanism and idle return transmission mechanism.

for example, as shown in fig. 1 and fig. 2, in this example, a manner of disposing the conductive transmission modules 300 and the idle-return transmission modules 400 one above the other is adopted, and the number of the conductive transmission modules 300 and the number of the idle-return transmission modules 400 are the same; the idle-return transmission module 400 is arranged at the lower part of the conductive transmission module 300;

and as a further improvement, a single conductive transmission module 300 and a single idle-return transmission module 400 are combined into a single transmitter in the present example, and a plurality of transmitters are connected in series to form a transmission system.

Meanwhile, the front end and the rear end of the transmission system are respectively provided with a lifting device 500.

The above-mentioned conveyor is shown in fig. 4 and fig. 13. Specifically, the conductive transmission module 300 includes a shield 301, a conductive track 302, and a transfer device (for distinction, the transfer device is referred to herein as a first transfer device 303); the first conveying device 303 is used for conveying the reflow soldering machine 100 loaded with the circuit board 9; the conductive tracks 302 are electrically connected to conductive electrodes on the reflow soldering chamber 1. in this example, the conductive tracks 302 are actually electrically connected to conductive strips 102 on the bottom plate 101 of the reflow soldering chamber 100. The first transfer device 303 in this example is basically the same as the above-mentioned board transfer device 8, except that the reflow soldering box 100 is the object of transfer, and the board 9 is transferred by the board transfer device 8. Of course, other various conveying devices known in the art may be used, and will not be described in detail.

in this embodiment, as shown in fig. 13, in order to make the reflow soldering box 100 slide on the conductive tracks 302 more smoothly, the conductive pulleys 304 are disposed on the conductive tracks 302, so that the sliding friction can be changed into rolling friction, the friction resistance between the conductive strips 102 and the conductive tracks 303 on the bottom plate 101 of the reflow soldering box 100 is smaller, and the reflow soldering box 100 slides more smoothly. At the same time, the conductive pulley 304 is also in electrical connection with the conductive track 302. Since the conductive track 302 is provided with a high voltage, the shield 301 is necessary for safety.

The lost motion module 400 includes a frame 401 and a conveyor (for the sake of distinction, the conveyor is referred to herein as a second conveyor 402); the second conveyor 402 is mounted on the frame 401. The bottom of the frame 401 is also provided with a pulley 403, and the movement of the conveyor is facilitated by the arrangement of the pulley 403. The second conveyor 402 may be used in substantially the same manner as the circuit board conveyor 8 disclosed above, except that the reflow oven 100 is the object of conveyance, and the circuit board 9 is conveyed by the circuit board conveyor 8. Of course, other conveying devices known in the art may be used, for example, in this case, the second conveying device 303 includes rollers driven by a motor to rotate the rollers to slide the reflow soldering chamber 100 thereon. And will not be described in detail.

As shown in fig. 3, the lifting device 500 includes a housing 501, a slider guide mechanism 502, and a conveyor (referred to herein as a third conveyor 503 for the sake of distinction); the slide guide mechanism 502 and the third conveyor 503 are both mounted in the housing 501; the slide block guide rail mechanism 502 comprises a lead screw guide rail and a slide block which can be slidably arranged on the lead screw guide rail; the third conveyor 503 is mounted on the slide. The third transfer device 503 is substantially the same as the circuit board transfer device 8 disclosed above, except that the reflow soldering box 100 is the object to be transferred, and the circuit board 9 is transferred by the circuit board transfer device 8. Of course, other various conveying devices known in the art may be used, and will not be described in detail.

The third conveyor 503 is mounted on the slides of the slide guide mechanism 502 such that the third conveyor 503 moves up and down the reflow soldering box 100 with the third conveyor 503 by the slide guide mechanism 502, lowers the empty reflow soldering box 100 from the end of the live conveyance mechanism to the empty conveyance mechanism, and raises the empty reflow soldering box 100 conveyed by the empty conveyance mechanism to the start end of the live conveyance mechanism again.

Of course, the lifting device 500 may also adopt other manners known to those skilled in the art to implement the lifting function thereof, and will not be described in detail.

The operation of the precision reflow soldering machine disclosed in this example is described as follows: the circuit board 9 that accomplishes the preceding process (coating the scaling powder through soaking the scaling powder device) conveys the circuit board input port department of reflow soldering box 100 front end, the baffle mechanism 3 of front end is opened, circuit board 9 is sent into in the box 1 through the circuit board input port, circuit board conveyer 8 in the box 1 sends circuit board 9 to the middle part of heating cavity 10, electrical system 6 control heating device 7 heats according to the temperature curve of predetermineeing, and simultaneously, fan 4 starts, the air thermally equivalent in the drive heating cavity 10, after accomplishing the heating according to the temperature curve of predetermineeing, the baffle mechanism 3 of rear end opens, circuit board conveyer 8 spreads circuit board 9 out the circuit board delivery outlet, send circuit board 9 into next process (detection device carries out the quality testing). Meanwhile, the reflow soldering box in this example, on which the wiring board 9 is placed, is transported on the above-mentioned belt conveying mechanism, and is conveyed to the next process by the belt conveying mechanism. And the live feed mechanism provides power to the reflow oven 100 during movement of the reflow oven 100. Then, after the circuit board 9 is sent to the next process, the unloaded reflow soldering box 100 is lowered onto the empty-circuit conveying mechanism at the lower part through the lifting device 500 at the tail end of the circuit board, and is conveyed onto the lifting device 500 at the starting end through the empty-circuit conveying mechanism, and the unloaded reflow soldering box 100 is lifted and conveyed to the starting end of the electrified conveying mechanism through the lifting device 500 at the starting end, so that the circulation is performed.

The precise reflow soldering machine provided by the invention adopts the single reflow soldering box 100 to perform precise reflow soldering on the single circuit board 9, the reflow soldering box 100 has a relatively small structure, and adopts a heating mode of precisely heating the single circuit board 9 according to a preset heating curve in a relatively small heating cavity, so that the control of the heating process is more accurate. Its energy consumption is less and therefore more energy efficient. Meanwhile, in the process of precise reflow soldering in the reflow soldering box 100, the whole reflow soldering box 100 is transmitted from the previous procedure to the next procedure on the live transmission mechanism, and when the reflow soldering box 100 finishes the reflow soldering action, the reflow soldering box 100 is just transmitted to the next procedure, so that the reflow soldering effect is not influenced. The number of the circuit boards 9 which need to be subjected to reflow soldering is effectively controlled, and the input number of the reflow soldering boxes 100 is effectively controlled, so that the management of the energy is more precise and reasonable compared with the rough reflow soldering furnace. The start-up power of the integral reflow soldering furnace among the prior art is generally about 70KW, and it is very big to strike power supply system, and the power of single reflow soldering box 100 is about 1.5KW in this application, in the use, starts one by one, and start-up power is little, does not have the impact to power supply system, greatly reduces the wiring cost of mill, when carrying out reflow soldering to circuit board 9 of same quantity, and its holistic energy consumption also obviously reduces, has saved a large amount of energy.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. a precise reflow soldering machine is characterized by comprising a plurality of reflow soldering boxes, a master control system, an electrified conveying mechanism and an idle return transmission mechanism;

the reflow soldering box comprises a box body, and a circuit board conveying device, a heating device, an electric control system, a power supply device and an air circulation device which are arranged in the box body;

the front end and the rear end of the box body are respectively provided with a channel opening for the circuit board to be transmitted in and out;

The power supply device provides electric energy for the heating device, the electric control system, the wind circulating device and the circuit board conveying device;

The heating device, the wind circulating device and the circuit board conveying device are all controlled by the electric control system;

The power supply device comprises a movable conductive mechanism arranged at the bottom of the box body, and the movable conductive mechanism comprises a plurality of conductive electrodes;

the electrified conveying mechanism comprises a conductive track electrically connected with a conductive electrode on the movable conductive mechanism and a conveying device for conveying the reflow soldering box from the starting end to the tail end;

The empty-return conveying mechanism is provided with a conveying device for conveying the reflow soldering box from the tail end of the electrified conveying mechanism back to the starting end of the electrified conveying mechanism;

The master control system is used for controlling the electrified conveying mechanism, the reflow soldering box and the empty-circuit transmission mechanism.

2. The precision reflow soldering machine according to claim 1, wherein the channel openings at the front end and the rear end of the box body are respectively provided with a baffle mechanism capable of being opened and closed.

3. The precision reflow soldering machine according to claim 1, wherein the bottom of the reflow soldering chamber is provided with a bottom plate, the bottom surface of the bottom plate is provided with conductive strips corresponding to the number of conductive electrodes at the bottom of the reflow soldering chamber, and the conductive strips are electrically connected with the conductive electrodes at the bottom of the reflow soldering chamber.

4. the precision reflow soldering machine of claim 1, wherein the master control system comprises a master control computer, an electric cabinet, a display, a keyboard and a mouse;

The master control computer comprises standard computer hardware including a mainboard, a CPU, an internal memory and a hard disk; the main board is provided with a special industrial control board card;

And electric control hardware comprising a power supply, an air switch, a relay, a motor driver and an electromagnetic valve is arranged in the electric cabinet.

5. The precise reflow soldering machine of claim 4, wherein the electronic control system of the reflow soldering box and the main control computer of the main control system or the electronic control box are correspondingly provided with communication modules for mutual communication.

6. The precision reflow soldering machine of claim 1, wherein the live transmission mechanism is composed of a plurality of conductive transmission modules connected in series;

the idle return transmission mechanism is formed by connecting a plurality of idle return transmission modules in series.

7. the precision reflow soldering machine of claim 6, wherein the number of the conductive transmission modules and the number of the idle return transmission modules are the same; the idle return transmission module is arranged at the lower part of the conductive transmission module;

the single conductive transmission module and the single idle return transmission module are combined into a single transmitter, and a plurality of transmitters are connected in series from front to back to form a transmission system;

meanwhile, the front end and the rear end of the transmission system are respectively provided with a lifting device.

8. The precision reflow soldering machine of claim 7, wherein the conductive transmission module comprises a shield, a conductive track and a first transmission device; the first conveying device is used for conveying the reflow soldering machine loaded with the circuit board; the conductive tracks are electrically connected with conductive electrodes on the reflow soldering box.

9. the precision reflow soldering machine of claim 8, wherein the lost motion transfer module comprises a rack and a second conveyor;

The second conveying device is mounted on the rack.

10. the precision reflow soldering machine of claim 8, wherein the lifting device comprises a housing, a slider rail mechanism and a third conveyor;

The sliding block guide rail mechanism and the third conveying device are both arranged in the outer cover; the sliding block guide rail mechanism comprises a lead screw guide rail and a sliding block which can be slidably arranged on the lead screw guide rail; the third conveying device is mounted on the sliding block.