HUE052217T2 - Eljárás és megmunkáló berendezés - Google Patents

Eljárás és megmunkáló berendezés

Info

Publication number
HUE052217T2
HUE052217T2 HUE17787030A HUE17787030A HUE052217T2 HU E052217 T2 HUE052217 T2 HU E052217T2 HU E17787030 A HUE17787030 A HU E17787030A HU E17787030 A HUE17787030 A HU E17787030A HU E052217 T2 HUE052217 T2 HU E052217T2
Authority
HU
Hungary
Prior art keywords
machining apparatus
machining
Prior art date
Application number
HUE17787030A
Other languages
English (en)
Inventor
Massimiliano Sale
Original Assignee
Manz Italy Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manz Italy Srl filed Critical Manz Italy Srl
Publication of HUE052217T2 publication Critical patent/HUE052217T2/hu

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/006—Feeding elongated articles, such as tubes, bars, or profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Press Drives And Press Lines (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Secondary Cells (AREA)
  • Control Of Presses (AREA)
  • Shearing Machines (AREA)
HUE17787030A 2016-10-19 2017-10-13 Eljárás és megmunkáló berendezés HUE052217T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102016000105300A IT201600105300A1 (it) 2016-10-19 2016-10-19 Metodo e apparato di lavorazione

Publications (1)

Publication Number Publication Date
HUE052217T2 true HUE052217T2 (hu) 2021-04-28

Family

ID=58054405

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE17787030A HUE052217T2 (hu) 2016-10-19 2017-10-13 Eljárás és megmunkáló berendezés

Country Status (9)

Country Link
US (1) US20190255591A1 (hu)
EP (1) EP3529829B1 (hu)
JP (1) JP2020500109A (hu)
KR (1) KR20190064620A (hu)
CN (1) CN109844926A (hu)
HU (1) HUE052217T2 (hu)
IT (1) IT201600105300A1 (hu)
PL (1) PL3529829T3 (hu)
WO (1) WO2018073709A1 (hu)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112607497A (zh) * 2020-12-07 2021-04-06 机械工业第九设计研究院有限公司 撕胶带机构

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523142B1 (hu) * 1969-04-19 1977-01-26
JP3164863B2 (ja) * 1991-12-06 2001-05-14 株式会社アマダ 形鋼の穴明け・切断装置
US5277571A (en) * 1992-07-17 1994-01-11 George Schmitt & Co., Inc. Apparatus for perforation of a sheet material
US5799858A (en) * 1995-09-16 1998-09-01 Samsung Aerospace Industries, Ltd. Die bonding device
JPH09108898A (ja) * 1995-10-18 1997-04-28 Orii Corp コイル材の自動加工装置
US6739447B2 (en) * 2002-03-06 2004-05-25 Jan Josef Verhaeghe Multi-cell reciprocating conveyor slat and method of manufacture and non-continuous guide structure
EP1587138B1 (de) * 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
JP4935575B2 (ja) * 2006-12-11 2012-05-23 日産自動車株式会社 トリミング装置およびトリミング方法
ATE519553T1 (de) * 2007-06-27 2011-08-15 Sica Spa Methode zum ablängen von kontinuierlich extrudierten rohren in vorbestimmte längen.
US9099511B2 (en) * 2009-10-13 2015-08-04 M-Solv Limited Apparatus and method for processing long, continuous flexible substrates
JP5654831B2 (ja) * 2010-10-18 2015-01-14 株式会社セーコウ 穿孔装置及びこれを備えた画像形成装置
KR101271492B1 (ko) * 2010-12-02 2013-06-05 주식회사 엘지화학 신규한 전극시트 커팅 장치 및 이를 사용하여 생산되는 이차전지
KR101326630B1 (ko) * 2010-12-02 2013-11-07 주식회사 엘지화학 신규한 노칭 장치 및 이를 사용하여 생산되는 이차전지
IT1403981B1 (it) * 2011-02-17 2013-11-08 Kemet Electronics Italia S R L Apparato di taglio
JP5361967B2 (ja) * 2011-09-28 2013-12-04 三星ダイヤモンド工業株式会社 基板の溝加工ツール
JP2013179035A (ja) * 2012-01-31 2013-09-09 Nissan Motor Co Ltd 非双極型電池の製造方法、および非双極型電池の製造装置
JP5796525B2 (ja) * 2012-03-28 2015-10-21 三菱マテリアル株式会社 電池用電極のプレス方法及びそのプレス装置
JP2016021560A (ja) * 2014-06-20 2016-02-04 株式会社半導体エネルギー研究所 剥離装置
CN105537445B (zh) * 2016-02-29 2017-12-12 长江大学 一种自动连续冲压全程自动化设备

Also Published As

Publication number Publication date
US20190255591A1 (en) 2019-08-22
CN109844926A (zh) 2019-06-04
EP3529829A1 (en) 2019-08-28
PL3529829T3 (pl) 2020-12-28
IT201600105300A1 (it) 2018-04-19
EP3529829B1 (en) 2020-08-12
KR20190064620A (ko) 2019-06-10
JP2020500109A (ja) 2020-01-09
WO2018073709A1 (en) 2018-04-26

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