CN107225303A - A kind of accurate reflow machine - Google Patents
A kind of accurate reflow machine Download PDFInfo
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- CN107225303A CN107225303A CN201610177088.3A CN201610177088A CN107225303A CN 107225303 A CN107225303 A CN 107225303A CN 201610177088 A CN201610177088 A CN 201610177088A CN 107225303 A CN107225303 A CN 107225303A
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- Prior art keywords
- reflow soldering
- conveyer
- accurate
- reflow
- backlash
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
For overcome in the prior art reflow soldering it is bulky, power consumption is big, the problem of accurate control can not be accomplished to heating-up temperature, the invention provides a kind of accurate reflow machine, it includes some Reflow Soldering casees, master control system, powered transport mechanism and backlash transmission mechanism；The accurate reflow machine that the present invention is provided, it uses single Reflow Soldering case to carry out accurate reflow soldering to single wiring board, and the control of its heating process is more accurate.Its energy expenditure is smaller, therefore more saves.The management of its energy is more fine reasonable relative to rough reflow soldering.Single Reflow Soldering case starts one by one in the application, and startup power is small, does not have impact to electric power system, and the wiring cost of factory is greatly reduced, and when carrying out Reflow Soldering to same amount of wiring board, its overall energy expenditure is also significantly reduced, and saves mass energy.
Description
Technical field
The present invention relates to a kind of reflow soldering device.
Background technology
Comprise the following steps it is well known that assist side makes：Printing is formed on circuit, circuit and punched on substrate, is fixed in the circuit board, is then welded by plug-in unit or surface-pasted mode.The mode of circuit plate weld includes the modes such as electric resistance welding, Reflow Soldering, supersonic welding.
The application is specifically improved mainly for reflow soldering apparatus, and existing reflow soldering apparatus is typically disposed in after component plug assembly (or surface mount device) and Scaling powder immersing device；After by component plug assembly (or surface mount device), component is positioned in the circuit board, component is pre-fixed in the circuit board by Scaling powder immersing device again, soft brazing filler metal composition (such as paste soldering material) is accommodated in the Scaling powder immersing device, soft brazing filler metal composition contains powder soft solder, solvent, solder flux.Welding is finally realized in reflow soldering apparatus.
Existing common reflow soldering apparatus is reflow soldering, and reflow soldering generally comprises edge and point-blank arranges multiple bodies of heater to the transport path of delivery outlet (outlet) from input port (entrance) and constitute.Multiple bodies of heater are according to its function, at least including preheating part, Reflow Soldering portion and cooling end etc..Preheating part is the body of heater for preheating wiring board, and Reflow Soldering portion is the body of heater for melting soft solder, and cooling end is the body of heater cooled down to wiring board.
As described above, it is necessary to be heated under the conditions of predetermined temperature to wiring board in reflow soldering.The temperature conditionss are referred to as temperature curve.It controls temperature by the way of heat stepwise, it is impossible to accomplish accurate control to it, meanwhile, there is the temperature difference between each section of body of heater, temperature change is also uncontrollable.For example, in the case of being for example set with 80 DEG C of temperature difference between the body of heater of the terminal positioned at preheating part and the body of heater of starting point positioned at Reflow Soldering portion, the temperature in the region adjacent with reflow soldering is too high, and only produces 40 DEG C of temperature difference.As a result, the temperature curve of the slope with desired temperature change can not be set by producing.Above-mentioned reflow soldering is bulky simultaneously, it is necessary to largely consume electric energy during startup and use.
The content of the invention
For overcome in the prior art reflow soldering it is bulky, power consumption is big, it is impossible to which the problem of accomplishing accurate control to heating-up temperature, the invention provides a kind of accurate reflow machine.
The invention provides a kind of accurate reflow machine, including some Reflow Soldering casees, master control system, powered transport mechanism and backlash transmission mechanism；
The Reflow Soldering case includes casing and the circuit substrate transfer device, heater, electric-control system, electric supply installation and the wind EGR that are placed in the casing；
The front-end and back-end of the casing are respectively equipped with the access portal being transferred into and out for wiring board；
The electric supply installation is the heater, electric-control system, wind EGR and circuit substrate transfer device provide electric energy；
The heater, wind EGR and circuit substrate transfer device are controlled by the electric-control system；
The electric supply installation includes the mobile conductive mechanism installed in the bottom half, and the mobile conductive mechanism includes some conductive electrodes；
The powered transport mechanism includes the conveyer transmitted with conductive electrode is electrically connected in the mobile conductive mechanism strip conductor and by the Reflow Soldering case from initiating terminal terminad；
The backlash transmission mechanism is provided with the conveyer for the initiating terminal that Reflow Soldering case is back to the powered transport mechanism from the end of the powered transport mechanism；
The master control system is used to control the powered transport mechanism, the Reflow Soldering case and the backlash transmission mechanism.
Further, further respectively had at the access portal on the casing front-end and back-end can open and close baffle mechanism.
Further, the bottom of the Reflow Soldering case is provided with a bottom plate, and the bottom plate lower surface is provided with conductive bar corresponding with Reflow Soldering case bottom conductive electrode quantity, and the conductive bar is electrically connected with the conductive electrode in the Reflow Soldering bottom portion.
Further, the master control system includes main control computer, electric cabinet, keyboard and mouse；The main control computer includes the standard computer hardware such as mainboard, CPU, internal memory and hard disk；Industry Control Special-purpose plate card is housed on the mainboard；
Provided with the automatically controlled hardware including power supply, air switch, relay, motor driver, magnetic valve in the electric cabinet.
Further, it is correspondingly provided with the communication module mutually communicated on the electric-control system of the Reflow Soldering case and the main control computer or electric cabinet of the master control system.
Further, the powered transport mechanism is synthesized by some conducting transmission modules concatenation；The backlash transmission mechanism is synthesized by some backlash transport modules concatenation.
Further, the conducting transmission module is identical with the quantity of backlash transport module；The backlash transport module is arranged on the bottom of the conducting transmission module；
Single conducting transmission module and single backlash transport module are combined into single conveyer, some conveyer tandem connection formation Transmission systems；
Meanwhile, the front-end and back-end of the Transmission system are respectively equipped with lowering or hoisting gear.
Further, the conducting transmission module includes protective cover, strip conductor and second conveyer；The second conveyer is used to transmit the reflow machine for being mounted with wiring board；The strip conductor is electrically connected with the conductive electrode on the Reflow Soldering case.
Further, the backlash transport module includes frame and second conveyer；The second conveyer is arranged in the frame.
Further, the lowering or hoisting gear includes outer cover, slide block guide rail mechanism and the 3rd conveyer；
The slide block guide rail mechanism and the 3rd conveyer are mounted in the outer cover；The slide block guide rail mechanism includes lead screw guide rails and the sliding block that can be slidably mounted on screw mandrel guide rail；3rd conveyer is arranged on the sliding block.
The accurate reflow machine that the present invention is provided, it uses single Reflow Soldering case to carry out accurate reflow soldering to single wiring board, Reflow Soldering box structure is relatively small, it is used in relatively small heating cavities, the mode of heating accurately heated to uniline plate according to default heating curves, in this way, the control of its heating process is more accurate.Its energy expenditure is smaller, therefore more saves.Simultaneously, inside Reflow Soldering case during accurate reflow soldering, its entirety is transmitted in powered transport mechanism from a upper process to next process, when Reflow Soldering case completes the action of Reflow Soldering, Reflow Soldering case is delivered in next process just, the effect of reflow soldering is not influenceed.The input quantity of the quantity of its wiring board as needed for carrying out reflow soldering, effectively control Reflow Soldering case, in this way, the management of its energy is more fine reasonable relative to rough reflow soldering.The startup power of the reflow soldering of monoblock type of the prior art is general in 70KW or so, very big is impacted to electric power system, and the power of single reflow soldering case in use, starts one by one in 1.5KW or so, startup power is small, do not have impact to electric power system, the wiring cost of factory is greatly reduced, when carrying out Reflow Soldering to same amount of wiring board, its overall energy expenditure is also significantly reduced, and saves mass energy.
Brief description of the drawings
Fig. 1 is the accurate solder reflow device schematic perspective view provided in the specific embodiment of the invention；
Fig. 2 is the accurate solder reflow device schematic front view provided in the specific embodiment of the invention；
Fig. 3 is the lowering or hoisting gear schematic perspective view provided in the specific embodiment of the invention；
Fig. 4 is the conveyer schematic perspective view provided in the specific embodiment of the invention；
Fig. 5 is the Reflow Soldering case schematic perspective view provided in the specific embodiment of the invention；
Fig. 6 is the Reflow Soldering case schematic side view provided in the specific embodiment of the invention；
Fig. 7 is the Reflow Soldering case elevational schematic view provided in the specific embodiment of the invention；
Fig. 8 is the Reflow Soldering case front-view schematic diagram provided in the specific embodiment of the invention；
Fig. 9 is A-A diagrammatic cross-sections in Fig. 8；
Figure 10 is that the Reflow Soldering case provided in the specific embodiment of the invention removes the schematic internal view behind casing top；
Figure 11 is the circuit substrate transfer device schematic perspective view provided in the specific embodiment of the invention；
Figure 12 is the Reflow Soldering case schematic perspective view after the further improvement provided in the specific embodiment of the invention；
Figure 13 is that the conveyer provided in the specific embodiment of the invention removes the schematic perspective view after protective cover.
Wherein, 100, Reflow Soldering case；200th, master control system；300th, conducting transmission module；400th, backlash transport module；500th, lowering or hoisting gear；101st, bottom plate；102nd, conductive bar；201st, electric cabinet；301st, protective cover；302nd, strip conductor；303rd, second conveyer；304th, conducting pulley；401st, frame；402nd, second conveyer；403rd, pulley；501st, outer cover；502nd, slide block guide rail mechanism；503rd, the 3rd conveyer；504th, the second supporting plate；1st, casing；2nd, access portal；3rd, baffle mechanism；4th, fan；5th, conductive guide；6th, electric-control system；7th, heater；8th, circuit substrate transfer device；9th, wiring board；10th, heating cavities；11st, automatically controlled separate cavities；81st, power transmission shaft；82nd, driving-chain；83rd, band board clamp.
Embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with drawings and Examples, the present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Embodiment 1
Accurate reflow machine disclosed in this example, as shown in Figure 1 and Figure 2, including some Reflow Soldering casees 100, master control system 200, powered transport mechanism and backlash transmission mechanism；
Following to carry out specific explanations explanation to Reflow Soldering case, as shown in Fig. 5-Figure 11, Reflow Soldering case 100 includes casing 1 and the circuit substrate transfer device 8, heater 7, electric-control system 6, electric supply installation and the wind EGR that are placed in the casing 1；
The front-end and back-end of the casing 1 are respectively equipped with the access portal 2 being transferred into and out for wiring board 9；
The electric supply installation is that the heater 7, electric-control system 6, wind EGR and circuit substrate transfer device 8 provide circuit；
The heater 7, wind EGR and circuit substrate transfer device 8 are by the control of the electric-control system 6.
In this example, as shown in Fig. 5, Fig. 6, Fig. 8, Fig. 9, the casing 1 is non-enclosed, and it is rectangular shape, including 4 sides (or regarding rear and front end face and left and right sides as), top surface and bottom surface；The access portal 2 of its front end is wiring board input port, and the access portal 2 of its rear end is wiring board delivery outlet.The wiring board 9 for completing previous process (applying scaling powder by Scaling powder immersing device) is sent in wiring board input port, via line plate input port feeding casing 1 by the conveyer between device.It when wiring board 9 is in casing 1, can be transmitted rearward, be spread out of eventually through wiring board delivery outlet by the above-mentioned circuit substrate transfer device 8 in casing 1, send into next process (detection means carry out Quality Detection).
As shown in figure 9, being provided with heating cavities 10 and automatically controlled separate cavities 11 in casing 1；The electric-control system 6 is arranged in the automatically controlled separate cavities 11, and the heater 7 is arranged in the heating cavities 10；It is arranged such, it effectively can isolate heater 7 and electric-control system 6, prevents the high temperature that heater 7 is produced from producing influence to electric-control system 6.
The wind EGR is used for making the air flow in heating cavities 10, makes the temperature of each position in its heating cavities 10 and tends to be average.In this example, the wind EGR includes fan 4 and air channel, and the fan 4 is arranged on the casing 1, and it is connected by air channel with heating cavities 10.Specifically, the fan 4 may be mounted at end face, side, top surface or the bottom surface of casing 1.In this example, as shown in Figure 1, Figure 2, Figure 5, the fan 4 is arranged on the left surface of casing 1.
Wherein, as shown in figure 9, the heater 7 can use various structures known to those skilled in the art, such as it is the heater members such as infrared heating pipe heater or ptc heater or resistance heater or semiconductor heat booster.In this example, as shown in Figure 10, the heater 7 is infrared heating pipe heater, and it coordinates air circulating system, realizes good reflow soldering effect.Electro-heat equipment 7 is fixed in casing by fixed structure, electric control system controls infrared heating pipe heater work, infrared heating pipe heater can use and be placed on circuit board, the lower section of wiring board 9, various ways arrangement is waited above and below wiring board 9, so that it is guaranteed that heating effect.
As shown in Figure 9, circuit substrate transfer device 8 is arranged on bottom in casing 1, it can use various structures known in those skilled in the art, and transmission lines plate 9 is used for or with board clamp by the circuit substrate transfer device 8 (wiring board 9 is placed on band board clamp).Specifically, as shown in figure 11, circuit substrate transfer device includes motor (not shown), power transmission shaft 81, driving-chain 82 (or can also be replaced using high temperature resistant driving belt) and with board clamp 83, the left and right sides of power transmission shaft 81 sets the driving-chain 82 respectively, power transmission shaft 81 is driven by motor, driving-chain 82 is driven by power transmission shaft 81, band board clamp 83 is ridden on two driving-chains 82, wiring board 9 is arranged on the band board clamp 83, band board clamp 83 is driven by driving-chain 82, the transmission of wiring board 9 is realized.
As shown in figure 8, the electric-control system 6 is embodied as an electric-controlled plate.It is used for the action for controlling each electrical equipment, electric-controlled plate is provided with microprocessor, inverter, communication module, temperature detection control module, data memory module etc., in this example, it is used as preferred mode, the device parameters such as its temperature curve, the speed of service pass to electric-controlled plate by master control system by communication module (wireless communication module or wire communication module), realize the accurate control to reflux course, wherein, it is mainly used in control heater 7 to work, it is heated according to default temperature curve to wiring board 9.Meanwhile, it controls the opening and closing of fan 4, if it is desired, go back the air quantity of controlling fan 4.Meanwhile, its also control circuit substrate transfer device 8, make its in case of need control circuit substrate transfer device 8 start, with transmission line plate 9.
Wherein, as shown in Fig. 5-Fig. 9, further respectively had at the access portal 2 on the front-end and back-end of casing 1 can open and close baffle mechanism 3.Above-mentioned access portal 2 can be closed or opened to the baffle mechanism 3, to provide the heating environment of closing.The baffle mechanism 3 is controlled also by electric-control system 6, to realize that it is automatically opened or closed.
The electric supply installation is the device communicated with external AC power, it can use various structures known in those skilled in the art, in this example, the electric supply installation includes the mobile conductive mechanism installed in the bottom of casing 1, the mobile conductive mechanism is included as anode connection terminal and negative pole connection end, the conductive electrode of earth terminal, and the conductive electrode is conductive guide or conductive guide groove.So, Reflow Soldering case 100 disclosed in this example can be arranged on in the powered transport mechanism on corresponding strip conductor, the strip conductor includes conductive guide groove (when above-mentioned mobile conductive mechanism is conductive guide) or conductive guide (when above-mentioned mobile conductive mechanism is conductive guide groove), the Reflow Soldering case 100 is set to be moved in powered transport mechanism, meanwhile, the powered transport mechanism also provides power supply for Reflow Soldering case 100.In this example, as shown in Fig. 6-Figure 11, the mobile conductive mechanism is 3 conductive guides 5 for being arranged on the bottom of casing 1.The concrete structure of above-mentioned powered transport mechanism will be described in detail in back.
In order to prevent being provided with thermal insulation layer in the loss of energy, this example in the casing 1.
In use, if electric-control system 6 can only accomplish local control, so, it is required for re-writing parameter etc., its process seems cumbersome when carrying out Reflow Soldering to different wiring boards 9, therefore, as an improvement, communication module of this example on the electric-control system 6 uses wireless communication module.Operating personnel can be communicated wirelessly by the wireless communication module, wirelessly write parameters etc..Its operation is simpler.
The Reflow Soldering case 100 disclosed in this example, its structure is relatively small, and it is used in relatively small heating cavities 10, the mode of heating accurately heated to uniline plate 9 according to default heating curves, in this way, the control of its heating process is more accurate.Meanwhile, its energy expenditure is smaller, therefore more saves.
Single Reflow Soldering case 100 can be used alone, and can also be placed in powered transport mechanism and be transmitted and powered, then be returned by backlash transmission mechanism.Master control system 200 can be controlled to the heating of each Reflow Soldering case 100, and powered transport mechanism and backlash transmission mechanism can also be controlled.It is following that specific explanations explanation is carried out to powered transport mechanism, backlash transmission mechanism and master control system 200.
Specifically, the powered transport mechanism includes the conveyer transmitted with conductive electrode is electrically connected in the mobile conductive mechanism strip conductor and by the Reflow Soldering case from initiating terminal terminad；
So-called initiating terminal, when referring to work, enter one end of powered transport mechanism with the Reflow Soldering case of wiring board, the Reflow Soldering case 100 that end refers to wiring board 9 sends wiring board 9 to next process, and the Reflow Soldering case 100 of unloaded (referring to without wiring board 9) is sent to one end of backlash transmitting device.
The backlash transmission mechanism is provided with the conveyer for the initiating terminal that Reflow Soldering case 100 is back to the powered transport mechanism from the end of the powered transport mechanism；
The master control system 200 is used to control the powered transport mechanism, the Reflow Soldering case 100 and the backlash mechanism.
Specifically, the master control system 200 includes main control computer, electric cabinet 201, keyboard and mouse；Main control computer includes the standard computer hardware such as mainboard, CPU, internal memory, hard disk, while being equipped with Industry Control Special-purpose plate card (motion control card, image pick-up card, data collecting card etc.) on mainboard, main control software is also contained on main control computer；Electric cabinet includes the automatically controlled hardware such as power supply, air switch, relay, motor driver, magnetic valve, and primary control program passes through the automatically controlled hardware in Labcard driver electric cabinet 201, automatically controlled hardware controls executive component (motor, cylinder etc.) execution.The external devices such as display, keyboard, mouse, convenient operation and parameter adjustment.
It is corresponding, the main control computer of master control system described above or the electric cabinet are provided with communication module, it is wireless communication module in this example, the wireless communication module is communicated wirelessly with the wireless communication module on the electric-control system of Reflow Soldering case, sends the device parameters such as its temperature curve mentioned above, the speed of service to Reflow Soldering case.
Wherein, concrete structure on powered transport mechanism, it is not specially limited, as long as it can play the Reflow Soldering case 100 built with wiring board 9 by conveyer transmission, and is electrically connected by strip conductor thereon with the conductive electrode in the mobile conductive mechanism on Reflow Soldering case 100.So, it can be achieved to carry out accurate solder reflow operation in Reflow Soldering case 100, simultaneously, while the accurate Reflow Soldering is carried out, Reflow Soldering case 100 with wiring board 9 is sent to the porch to subsequent processing by powered transport mechanism in time, then send wiring board 9 to next process, and unloaded Reflow Soldering case 100 is delivered into backlash transmission mechanism.
Specifically, as shown in figure 12, it is used as improvement, a kind of further improved Reflow Soldering case 100 is disclosed in this example, the bottom of the Reflow Soldering case 100 is further provided with a bottom plate 101, the lower surface of bottom plate 101 is provided with conductive bar 102 corresponding with the bottom conductive electrode quantity of Reflow Soldering case 100, and the conductive bar 102 is electrically connected with the conductive electrode of the bottom of Reflow Soldering case 100；Using above-mentioned bottom plate 101, influence of the Reflow Soldering case 100 to powered transport mechanism can further be isolated, simultaneously, it is electrically connected by above-mentioned conductive bar 102 with the strip conductor realization in powered transport mechanism, the conductive electrode so that electric energy to be passed to the bottom of Reflow Soldering case 100 as middleware by the conductive bar 102.The bottom plate 101 is made up of insulating materials.
Wherein, the concrete structure on backlash transmission mechanism, is also not particularly limited, as long as it can be played unloaded Reflow Soldering case 100 from the tip transition of above-mentioned powered transport mechanism to initiating terminal.
Above-mentioned powered transmission mechanism and backlash transmission mechanism can be monolithic construction or split-type structural, and split-type structural refers to it by the way of being formed by some block combiners, and monolithic construction refers to it for single overall mode.Because said structure relative volume is larger.Above-mentioned powered transmission mechanism and backlash transmission mechanism are designed to split-type structural, is more easy to transport and installs.In this example, above-mentioned powered transmission mechanism and backlash transmission mechanism are using split type.Specifically, as shown in Figure 1, 2, the powered transport mechanism is concatenated by some conducting transmission modules 300 and synthesized；The backlash transmission mechanism is concatenated by some backlash transport modules 400 and synthesized.
In this example, the space placement location of above-mentioned some conducting transmission modules 300 and backlash transport module 400 is not particularly limited, such as, and it can form the pattern of hollow with horizontal positioned, tandem array.It can also up and down be arranged, such as above-mentioned conducting transmission module 300 is placed on top, backlash transport module 400 is placed on bottom；Vice versa.Simply now need the head and the tail in its conducting transmission mechanism and backlash transmission mechanism that lowering or hoisting gear 500 is set.
Such as, shown in as shown in Figure 1, Figure 2, in this example by the way of arrangement conducting transmission module 300 up and down and backlash transport module 400, the conducting transmission module 300 is identical with the quantity of backlash transport module 400；The backlash transport module 400 is arranged on the bottom of the conducting transmission module 300；
And as a further improvement, single conducting transmission module 300 and single backlash transport module 400 are combined into single conveyer, some conveyer tandem connection formation Transmission systems in this example.
Meanwhile, the front-end and back-end of the Transmission system are respectively equipped with lowering or hoisting gear 500.
Wherein, above-mentioned conveyer is as shown in Fig. 4, Figure 13.Specifically, conducting transmission module 300 includes protective cover 301, strip conductor 302 and conveyer (for the sake of difference, conveyer herein is referred to as second conveyer 303)；The second conveyer 303 is used to transmit the reflow machine 100 for being mounted with wiring board 9；The strip conductor 302 is electrically connected with the conductive electrode on the Reflow Soldering case 1, in this example, and the strip conductor 302 is actual to be electrically connected with the conductive bar 102 on the bottom plate 101 of the bottom of Reflow Soldering case 100.The second conveyer 303 in this example and the structure of circuit substrate transfer device 8 mentioned above are essentially identical, and the object simply transmitted herein is Reflow Soldering case 100, and it is wiring board 9 that circuit substrate transfer device 8, which is transmitted,.Certainly, it can also use other various conveyers well known in the art, repeat no more.
In this example, as shown in figure 13, to make slip of the Reflow Soldering case 100 on its above-mentioned strip conductor 302 more smooth, it is provided with conducting pulley 304 on each strip conductor 302, so, sliding friction can be changed into rolling friction, make that the frictional resistance on the bottom plate 101 of Reflow Soldering case 100 between conductive bar 102 and each strip conductor 303 is smaller, the slip of Reflow Soldering case 100 is more smooth.Meanwhile, the relation electrically connected is also kept between the conducting pulley 304 and strip conductor 302.Due to carrying high-tension electricity on above-mentioned strip conductor 302, therefore, for safety, protective cover 301 is necessary.
The backlash transport module 400 includes frame 401 and conveyer (for the sake of difference, conveyer herein is referred to as second conveyer 402)；The second conveyer 402 is arranged in the frame 401.The bottom of the frame 401 is additionally provided with pulley 403, by setting the pulley 403, is more convenient the movement of the conveyer.The second conveyer 402 can use the substantially similar way of circuit substrate transfer device 8 disclosed above, and the object simply transmitted herein is Reflow Soldering case 100, and the transmission of circuit substrate transfer device 8 is wiring board 9.Certainly, other various conveyers well known in the art can be also used, such as, in this example, some rollers are included in the second conveyer 303, above-mentioned roller is driven by motor, realizes that roller is rotated and drives Reflow Soldering case 100 to slide on.Repeat no more.
As shown in figure 3, the lowering or hoisting gear 500 includes outer cover 501, slide block guide rail mechanism 502 and conveyer (for the sake of difference, referred to herein as the 3rd conveyer 503)；The conveyer 503 of slide block guide rail mechanism 502 and the 3rd is mounted in the outer cover 501；The slide block guide rail mechanism 502 includes lead screw guide rails and the sliding block that can be slidably mounted on screw mandrel guide rail；3rd conveyer 503 is arranged on the sliding block.3rd conveyer 503 and circuit substrate transfer device 8 disclosed above are essentially identical, and the object simply transmitted herein is Reflow Soldering case 100, and the transmission of circuit substrate transfer device 8 is wiring board 9.Certainly, it can also use other various conveyers well known in the art, repeat no more.
3rd conveyer 503 is arranged on the sliding block of slide block guide rail mechanism 502, so, rising or decline of 3rd conveyer 503 with Reflow Soldering case 100 are realized by the slide block guide rail mechanism 502, unloaded Reflow Soldering case 100 is dropped on backlash transmission mechanism from powered transport mechanism end, and backlash transmission mechanism is conveyed through to the initiating terminal that the unloaded Reflow Soldering case 100 come rises to powered transport mechanism again.
Certainly, the lowering or hoisting gear 500 can also be used well known to a person skilled in the art the function that other modes realize its lifting, repeated no more.
The course of work of accurate reflow machine is described as follows disclosed in this example：The wiring board 9 for completing previous process (applying scaling powder by Scaling powder immersing device) is sent at the wiring board input port of the front end of Reflow Soldering case 100, the baffle mechanism 3 of front end is opened, in the feeding casing 1 of the via line plate input port of wiring board 9, wiring board 9 is delivered to the middle part of heating cavities 10 by the circuit substrate transfer device 8 in casing 1, the control heater 7 of electric-control system 6 is heated according to default temperature curve, simultaneously, fan 4 starts, drive the air thermally equivalent in heating cavities 10, after completing to heat according to default temperature curve, the baffle mechanism 3 of rear end is opened, wiring board 9 is spread out of wiring board delivery outlet by circuit substrate transfer device 8, wiring board 9 is sent into next process (detection means carry out Quality Detection).Meanwhile, the Reflow Soldering case of wiring board 9 that is placed with this example is transmitted in above-mentioned powered transport mechanism, and next process is sent to by the powered transport mechanism.And the powered transport mechanism provides power supply in the moving process of Reflow Soldering case 100 for Reflow Soldering case 100.Then wiring board 9 is sent into after next process, unloaded Reflow Soldering case 100 is dropped on the backlash transmission mechanism of bottom by the lowering or hoisting gear 500 of its tail end, transmitted by the backlash transmission mechanism to the lowering or hoisting gear 500 of initiating terminal, pass through the lowering or hoisting gear 500 of initiating terminal, unloaded Reflow Soldering case 100 is risen to the initiating terminal for delivering to powered transport mechanism, circulated with this.
The accurate reflow machine that the present invention is provided, it uses single Reflow Soldering case 100 to carry out accurate reflow soldering to single wiring board 9, the structure of Reflow Soldering case 100 is relatively small, it is used in relatively small heating cavities, enter the mode of heating that 9 rows are accurately heated to uniline plate according to default heating curves, in this way, the control of its heating process is more accurate.Its energy expenditure is smaller, therefore more saves.Simultaneously, inside Reflow Soldering case 100 during accurate reflow soldering, its entirety is transmitted in powered transport mechanism from a upper process to next process, when Reflow Soldering case 100 completes the action of Reflow Soldering, Reflow Soldering case 100 is delivered in next process just, the effect of reflow soldering is not influenceed.The input quantity of the quantity of its wiring board 9 as needed for carrying out reflow soldering, effectively control Reflow Soldering case 100, in this way, the management of its energy is more fine reasonable relative to rough reflow soldering.The startup power of the reflow soldering of monoblock type of the prior art is general in 70KW or so, very big is impacted to electric power system, the power of single Reflow Soldering case 100 in use, starts one by one in 1.5KW or so in the application, startup power is small, do not have impact to electric power system, the wiring cost of factory is greatly reduced, when carrying out Reflow Soldering to same amount of wiring board 9, its overall energy expenditure is also significantly reduced, and saves mass energy.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the invention etc., should be included in the scope of the protection.
Claims (10)
1. a kind of accurate reflow machine, it is characterised in that including some Reflow Soldering casees, master control system, band
Transmit electrically mechanism and backlash transmission mechanism；
The Reflow Soldering case include casing and be placed in the casing circuit substrate transfer device, heater,
Electric-control system, electric supply installation and wind EGR；
The front-end and back-end of the casing are respectively equipped with the access portal being transferred into and out for wiring board；
The electric supply installation is the heater, electric-control system, wind EGR and wiring board transmission dress
Offer electric energy is provided；
The heater, wind EGR and circuit substrate transfer device are controlled by the electric-control system；
The electric supply installation includes the mobile conductive mechanism installed in the bottom half, described mobile conductive
Mechanism includes some conductive electrodes；
The conductor rail that the powered transport mechanism includes with conductive electrode is electrically connected in the mobile conductive mechanism
Road and the conveyer for transmitting the Reflow Soldering case from initiating terminal terminad；
The backlash transmission mechanism is provided with and is back to Reflow Soldering case from the end of the powered transport mechanism
The conveyer of the initiating terminal of the powered transport mechanism；
The master control system is used to control the powered transport mechanism, the Reflow Soldering case and the backlash to pass
Transfer mechanism.
2. accurate reflow machine according to claim 1, it is characterised in that the casing front end and
Further respectively had at access portal on rear end can open and close baffle mechanism.
3. accurate reflow machine according to claim 1, it is characterised in that the Reflow Soldering case
Bottom is provided with a bottom plate, and the bottom plate lower surface is provided with corresponding with Reflow Soldering case bottom conductive electrode quantity
Conductive bar, the conductive bar is electrically connected with the conductive electrode in the Reflow Soldering bottom portion.
4. accurate reflow machine according to claim 1, it is characterised in that the master control system bag
Include main control computer, electric cabinet, display, keyboard and mouse；
The main control computer includes the standard computer hardware such as mainboard, CPU, internal memory and hard disk；The mainboard
It is upper that Industry Control Special-purpose plate card is housed；
Being provided with the electric cabinet includes power supply, air switch, relay, motor driver, magnetic valve
Automatically controlled hardware inside.
5. accurate reflow machine according to claim 4, it is characterised in that the Reflow Soldering case
It is correspondingly provided with and is mutually communicated on electric-control system and the main control computer or the electric cabinet of the master control system
Communication module.
6. accurate reflow machine according to claim 1, it is characterised in that the powered conveyer
Structure is synthesized by some conducting transmission modules concatenation；
The backlash transmission mechanism is synthesized by some backlash transport modules concatenation.
7. accurate reflow machine according to claim 6, it is characterised in that the conducting transmission mould
Block is identical with the quantity of backlash transport module；The backlash transport module is arranged on the conducting transmission module
Bottom；
Single conducting transmission module and single backlash transport module are combined into single conveyer, some conveyers
Tandem connection formation Transmission system；
Meanwhile, the front-end and back-end of the Transmission system are respectively equipped with lowering or hoisting gear.
8. accurate reflow machine according to claim 7, it is characterised in that the conducting transmission mould
Block includes protective cover, strip conductor and second conveyer；The second conveyer, which is used to transmit, to be loaded
There is the reflow machine of wiring board；The strip conductor is electrically connected with the conductive electrode on the Reflow Soldering case.
9. accurate reflow machine according to claim 8, it is characterised in that mould is transmitted in the backlash
Block includes frame and second conveyer；
The second conveyer is arranged in the frame.
10. accurate reflow machine according to claim 8, it is characterised in that the lowering or hoisting gear
Including outer cover, slide block guide rail mechanism and the 3rd conveyer；
The slide block guide rail mechanism and the 3rd conveyer are mounted in the outer cover；The slide block guide rail
Mechanism includes lead screw guide rails and the sliding block that can be slidably mounted on screw mandrel guide rail；The 3rd conveyer peace
On the sliding block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177088.3A CN107225303B (en) | 2016-03-25 | 2016-03-25 | Precise reflow welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177088.3A CN107225303B (en) | 2016-03-25 | 2016-03-25 | Precise reflow welding machine |
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| Publication Number | Publication Date |
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| CN107225303A true CN107225303A (en) | 2017-10-03 |
| CN107225303B CN107225303B (en) | 2019-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610177088.3A Active CN107225303B (en) | 2016-03-25 | 2016-03-25 | Precise reflow welding machine |
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| Country | Link |
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| CN (1) | CN107225303B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109249108A (en) * | 2018-10-22 | 2019-01-22 | 伟创力电子技术(苏州)有限公司 | Track Crashworthy plate device before reflow soldering |
| CN110355440A (en) * | 2019-07-18 | 2019-10-22 | 安徽天通精电新科技有限公司 | A kind of recycle heat formula reflow oven and its operating method |
| CN117577562A (en) * | 2024-01-15 | 2024-02-20 | 北京仝志伟业科技有限公司 | Vacuum device for chip packaging |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN217452667U (en) * | 2021-12-31 | 2022-09-20 | 伊利诺斯工具制品有限公司 | Reflow furnace |
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| JP2000261136A (en) * | 1999-03-08 | 2000-09-22 | Nec Corp | Reflow device |
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| CN102689071A (en) * | 2012-06-18 | 2012-09-26 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
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| JPH0555732A (en) * | 1991-07-31 | 1993-03-05 | Nec Corp | Automatic reflow-soldering device |
| JP2000261136A (en) * | 1999-03-08 | 2000-09-22 | Nec Corp | Reflow device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109249108A (en) * | 2018-10-22 | 2019-01-22 | 伟创力电子技术(苏州)有限公司 | Track Crashworthy plate device before reflow soldering |
| CN110355440A (en) * | 2019-07-18 | 2019-10-22 | 安徽天通精电新科技有限公司 | A kind of recycle heat formula reflow oven and its operating method |
| CN117577562A (en) * | 2024-01-15 | 2024-02-20 | 北京仝志伟业科技有限公司 | Vacuum device for chip packaging |
| CN117577562B (en) * | 2024-01-15 | 2024-04-16 | 北京仝志伟业科技有限公司 | Vacuum device for chip packaging |
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| Publication number | Publication date |
|---|---|
| CN107225303B (en) | 2019-12-10 |
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