HUE062918T2 - Végeffektor lemez alakú hordozókhoz - Google Patents
Végeffektor lemez alakú hordozókhozInfo
- Publication number
- HUE062918T2 HUE062918T2 HUE19808783A HUE19808783A HUE062918T2 HU E062918 T2 HUE062918 T2 HU E062918T2 HU E19808783 A HUE19808783 A HU E19808783A HU E19808783 A HUE19808783 A HU E19808783A HU E062918 T2 HUE062918 T2 HU E062918T2
- Authority
- HU
- Hungary
- Prior art keywords
- end effector
- slab formed
- formed substrates
- substrates
- slab
- Prior art date
Links
- 239000012636 effector Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0033—Gripping heads and other end effectors with gripping surfaces having special shapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18208030.9A EP3657537A1 (en) | 2018-11-23 | 2018-11-23 | End effector for slab formed substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUE062918T2 true HUE062918T2 (hu) | 2023-12-28 |
Family
ID=64476939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HUE19808783A HUE062918T2 (hu) | 2018-11-23 | 2019-11-22 | Végeffektor lemez alakú hordozókhoz |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20220016787A1 (hu) |
| EP (2) | EP3657537A1 (hu) |
| JP (1) | JP7425061B2 (hu) |
| KR (1) | KR20210094594A (hu) |
| CN (1) | CN113169115B (hu) |
| HU (1) | HUE062918T2 (hu) |
| PL (1) | PL3884514T3 (hu) |
| PT (1) | PT3884514T (hu) |
| SI (1) | SI3884514T1 (hu) |
| TW (1) | TWI833844B (hu) |
| WO (1) | WO2020104639A1 (hu) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715637A (en) * | 1985-04-17 | 1987-12-29 | Hitachi, Ltd. | Grip device for sheet-like objects |
| JP2003037160A (ja) | 2001-07-23 | 2003-02-07 | Kondo Seisakusho:Kk | ウエハ搬送用ハンド |
| US6844929B2 (en) * | 2003-04-09 | 2005-01-18 | Phase Shift Technology | Apparatus and method for holding and transporting thin opaque plates |
| JP2005131729A (ja) * | 2003-10-30 | 2005-05-26 | Matsushita Electric Ind Co Ltd | 薄板材把持装置 |
| US7712808B2 (en) * | 2005-09-29 | 2010-05-11 | Brooks Automation, Inc. | End effector with centering grip |
| DE202007007721U1 (de) * | 2007-05-31 | 2007-08-09 | Jonas & Redmann Automationstechnik Gmbh | Greifer, insbesondere Bernoulli-Greifer |
| JP4883017B2 (ja) * | 2008-01-24 | 2012-02-22 | 株式会社安川電機 | 基板把持装置およびそれを備えた基板搬送ロボット、半導体製造装置 |
| JP5491834B2 (ja) * | 2009-12-01 | 2014-05-14 | 川崎重工業株式会社 | エッジグリップ装置、及びそれを備えるロボット。 |
| JP5877016B2 (ja) * | 2011-08-26 | 2016-03-02 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板反転装置および基板処理装置 |
| CN104025277A (zh) * | 2011-10-31 | 2014-09-03 | Memc电子材料有限公司 | 用于劈裂键合晶片结构的夹持装置和劈裂方法 |
| JP6800022B2 (ja) * | 2014-07-03 | 2020-12-16 | エルピーイー ソシエタ ペル アチオニ | 基板を操作するためのツール、操作方法およびエピタキシャル反応器 |
| NL2018243B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector |
-
2018
- 2018-11-23 EP EP18208030.9A patent/EP3657537A1/en not_active Withdrawn
-
2019
- 2019-11-22 US US17/294,738 patent/US20220016787A1/en active Pending
- 2019-11-22 SI SI201930624T patent/SI3884514T1/sl unknown
- 2019-11-22 PT PT198087835T patent/PT3884514T/pt unknown
- 2019-11-22 EP EP19808783.5A patent/EP3884514B1/en active Active
- 2019-11-22 JP JP2021528990A patent/JP7425061B2/ja active Active
- 2019-11-22 WO PCT/EP2019/082193 patent/WO2020104639A1/en unknown
- 2019-11-22 PL PL19808783.5T patent/PL3884514T3/pl unknown
- 2019-11-22 TW TW108142483A patent/TWI833844B/zh active
- 2019-11-22 KR KR1020217018987A patent/KR20210094594A/ko not_active Application Discontinuation
- 2019-11-22 HU HUE19808783A patent/HUE062918T2/hu unknown
- 2019-11-22 CN CN201980081850.XA patent/CN113169115B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| PL3884514T3 (pl) | 2023-11-27 |
| PT3884514T (pt) | 2023-09-19 |
| JP2022507924A (ja) | 2022-01-18 |
| CN113169115A (zh) | 2021-07-23 |
| EP3884514B1 (en) | 2023-06-21 |
| WO2020104639A1 (en) | 2020-05-28 |
| EP3884514A1 (en) | 2021-09-29 |
| KR20210094594A (ko) | 2021-07-29 |
| TWI833844B (zh) | 2024-03-01 |
| US20220016787A1 (en) | 2022-01-20 |
| EP3657537A1 (en) | 2020-05-27 |
| SI3884514T1 (sl) | 2023-11-30 |
| JP7425061B2 (ja) | 2024-01-30 |
| CN113169115B (zh) | 2023-08-08 |
| TW202036781A (zh) | 2020-10-01 |
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