HUE061926T2 - Eljárás ultrahangos huzalkötõ üzemeltetésére aktív és passzív rezgéscsillapítással - Google Patents

Eljárás ultrahangos huzalkötõ üzemeltetésére aktív és passzív rezgéscsillapítással

Info

Publication number
HUE061926T2
HUE061926T2 HUE16828922A HUE16828922A HUE061926T2 HU E061926 T2 HUE061926 T2 HU E061926T2 HU E16828922 A HUE16828922 A HU E16828922A HU E16828922 A HUE16828922 A HU E16828922A HU E061926 T2 HUE061926 T2 HU E061926T2
Authority
HU
Hungary
Prior art keywords
active
vibration damping
wire bonding
passive vibration
ultrasonic wire
Prior art date
Application number
HUE16828922A
Other languages
English (en)
Inventor
Matthias Hunstig
Michael Broekelmann
Original Assignee
Hesse Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse Gmbh filed Critical Hesse Gmbh
Publication of HUE061926T2 publication Critical patent/HUE061926T2/hu

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/75347—Piezoelectric transducers
    • H01L2224/75349—Piezoelectric transducers in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
HUE16828922A 2015-12-01 2016-11-24 Eljárás ultrahangos huzalkötõ üzemeltetésére aktív és passzív rezgéscsillapítással HUE061926T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102015120824.5A DE102015120824A1 (de) 2015-12-01 2015-12-01 Betriebsverfahren für einen Ultraschalldrahtbonder

Publications (1)

Publication Number Publication Date
HUE061926T2 true HUE061926T2 (hu) 2023-08-28

Family

ID=57850825

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE16828922A HUE061926T2 (hu) 2015-12-01 2016-11-24 Eljárás ultrahangos huzalkötõ üzemeltetésére aktív és passzív rezgéscsillapítással

Country Status (5)

Country Link
US (1) US10960488B2 (hu)
EP (1) EP3383574B1 (hu)
DE (1) DE102015120824A1 (hu)
HU (1) HUE061926T2 (hu)
WO (1) WO2017092730A1 (hu)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN110011164B (zh) * 2019-04-24 2020-06-09 江西远大科技有限公司 一种10kV大容量架空线路引线对接新方法
US11610860B2 (en) * 2019-09-19 2023-03-21 Kabushiki Kaisha Toshiba Wire bonding apparatus and wire bonding method
US20220187353A1 (en) * 2020-12-16 2022-06-16 Kulicke And Soffa Industries, Inc. Methods of detecting connection issues between a wire bonding tool and an ultrasonic transducer of a wire bonding machine

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY104152A (en) * 1988-08-12 1994-02-28 Mitsui Chemicals Inc Processes for producing semiconductor devices.
JP2736914B2 (ja) * 1989-03-06 1998-04-08 株式会社新川 ワイヤボンデイング方法
JP3128715B2 (ja) * 1992-12-24 2001-01-29 株式会社新川 ボンデイング装置
JP2601755B2 (ja) * 1993-01-08 1997-04-16 新日本製鐵株式会社 ワイヤボンディング装置及びワイヤの接合方法
JP3292770B2 (ja) * 1993-12-15 2002-06-17 株式会社富士通宮城エレクトロニクス ワイヤボンディング方法およびその装置
JPH07221141A (ja) * 1994-02-03 1995-08-18 Matsushita Electric Ind Co Ltd 超音波ワイヤボンディング装置
DE10314499B4 (de) 2003-03-27 2005-03-10 Angewandte Physik Mbh Ges Vorrichtung zum Drahtbonden
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.
US20090127317A1 (en) * 2007-11-15 2009-05-21 Infineon Technologies Ag Device and method for producing a bonding connection
DE102009003312A1 (de) * 2008-10-14 2010-04-15 Hesse & Knipps Gmbh Bondvorrichtung, Ultraschall-Transducer und Bondverfahren
US7810699B1 (en) 2009-04-22 2010-10-12 Gm Global Technology Operations, Inc. Method and system for optimized vibration welding
US8288876B2 (en) * 2010-05-14 2012-10-16 Continental Automotive Systems, Inc. Bonding wire profile for minimizing vibration fatigue failure
DE102013012716B4 (de) 2013-08-01 2022-07-14 Sew-Eurodrive Gmbh & Co Kg Verfahren zum Steuern, insbesondere Dämpfen, einer mechanischen Schwingung eines Svstems

Also Published As

Publication number Publication date
DE102015120824A1 (de) 2017-06-01
US10960488B2 (en) 2021-03-30
EP3383574A1 (de) 2018-10-10
EP3383574B1 (de) 2023-01-04
WO2017092730A1 (de) 2017-06-08
US20180369952A1 (en) 2018-12-27

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