AU2001272282A1 - Process for deposition of metal on a surface - Google Patents

Process for deposition of metal on a surface

Info

Publication number
AU2001272282A1
AU2001272282A1 AU2001272282A AU7228201A AU2001272282A1 AU 2001272282 A1 AU2001272282 A1 AU 2001272282A1 AU 2001272282 A AU2001272282 A AU 2001272282A AU 7228201 A AU7228201 A AU 7228201A AU 2001272282 A1 AU2001272282 A1 AU 2001272282A1
Authority
AU
Australia
Prior art keywords
deposition
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001272282A
Inventor
Theresa M. Anderson
David E. Marx
Alan G. Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2001272282A1 publication Critical patent/AU2001272282A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1664Process features with additional means during the plating process
    • C23C18/1669Agitation, e.g. air introduction
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AU2001272282A 2000-07-13 2001-07-11 Process for deposition of metal on a surface Abandoned AU2001272282A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21806000P 2000-07-13 2000-07-13
US60/218,060 2000-07-13
CA002343440A CA2343440A1 (en) 2000-07-13 2001-04-06 Ultrasonic process for autocatalytic deposition of metal
CA2,343,440 2001-04-06
PCT/CA2001/001015 WO2002006561A2 (en) 2000-07-13 2001-07-11 Process for deposition of metal on a surface

Publications (1)

Publication Number Publication Date
AU2001272282A1 true AU2001272282A1 (en) 2002-01-30

Family

ID=22813572

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001272282A Abandoned AU2001272282A1 (en) 2000-07-13 2001-07-11 Process for deposition of metal on a surface

Country Status (4)

Country Link
US (1) US7172785B2 (en)
AU (1) AU2001272282A1 (en)
CA (1) CA2343440A1 (en)
WO (1) WO2002006561A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669997B2 (en) 2002-03-26 2003-12-30 National Research Council Of Canada Acousto-immersion coating and process for magnesium and its alloy
CA2538808C (en) * 2003-09-30 2011-04-19 The Boeing Company Applique
JP3791518B2 (en) * 2003-10-29 2006-06-28 セイコーエプソン株式会社 Film forming method and film forming apparatus
GB0621184D0 (en) * 2006-10-25 2006-12-06 Rolls Royce Plc Method for treating a component of a gas turbine engine
GB2449862B (en) * 2007-06-05 2009-09-16 Rolls Royce Plc Method for producing abrasive tips for gas turbine blades
GB0822703D0 (en) * 2008-12-15 2009-01-21 Rolls Royce Plc A component having an abrasive layer and a method of applying an abrasive layer on a component
WO2010144770A1 (en) * 2009-06-12 2010-12-16 Lord Corporation Method for shielding a substrate from electromagnetic interference
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US20110123728A1 (en) * 2009-11-25 2011-05-26 Ricoh Company, Ltd. Thin film manufacturing method and thin film element
EP2616572B1 (en) * 2010-09-17 2019-07-10 Hochschule für angewandte Wissenschaften Fachhochschule Coburg Assembly and method for influencing the kinetics of chemical reactions by means of acoustic surface waves
DE102012212665A1 (en) 2012-07-19 2014-01-23 Robert Bosch Gmbh Device useful for coating a first component surface of a component, preferably a substrate for a thin-film solar cell, comprises a first liquid for coating the first component surface, and a second liquid different from the first liquid
DE102014114986A1 (en) * 2014-10-15 2016-04-21 Lpkf Laser & Electronics Ag Process for producing an electrically conductive structure and a carrier material produced by this process
JP6244296B2 (en) * 2014-12-15 2017-12-06 オリンパス株式会社 How to apply deposits
KR102458548B1 (en) 2015-06-12 2022-10-25 네오그라프 솔루션즈, 엘엘씨 Graphite Composites and Thermal Management Systems
KR102359198B1 (en) 2016-03-31 2022-02-07 네오그라프 솔루션즈, 엘엘씨 noise suppression assembly
US11246366B2 (en) 2017-05-31 2022-02-15 Nike, Inc. Selective deposition of reflective materials for an apparel item
WO2019111229A1 (en) * 2017-12-07 2019-06-13 Tesla, Inc. Coating system and method for e-coating and degasification of e-coat fluid during e-coat
CN115287644B (en) * 2022-07-18 2023-04-07 广东嘉元科技股份有限公司 Copper foil surface anti-oxidation treatment equipment and process

Family Cites Families (25)

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US2744860A (en) * 1951-11-13 1956-05-08 Robert H Rines Electroplating method
GB1304163A (en) * 1970-01-20 1973-01-24
US3733213A (en) * 1970-12-31 1973-05-15 Coppertech Inc Electroless plating of plastics and fibers
US3925138A (en) * 1973-11-27 1975-12-09 Formica Int Process for preparing an insulating substrate for use in printed circuits
US4528265A (en) * 1982-05-11 1985-07-09 Becker Robert O Processes and products involving cell modification
US4592808A (en) * 1983-09-30 1986-06-03 The Boeing Company Method for plating conductive plastics
US4960413A (en) * 1985-11-09 1990-10-02 The Shirley Institute Wound dressing
US4728323A (en) * 1986-07-24 1988-03-01 Minnesota Mining And Manufacturing Company Antimicrobial wound dressings
US5024858A (en) * 1988-07-07 1991-06-18 E. I. Du Pont De Nemours And Company Metallized polymers and method
JPH0666550B2 (en) 1988-07-12 1994-08-24 株式会社プランテックス Printed circuit board manufacturing equipment
DE3905100A1 (en) * 1989-02-20 1990-08-23 Hans Henig Method and appliance for electrolyte exchange especially in narrow recesses of large-area workpieces
ATE140948T1 (en) * 1991-03-25 1996-08-15 Du Pont ELECTROLESS METALIZATION OF ARAMID SURFACES
DE4111174A1 (en) 1991-04-06 1992-10-08 Leipzig Galvanotechnik Using electromagnet to vibrate continuous ferromagnetic wire - as it is passed through electrocoating bath to improve current density
US5279899A (en) * 1992-03-17 1994-01-18 Monsanto Company Sulfonated polyamides
RU2075557C1 (en) * 1992-05-20 1997-03-20 Фирма "Инсот" Method of electroplating
DE4322378A1 (en) 1993-07-06 1995-01-12 Hans Henig Method and device for the surface treatment, in the horizontal operating position, of workpieces which are primarily in the form of boards
US5374283A (en) * 1993-12-01 1994-12-20 Flick; A. Bart Electrical therapeutic apparatus
US5814094A (en) * 1996-03-28 1998-09-29 Becker; Robert O. Iontopheretic system for stimulation of tissue healing and regeneration
US6861570B1 (en) * 1997-09-22 2005-03-01 A. Bart Flick Multilayer conductive appliance having wound healing and analgesic properties
US6087549A (en) * 1997-09-22 2000-07-11 Argentum International Multilayer laminate wound dressing
US6333093B1 (en) * 1997-03-17 2001-12-25 Westaim Biomedical Corp. Anti-microbial coatings having indicator properties and wound dressings
US6261435B1 (en) * 1997-10-21 2001-07-17 Nihon Techno Kabushiki Kaisha Plating method
US6033622A (en) * 1998-09-21 2000-03-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making metal matrix composites
US6368482B1 (en) * 2000-09-19 2002-04-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) Plating processes utilizing high intensity acoustic beams
US6726964B1 (en) * 2001-07-11 2004-04-27 G. Alan Thompson Ultrasonic process for autocatalytic deposition of metal on microparticulate

Also Published As

Publication number Publication date
CA2343440A1 (en) 2002-01-13
US7172785B2 (en) 2007-02-06
US20040022957A1 (en) 2004-02-05
WO2002006561A2 (en) 2002-01-24
WO2002006561A3 (en) 2002-12-27

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