PL3884514T3 - Chwytak końcowy dla podłoży uformowanych w kształt płytki - Google Patents

Chwytak końcowy dla podłoży uformowanych w kształt płytki

Info

Publication number
PL3884514T3
PL3884514T3 PL19808783.5T PL19808783T PL3884514T3 PL 3884514 T3 PL3884514 T3 PL 3884514T3 PL 19808783 T PL19808783 T PL 19808783T PL 3884514 T3 PL3884514 T3 PL 3884514T3
Authority
PL
Poland
Prior art keywords
end effector
slab formed
formed substrates
substrates
slab
Prior art date
Application number
PL19808783.5T
Other languages
English (en)
Inventor
Steffen Pollack
Siegfried Ickert
Original Assignee
Atotech Deutschland GmbH & Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH & Co. KG filed Critical Atotech Deutschland GmbH & Co. KG
Publication of PL3884514T3 publication Critical patent/PL3884514T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0033—Gripping heads and other end effectors with gripping surfaces having special shapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PL19808783.5T 2018-11-23 2019-11-22 Chwytak końcowy dla podłoży uformowanych w kształt płytki PL3884514T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18208030.9A EP3657537A1 (en) 2018-11-23 2018-11-23 End effector for slab formed substrates
PCT/EP2019/082193 WO2020104639A1 (en) 2018-11-23 2019-11-22 End effector for slab formed substrates

Publications (1)

Publication Number Publication Date
PL3884514T3 true PL3884514T3 (pl) 2023-11-27

Family

ID=64476939

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19808783.5T PL3884514T3 (pl) 2018-11-23 2019-11-22 Chwytak końcowy dla podłoży uformowanych w kształt płytki

Country Status (11)

Country Link
US (1) US12115654B2 (pl)
EP (2) EP3657537A1 (pl)
JP (1) JP7425061B2 (pl)
KR (1) KR20210094594A (pl)
CN (1) CN113169115B (pl)
HU (1) HUE062918T2 (pl)
PL (1) PL3884514T3 (pl)
PT (1) PT3884514T (pl)
SI (1) SI3884514T1 (pl)
TW (1) TWI833844B (pl)
WO (1) WO2020104639A1 (pl)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198501B1 (en) * 1985-04-17 1992-07-01 Hitachi, Ltd. Gripping device
JP2003037160A (ja) 2001-07-23 2003-02-07 Kondo Seisakusho:Kk ウエハ搬送用ハンド
US6844929B2 (en) * 2003-04-09 2005-01-18 Phase Shift Technology Apparatus and method for holding and transporting thin opaque plates
JP2005131729A (ja) * 2003-10-30 2005-05-26 Matsushita Electric Ind Co Ltd 薄板材把持装置
US7712808B2 (en) * 2005-09-29 2010-05-11 Brooks Automation, Inc. End effector with centering grip
DE202007007721U1 (de) * 2007-05-31 2007-08-09 Jonas & Redmann Automationstechnik Gmbh Greifer, insbesondere Bernoulli-Greifer
JP4883017B2 (ja) 2008-01-24 2012-02-22 株式会社安川電機 基板把持装置およびそれを備えた基板搬送ロボット、半導体製造装置
JP5491834B2 (ja) * 2009-12-01 2014-05-14 川崎重工業株式会社 エッジグリップ装置、及びそれを備えるロボット。
CN102935942B (zh) * 2011-08-16 2015-03-04 中芯国际集成电路制造(北京)有限公司 电控操作器
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
KR102061359B1 (ko) * 2011-10-31 2019-12-31 글로벌웨이퍼스 씨오., 엘티디. 본딩된 웨이퍼 구조물 절개를 위한 클램핑 장치 및 절개 방법
WO2016001863A1 (en) * 2014-07-03 2016-01-07 Lpe S.P.A. Tool for manipulating substrates, manipulation method and epitaxial reactor
JP6480905B2 (ja) * 2016-12-26 2019-03-13 ファナック株式会社 ロボットハンド
NL2018243B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector
WO2022087360A1 (en) * 2020-10-23 2022-04-28 Massachusetts Institute Of Technology Learning physical features from tactile robotic exploration
US11643285B1 (en) * 2021-11-09 2023-05-09 Fu-Han Wei Automatic picking fixture device

Also Published As

Publication number Publication date
EP3884514B1 (en) 2023-06-21
JP7425061B2 (ja) 2024-01-30
KR20210094594A (ko) 2021-07-29
SI3884514T1 (sl) 2023-11-30
EP3884514A1 (en) 2021-09-29
HUE062918T2 (hu) 2023-12-28
CN113169115A (zh) 2021-07-23
EP3657537A1 (en) 2020-05-27
US12115654B2 (en) 2024-10-15
CN113169115B (zh) 2023-08-08
WO2020104639A1 (en) 2020-05-28
TWI833844B (zh) 2024-03-01
US20220016787A1 (en) 2022-01-20
PT3884514T (pt) 2023-09-19
TW202036781A (zh) 2020-10-01
JP2022507924A (ja) 2022-01-18

Similar Documents

Publication Publication Date Title
IL277006A (en) CD73 inhibitors
EP3843714A4 (en) CD73 INHIBITORS
EP3793547A4 (en) MAGL INHIBITORS
IL304348A (en) cd73 inhibitors
SG11202104211XA (en) Robot
EP3643265C0 (en) RELAXED MODE FOR ROBOT
IL291119A (en) Etching compounds
GB201812408D0 (en) Manipulator
EP3819275A4 (en) BRICK
GB2591071B (en) End effector
SI3884514T1 (sl) Končni efektor za substrate v obliki plošče
GB2591847B (en) Actuator
GB2581847B (en) End effector
GB2580198B (en) Actuator
GB201818075D0 (en) Actuator
GB201812316D0 (en) Actuator
CA201618S (en) Actuator
CA188791S (en) Actuator
CA187418S (en) Patterned substrate
EP3835621C0 (de) Stellantrieb
GB2582925B (en) Microscope
GB202114243D0 (en) Roatary actuator
GB2579354B (en) General purpose actuator
GB2575317B (en) Actuator
GB201818242D0 (en) Robot