IE32747B1 - Pressure electrical contact assembly for an electrical device and method and apparatus for producing the same - Google Patents

Pressure electrical contact assembly for an electrical device and method and apparatus for producing the same

Info

Publication number
IE32747B1
IE32747B1 IE442/69A IE44269A IE32747B1 IE 32747 B1 IE32747 B1 IE 32747B1 IE 442/69 A IE442/69 A IE 442/69A IE 44269 A IE44269 A IE 44269A IE 32747 B1 IE32747 B1 IE 32747B1
Authority
IE
Ireland
Prior art keywords
plunger
wall
dimples
spring
tools
Prior art date
Application number
IE442/69A
Other languages
English (en)
Other versions
IE32747L (en
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of IE32747L publication Critical patent/IE32747L/xx
Publication of IE32747B1 publication Critical patent/IE32747B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Die Bonding (AREA)
  • Manufacture Of Switches (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IE442/69A 1968-04-10 1969-04-01 Pressure electrical contact assembly for an electrical device and method and apparatus for producing the same IE32747B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72006268A 1968-04-10 1968-04-10

Publications (2)

Publication Number Publication Date
IE32747L IE32747L (en) 1969-10-10
IE32747B1 true IE32747B1 (en) 1973-11-14

Family

ID=24892482

Family Applications (1)

Application Number Title Priority Date Filing Date
IE442/69A IE32747B1 (en) 1968-04-10 1969-04-01 Pressure electrical contact assembly for an electrical device and method and apparatus for producing the same

Country Status (8)

Country Link
BE (1) BE731255A (enrdf_load_stackoverflow)
CH (1) CH503371A (enrdf_load_stackoverflow)
DE (1) DE1916699A1 (enrdf_load_stackoverflow)
ES (1) ES365811A1 (enrdf_load_stackoverflow)
FR (1) FR2005999A1 (enrdf_load_stackoverflow)
GB (1) GB1258008A (enrdf_load_stackoverflow)
IE (1) IE32747B1 (enrdf_load_stackoverflow)
NL (1) NL6905444A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149448U (enrdf_load_stackoverflow) * 1984-09-03 1986-04-03
JPH0642337Y2 (ja) * 1984-07-05 1994-11-02 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
FR2005999A1 (enrdf_load_stackoverflow) 1969-12-19
GB1258008A (enrdf_load_stackoverflow) 1971-12-22
NL6905444A (enrdf_load_stackoverflow) 1969-10-14
DE1916699A1 (de) 1969-10-30
CH503371A (de) 1971-02-15
BE731255A (enrdf_load_stackoverflow) 1969-09-15
ES365811A1 (es) 1971-03-16
IE32747L (en) 1969-10-10

Similar Documents

Publication Publication Date Title
AU5887673A (en) A method employing precision stamping for fabricating the wafers ofa multiwafer electrical circuit structure
CN212350769U (zh) 一种激光加工定位治具
GB1240805A (en) Dynamo-electric machine cores and their manufacture
CN205651251U (zh) 一种定位设备
IE32747B1 (en) Pressure electrical contact assembly for an electrical device and method and apparatus for producing the same
KR20160149464A (ko) 펀치 높낮이 조절이 가능한 펀칭금형
US2896311A (en) Method and apparatus for aligning slotted laminations
JP2000058008A (ja) コイン型電池の封口装置
CN222897158U (zh) 微型电机铆压装配装置
US1595810A (en) Plate condenser element and method of manufacture therefor
CN222587778U (zh) 翻边模具
CN216939292U (zh) 一种浮动机构及采用该机构的开口销压装机
JPS63131415A (ja) リベツト型電気接点のかしめ金型
US3875640A (en) Brush assembly tool
CN222785628U (zh) 一种可控制冲头伸缩间隔冲切导电端子的冲压模具
CN222134123U (zh) 一种用于切削加工的浮动支撑装置及加工设备
CN117087226B (zh) 压力机
JPS5789534A (en) Fitting device for parts
JPH0760374A (ja) プレス装置
CN222242174U (zh) 一种多工位一体化的冲压设备
CN221493900U (zh) 一种弹片冲压模具结构
CN219421227U (zh) 适用于处理器的分体式弹性压装结构及处理器支架
US2495184A (en) Brush holder
KR200213532Y1 (ko) 반도체패키지 포밍장치용 캠펀치 구동장치
CN115208137A (zh) 高效电机装配装置