CN218336626U - Reflow soldering device for SMT - Google Patents
Reflow soldering device for SMT Download PDFInfo
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- CN218336626U CN218336626U CN202222395503.6U CN202222395503U CN218336626U CN 218336626 U CN218336626 U CN 218336626U CN 202222395503 U CN202222395503 U CN 202222395503U CN 218336626 U CN218336626 U CN 218336626U
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- reflow soldering
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Abstract
The utility model belongs to the technical field of circuit board processing equipment technique and specifically relates to a reflow soldering device for SMT, including the reflow soldering machine main part, reflow soldering machine main part top one end fixedly connected with control module, the inside mounting groove of having seted up of reflow soldering machine main part, the inside conveyer belt that is provided with of mounting groove, the one end that the reflow soldering machine main part is close to control module is provided with two slide rails, two the inside equal sliding connection of slide rail has the slider, the inside mounting hole of having seted up of slider. The utility model discloses in, through the control module, laser rangefinder module and the heating element who sets up, according to the size of different circuit boards, can adjust through opening and close of control module to a plurality of heating element on the preheating plate automatically for the heating range that the heating element bottom covered is greater than the area of circuit board just, thereby has improved heating element's heating efficiency greatly, has reduced energy loss and manufacturing cost simultaneously.
Description
Technical Field
The utility model relates to a circuit board processing equipment technical field specifically is a reflow soldering device for SMT.
Background
Reflow soldering machines, also known as reflow soldering machines or "reflow ovens," are devices that reliably join surface mount components and PCB pads together through solder paste alloys by providing a heated environment that melts the solder paste. Reflow soldering is a soldering technique developed with the advent of miniaturized electronic products, and is mainly applied to soldering of various surface-mounted components.
In SMT production line, reflow soldering equipment is indispensable part, and traditional reflow soldering equipment circuit board all need pass through preheating plate's preheating when using, and present current reflow soldering preheating plate when using, its size rigidity, and the flexibility is relatively poor, when preheating to not unidimensional circuit board, and the efficiency of preheating is not high, and the energy loss is great, and the utilization ratio is lower, is unfavorable for the user to use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a reflow soldering device for SMT to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a reflow soldering device for SMT comprises a reflow soldering machine main body, wherein a control module is fixedly connected to one end of the top of the reflow soldering machine main body, a mounting groove is formed in the reflow soldering machine main body, a conveying belt is arranged in the mounting groove, two sliding rails are arranged at one end, close to the control module, of the reflow soldering machine main body, sliding blocks are connected to the insides of the two sliding rails in a sliding mode, and mounting holes are formed in the sliding blocks;
the sensing assembly is arranged at one end, close to the control module, of the inner wall of the mounting groove and comprises a fixing frame, a protection box is fixedly connected to the top of the fixing frame, and a laser ranging module is arranged inside the protection box;
the one end that mounting groove inner wall is close to induction component is provided with preheats the subassembly, it includes two mounting brackets, two the spout has all been seted up to one side that the mounting bracket is close to each other, two keep away from control module's mounting bracket bottom fixedly connected with motor in the mounting bracket, motor drive shaft runs through corresponding spout and the two-way threaded rod of fixedly connected with, two-way threaded rod both ends respectively threaded connection have first preheating plate and second preheating plate, first preheating plate and second preheat the equal fixedly connected with a plurality of heating element in one side that the plate is close to each other.
Preferably, the two sides of the outer wall of the fixing frame are respectively fixed with the two sides of the inner wall of the mounting groove through bolts, and the fixing frame is positioned at the top of the conveying belt, so that the size of a workpiece on the conveying belt passing through the bottom of the fixing frame can be conveniently measured.
Preferably, the laser rangefinder module is provided with a plurality of, and a plurality of laser rangefinder module evenly distributed is in the guard box, is convenient for measure the size of different circuit boards, and its measuring range is wider, and application scope is bigger.
Preferably, two the equal fixedly connected with L template in one side that the mounting bracket was kept away from each other, the L template passes through bolt and mounting groove inner wall fixed connection, is convenient for install preheating component.
Preferably, control module and laser rangefinder module electric connection, control module includes analysis module and signal transceiver module, measures the outer size of circuit board through the laser rangefinder module, and the heating element that the equipment self-adaptation of being convenient for starts corresponding quantity plays the effect of energy saving.
Preferably, a plurality of heating element all with control module electric connection, motor and control module electric connection, the user of being convenient for is according to the thickness of different strip welding circuit boards, the automatic distance of adjusting between heating element and the circuit board to be convenient for preheat the circuit board better.
Preferably, the slider passes through bolt and slide rail fixed connection, the inside locating hole of seting up a plurality of and bolt and corresponding of slide rail, the user of being convenient for according to the equipment height with reflow soldering cooperation use, nimble adjusting slider's position to be convenient for the equipment of reassembling after better realization equipment dismantlement.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, through the control module, laser rangefinder module and the heating element who sets up, according to the size of different circuit boards, can adjust through opening and close of control module to a plurality of heating element on the preheating plate automatically for the heating range that the heating element bottom covered is greater than the area of circuit board just, thereby has improved heating element's heating efficiency greatly, has reduced energy loss and manufacturing cost simultaneously.
2. The utility model discloses in, through the laser rangefinder module that sets up, be convenient for drive two-way threaded rod through the motor and rotate according to different circuit board thicknesses to it changes thereupon and treats the distance between the processing circuit board to drive first, two preheating plates, thereby is convenient for better preheat the circuit board.
Drawings
Fig. 1 is a perspective view of a reflow soldering apparatus for SMT according to the present invention;
fig. 2 is a schematic structural diagram of an induction assembly of a reflow soldering apparatus for SMT according to the present invention;
FIG. 3 is a schematic structural diagram of a preheating assembly of a reflow soldering apparatus for SMT according to the present invention;
fig. 4 is an enlarged view of a point a in fig. 1.
In the figure: 1. a reflow soldering machine body; 2. a control module; 3. mounting grooves; 4. a conveyor belt; 5. a fixed mount; 6. a protection box; 7. a laser ranging module; 8. a mounting frame; 9. an L-shaped plate; 10. a chute; 11. a motor; 12. a bidirectional threaded rod; 13. a first preheating plate; 14. a second preheating plate; 15. a heating element; 16. a slide rail; 17. a slider; 18. and (7) installing holes.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person skilled in the art without creative work belong to the scope of protection of the present invention based on the embodiments of the present invention.
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-4, the present invention provides a technical solution:
in this embodiment, please refer to fig. 1 and fig. 4, a reflow soldering device for SMT, including reflow soldering machine main part 1, 1 top one end fixedly connected with control module 2 of reflow soldering machine main part, mounting groove 3 has been seted up to reflow soldering machine main part 1 inside, 3 inside conveyer belts 4 that are provided with of mounting groove, one end that reflow soldering machine main part 1 is close to control module 2 is provided with two slide rails 16, the inside equal sliding connection of two slide rails 16 has slider 17, mounting hole 18 has been seted up to slider 17 inside, wherein slider 17 passes through bolt and slide rail 16 fixed connection, slide rail 16 is inside to be seted up the locating hole that a plurality of and bolt correspond, the user of being convenient for is according to the equipment height that uses with the reflow soldering cooperation, nimble adjusting slider 17's position, thereby be convenient for the equipment of better realization after the equipment dismantlement again.
In this embodiment, please refer to fig. 2, one end of the inner wall of the mounting groove 3, which is close to the control module 2, is provided with a sensing assembly, which includes a fixing frame 5, two sides of the outer wall of the fixing frame 5 are respectively fixed to two sides of the inner wall of the mounting groove 3 by bolts, and the fixing frame 5 is located at the top of the conveying belt 4, so as to measure the size of the workpiece on the conveying belt 4 passing through the bottom of the fixing frame.
Top fixedly connected with guard box 6 in mount 5, the inside laser rangefinder module 7 that is provided with of guard box 6, laser rangefinder module 7 are provided with a plurality of, and a plurality of laser rangefinder module 7 evenly distributed is convenient for measure the size of different circuit boards in guard box 6, and its measuring range is wider, and application scope is bigger. And control module 2 and laser rangefinder module 7 electric connection, control module 2 includes analysis module and signal transceiver module, measures the external dimension of circuit board through laser rangefinder module 7, and the equipment self-adaptation of being convenient for starts heating element 15 of corresponding quantity, plays the effect of energy saving.
In this embodiment, please refer to fig. 3, one end of the inner wall of the mounting groove 3, which is close to the sensing assembly, is provided with a preheating assembly, the preheating assembly includes two mounting brackets 8, one side of each of the two mounting brackets 8, which is far away from each other, is fixedly connected with an L-shaped plate 9,L plate 9, which is fixedly connected with the inner wall of the mounting groove 3 through a bolt, so that the preheating assembly is conveniently mounted.
A plurality of heating element 15 all with control module 2 electric connection, motor 11 and control module 2 electric connection, the user of being convenient for is according to the thickness of different strip welding circuit boards, the automatic distance of adjusting between heating element 15 and the circuit board to be convenient for preheat the circuit board better.
The utility model discloses the theory of operation: during the use, treat that welded circuit board gets into inside the reflow soldering machine after 4 transport of conveyer belt, when the circuit board is located laser ranging module 7 bottom, a plurality of laser ranging module 7 send the laser simultaneously and range to 4 conveyer belts of its bottom, when 4 tops of conveyer belt have circuit board components, the distance value that partial laser ranging module 7 measured is less, laser ranging module 7 sends the signal to in control module 2 this moment, through analysis of analysis module, it is in certain within range to reach the size of circuit board size, control module 2 controls a plurality of heating element 15 afterwards, locate to the center from both sides and close in proper order, it is just greater than the circuit board size to the scope that heating element 15 covered.
Meanwhile, according to the size of the distance measurement module, namely the thickness of the circuit board, the control module 2 controls the motor 11 to start, and drives the first preheating plate 13 and the second preheating plate 14 to approach each other, wherein the first preheating plate 13 and the second preheating plate 14 are symmetrically arranged about the top surface of the conveyor belt 4, and the first preheating plate 13 and the second preheating plate 14 continue to preheat the circuit board at the top of the conveyor belt 4 together after approaching each other.
At the moment, the heat generated by the heating elements 15 completely acts on the circuit board, so that the circuit board can be better preheated, and the heating elements 15 on the two sides are closed, so that the production cost is saved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A reflow soldering apparatus for SMT, comprising a reflow soldering machine main body (1), characterized in that: the welding device is characterized in that a control module (2) is fixedly connected to one end of the top of the reflow welding machine main body (1), a mounting groove (3) is formed in the reflow welding machine main body (1), a conveying belt (4) is arranged in the mounting groove (3), two sliding rails (16) are arranged at one end, close to the control module (2), of the reflow welding machine main body (1), sliding blocks (17) are connected to the inner parts of the two sliding rails (16) in a sliding mode, and mounting holes (18) are formed in the inner parts of the sliding blocks (17);
an induction component is arranged at one end, close to the control module (2), of the inner wall of the mounting groove (3), the induction component comprises a fixing frame (5), a protection box (6) is fixedly connected to the top of the fixing frame (5), and a laser ranging module (7) is arranged inside the protection box (6);
the one end that mounting groove (3) inner wall is close to induction assembly is provided with preheats the subassembly, it includes two mounting bracket (8), two spout (10) have all been seted up to one side that mounting bracket (8) are close to each other, two mounting bracket (8) bottom fixedly connected with motor (11) of keeping away from control module (2) in mounting bracket (8), motor (11) drive shaft runs through corresponding spout (10) and fixedly connected with two-way threaded rod (12), two-way threaded rod (12) both ends are threaded connection respectively and preheat board (13) and second and preheat board (14), the equal fixedly connected with a plurality of heating element (15) in one side that first preheating plate (13) and second preheat board (14) and are close to each other.
2. A reflow apparatus for SMT according to claim 1, wherein: the two sides of the outer wall of the fixing frame (5) are fixed with the two sides of the inner wall of the mounting groove (3) through bolts respectively, and the fixing frame (5) is located at the top of the conveying belt (4).
3. A reflow apparatus for SMT according to claim 1, wherein: the laser ranging module (7) is provided with a plurality of, and a plurality of laser ranging module (7) evenly distributed is in guard box (6).
4. A reflow apparatus for SMT according to claim 1, wherein: two equal fixedly connected with L template (9) in one side that mounting bracket (8) kept away from each other, L template (9) pass through bolt and mounting groove (3) inner wall fixed connection.
5. A reflow apparatus for SMT according to claim 1, wherein: the control module (2) is electrically connected with the laser ranging module (7), and the control module (2) comprises an analysis module and a signal receiving and transmitting module.
6. A reflow apparatus for SMT according to claim 1, wherein: the heating elements (15) are electrically connected with the control module (2), and the motor (11) is electrically connected with the control module (2).
7. A reflow apparatus for SMT according to claim 1, wherein: the sliding block (17) is fixedly connected with the sliding rail (16) through bolts, and a plurality of positioning holes corresponding to the bolts are formed in the sliding rail (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222395503.6U CN218336626U (en) | 2022-09-09 | 2022-09-09 | Reflow soldering device for SMT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222395503.6U CN218336626U (en) | 2022-09-09 | 2022-09-09 | Reflow soldering device for SMT |
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| Publication Number | Publication Date |
|---|---|
| CN218336626U true CN218336626U (en) | 2023-01-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222395503.6U Active CN218336626U (en) | 2022-09-09 | 2022-09-09 | Reflow soldering device for SMT |
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| CN (1) | CN218336626U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116213871A (en) * | 2023-03-03 | 2023-06-06 | 北京铁科世纪科技有限公司 | Hot air type reflow soldering device and method for SMT (surface mounted technology) patch |
-
2022
- 2022-09-09 CN CN202222395503.6U patent/CN218336626U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116213871A (en) * | 2023-03-03 | 2023-06-06 | 北京铁科世纪科技有限公司 | Hot air type reflow soldering device and method for SMT (surface mounted technology) patch |
| CN116213871B (en) * | 2023-03-03 | 2023-08-25 | 北京铁科世纪科技有限公司 | Hot air type reflow soldering device and method for SMT (surface mounted technology) patch |
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