HK85686A - Electroless direct deposition of gold on metallized ceramics - Google Patents

Electroless direct deposition of gold on metallized ceramics

Info

Publication number
HK85686A
HK85686A HK856/86A HK85686A HK85686A HK 85686 A HK85686 A HK 85686A HK 856/86 A HK856/86 A HK 856/86A HK 85686 A HK85686 A HK 85686A HK 85686 A HK85686 A HK 85686A
Authority
HK
Hong Kong
Prior art keywords
gold
direct deposition
metallized ceramics
electroless
electroless direct
Prior art date
Application number
HK856/86A
Other languages
English (en)
Inventor
Alan A Halechy
Mohamed F El-Shazly
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of HK85686A publication Critical patent/HK85686A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
HK856/86A 1982-12-01 1986-11-13 Electroless direct deposition of gold on metallized ceramics HK85686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/445,126 US4474838A (en) 1982-12-01 1982-12-01 Electroless direct deposition of gold on metallized ceramics

Publications (1)

Publication Number Publication Date
HK85686A true HK85686A (en) 1986-11-21

Family

ID=23767702

Family Applications (1)

Application Number Title Priority Date Filing Date
HK856/86A HK85686A (en) 1982-12-01 1986-11-13 Electroless direct deposition of gold on metallized ceramics

Country Status (12)

Country Link
US (1) US4474838A (xx)
JP (1) JPS59107069A (xx)
AU (1) AU551152B2 (xx)
BR (1) BR8306600A (xx)
CA (1) CA1205604A (xx)
DE (1) DE3343052C2 (xx)
FR (1) FR2537162B1 (xx)
GB (1) GB2133046B (xx)
HK (1) HK85686A (xx)
IT (1) IT1221490B (xx)
MX (1) MX159989A (xx)
NL (1) NL8304104A (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590095A (en) * 1985-06-03 1986-05-20 General Electric Company Nickel coating diffusion bonded to metallized ceramic body and coating method
US5202151A (en) * 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
DE4024764C1 (xx) * 1990-08-02 1991-10-10 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
US5194295A (en) * 1991-06-21 1993-03-16 General Electric Company Ceramic articles having heat-sealable metallic coatings and method of preparation
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
JP4887583B2 (ja) * 2001-08-09 2012-02-29 Ｄｏｗａメタルテック株式会社 セラミックス回路基板の製造方法
JP7457537B2 (ja) * 2020-03-06 2024-03-28 関東化学株式会社 無電解金めっき用組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2654702A (en) * 1948-09-03 1953-10-06 Dow Chemical Co Electrodepostion of metal from alkaline cyanide bath
US3214292A (en) * 1962-09-12 1965-10-26 Western Electric Co Gold plating
US3862850A (en) * 1973-06-08 1975-01-28 Ceramic Systems Electroless gold plating on refractory metals
US3917885A (en) * 1974-04-26 1975-11-04 Engelhard Min & Chem Electroless gold plating process
US4082908A (en) * 1976-05-05 1978-04-04 Burr-Brown Research Corporation Gold plating process and product produced thereby
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
JPS5729545A (en) * 1980-07-30 1982-02-17 Sumitomo Chem Co Ltd Fiber reinforced metallic composite material
DE3029785A1 (de) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures goldbad zur stromlosen abscheidung von gold
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
JPS5817256A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 圧力容器

Also Published As

Publication number Publication date
GB8332076D0 (en) 1984-01-11
DE3343052A1 (de) 1984-06-07
CA1205604A (en) 1986-06-10
FR2537162A1 (fr) 1984-06-08
JPH0356310B2 (xx) 1991-08-27
IT8349397A0 (it) 1983-11-29
AU551152B2 (en) 1986-04-17
MX159989A (es) 1989-10-20
GB2133046A (en) 1984-07-18
AU2186683A (en) 1984-06-07
US4474838A (en) 1984-10-02
BR8306600A (pt) 1984-07-10
NL8304104A (nl) 1984-07-02
GB2133046B (en) 1985-11-20
JPS59107069A (ja) 1984-06-21
IT1221490B (it) 1990-07-06
DE3343052C2 (de) 1985-10-03
FR2537162B1 (fr) 1986-12-19

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