HUP0104915A3 - Electrostatic sensing chuck for attracting particles to a portion of a particle contact surface near a deposition electrode, method for depositing or transporting particles using an electrostatic sensing chuck, method for unbalanced... - Google Patents

Electrostatic sensing chuck for attracting particles to a portion of a particle contact surface near a deposition electrode, method for depositing or transporting particles using an electrostatic sensing chuck, method for unbalanced...

Info

Publication number
HUP0104915A3
HUP0104915A3 HU0104915A HUP0104915A HUP0104915A3 HU P0104915 A3 HUP0104915 A3 HU P0104915A3 HU 0104915 A HU0104915 A HU 0104915A HU P0104915 A HUP0104915 A HU P0104915A HU P0104915 A3 HUP0104915 A3 HU P0104915A3
Authority
HU
Hungary
Prior art keywords
electrostatic sensing
particles
sensing chuck
unbalanced
depositing
Prior art date
Application number
HU0104915A
Other languages
English (en)
Original Assignee
Delsys Pharmaceutical Corp Mon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delsys Pharmaceutical Corp Mon filed Critical Delsys Pharmaceutical Corp Mon
Publication of HUP0104915A2 publication Critical patent/HUP0104915A2/hu
Publication of HUP0104915A3 publication Critical patent/HUP0104915A3/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HU0104915A 1998-10-14 1999-10-14 Electrostatic sensing chuck for attracting particles to a portion of a particle contact surface near a deposition electrode, method for depositing or transporting particles using an electrostatic sensing chuck, method for unbalanced... HUP0104915A3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10423498P 1998-10-14 1998-10-14
US13098599P 1999-04-26 1999-04-26
PCT/US1999/023959 WO2000022722A1 (en) 1998-10-14 1999-10-14 Electrostatic sensing chuck using area matched electrodes

Publications (2)

Publication Number Publication Date
HUP0104915A2 HUP0104915A2 (hu) 2002-04-29
HUP0104915A3 true HUP0104915A3 (en) 2003-02-28

Family

ID=26801318

Family Applications (1)

Application Number Title Priority Date Filing Date
HU0104915A HUP0104915A3 (en) 1998-10-14 1999-10-14 Electrostatic sensing chuck for attracting particles to a portion of a particle contact surface near a deposition electrode, method for depositing or transporting particles using an electrostatic sensing chuck, method for unbalanced...

Country Status (10)

Country Link
US (2) US6370005B1 (hu)
EP (1) EP1121752A4 (hu)
JP (1) JP2003506996A (hu)
KR (1) KR20010080172A (hu)
CN (1) CN1330806A (hu)
AU (1) AU752391B2 (hu)
CA (1) CA2346240A1 (hu)
HU (1) HUP0104915A3 (hu)
IL (1) IL142520A0 (hu)
WO (1) WO2000022722A1 (hu)

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JP2003506996A (ja) * 1998-10-14 2003-02-18 デルシス ファーマシューティカル コーポレーション 面積を整合させた複数の電極を用いた静電感知チャック
JP4634581B2 (ja) * 2000-07-06 2011-02-16 キヤノンアネルバ株式会社 スパッタリング方法、表面処理方法、スパッタリング装置及び表面処理装置
GB2384199B (en) * 2002-01-17 2005-04-06 Phoqus Ltd Electrostatic application of powder material to solid dosage forms
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
US6948537B2 (en) * 2002-05-31 2005-09-27 John Jones Systems and methods for collecting a particulate substance
US6998349B2 (en) * 2003-02-06 2006-02-14 Lam Research Corporation System, method and apparatus for automatic control of an RF generator for maximum efficiency
AU2003299889A1 (en) * 2003-02-06 2004-09-06 Lam Research Corporation Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency
US7053000B2 (en) * 2003-02-06 2006-05-30 Lam Research Corporation System, method and apparatus for constant voltage control of RF generator for optimum operation
US7033845B2 (en) * 2003-02-06 2006-04-25 Lam Research Corporation Phase control of megasonic RF generator for optimum operation
US6995067B2 (en) * 2003-02-06 2006-02-07 Lam Research Corporation Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
US7313242B2 (en) * 2004-03-16 2007-12-25 Palo Alto Research Center Incorporated Hypersonic transducer
EP1787871B1 (en) * 2005-11-22 2008-12-10 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. System for capacitive detection of a seat occupancy
US7583491B2 (en) * 2006-05-18 2009-09-01 Varian Semiconductor Equipment Associates, Inc. Electrostatic chuck to limit particle deposits thereon
KR101394337B1 (ko) * 2006-08-30 2014-05-13 엘아이지에이디피 주식회사 정전척
US8033842B2 (en) * 2006-11-08 2011-10-11 Sony Corporation Apparatus and method for mounting audio-visual components
US20090149038A1 (en) * 2007-12-07 2009-06-11 Metamems Llc Forming edge metallic contacts and using coulomb forces to improve ohmic contact
US8018009B2 (en) * 2007-12-07 2011-09-13 METAMEMS Corp. Forming large planar structures from substrates using edge Coulomb forces
US8159809B2 (en) * 2007-12-07 2012-04-17 METAMEMS Corp. Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter
US8531848B2 (en) * 2007-12-07 2013-09-10 METAMEMS Corp. Coulomb island and Faraday shield used to create adjustable Coulomb forces
US8008070B2 (en) 2007-12-07 2011-08-30 METAMEMS Corp. Using coulomb forces to study charateristics of fluids and biological samples
US7812336B2 (en) * 2007-12-07 2010-10-12 METAMEMS Corp. Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire
US8452037B2 (en) 2010-05-05 2013-05-28 Apple Inc. Speaker clip
JP5976377B2 (ja) * 2012-04-25 2016-08-23 東京エレクトロン株式会社 被処理基体に対する微粒子付着の制御方法、及び、処理装置
US9820033B2 (en) 2012-09-28 2017-11-14 Apple Inc. Speaker assembly
KR101319785B1 (ko) * 2013-03-18 2013-10-18 주식회사 야스 정전기 부상을 이용한 기판이송장치
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
US9451354B2 (en) * 2014-05-12 2016-09-20 Apple Inc. Liquid expulsion from an orifice
US9900698B2 (en) 2015-06-30 2018-02-20 Apple Inc. Graphene composite acoustic diaphragm
WO2018154706A1 (ja) * 2017-02-24 2018-08-30 株式会社 日立ハイテクノロジーズ 荷電粒子線装置
JP6846238B2 (ja) * 2017-03-07 2021-03-24 東京エレクトロン株式会社 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体
US11307661B2 (en) 2017-09-25 2022-04-19 Apple Inc. Electronic device with actuators for producing haptic and audio output along a device housing
JP7229505B2 (ja) * 2018-05-21 2023-02-28 国立大学法人山形大学 静電吸着装置
US10873798B1 (en) 2018-06-11 2020-12-22 Apple Inc. Detecting through-body inputs at a wearable audio device
US10757491B1 (en) 2018-06-11 2020-08-25 Apple Inc. Wearable interactive audio device
CN108861614B (zh) * 2018-07-10 2020-11-27 成都青山利康药业有限公司 一种天然生物薄膜材料的移动方法
US11334032B2 (en) 2018-08-30 2022-05-17 Apple Inc. Electronic watch with barometric vent
US11561144B1 (en) 2018-09-27 2023-01-24 Apple Inc. Wearable electronic device with fluid-based pressure sensing
US11511891B2 (en) * 2018-11-19 2022-11-29 Andrew Neil Aurigema System and method for generating forces using asymmetrical electrostatic pressure
CN113994345A (zh) 2019-04-17 2022-01-28 苹果公司 无线可定位标签

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DE3609240C2 (de) 1986-03-19 1996-08-01 Behr Industrieanlagen Vorrichtung zum elektrostatischen Beschichten von Gegenständen
US5205896A (en) * 1992-02-03 1993-04-27 Hughes Aircraft Company Component and solder preform placement device and method of placement
US5669973A (en) * 1995-06-06 1997-09-23 David Sarnoff Research Center, Inc. Apparatus for electrostatically depositing and retaining materials upon a substrate
US5858099A (en) * 1996-04-09 1999-01-12 Sarnoff Corporation Electrostatic chucks and a particle deposition apparatus therefor
US5788814A (en) * 1996-04-09 1998-08-04 David Sarnoff Research Center Chucks and methods for positioning multiple objects on a substrate
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5988432A (en) * 1998-03-25 1999-11-23 Sarnoff Corporation Bead manipulating chucks with bead size selector
JP2003506996A (ja) * 1998-10-14 2003-02-18 デルシス ファーマシューティカル コーポレーション 面積を整合させた複数の電極を用いた静電感知チャック

Also Published As

Publication number Publication date
CA2346240A1 (en) 2000-04-20
WO2000022722A1 (en) 2000-04-20
US6724609B2 (en) 2004-04-20
AU6516799A (en) 2000-05-01
US20020167780A1 (en) 2002-11-14
HUP0104915A2 (hu) 2002-04-29
IL142520A0 (en) 2002-03-10
US6370005B1 (en) 2002-04-09
EP1121752A1 (en) 2001-08-08
AU752391B2 (en) 2002-09-19
KR20010080172A (ko) 2001-08-22
CN1330806A (zh) 2002-01-09
JP2003506996A (ja) 2003-02-18
EP1121752A4 (en) 2003-05-21

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