HK75286A - A solution for the electroless deposition of gold-alloys onto a substrate - Google Patents
A solution for the electroless deposition of gold-alloys onto a substrateInfo
- Publication number
- HK75286A HK75286A HK752/86A HK75286A HK75286A HK 75286 A HK75286 A HK 75286A HK 752/86 A HK752/86 A HK 752/86A HK 75286 A HK75286 A HK 75286A HK 75286 A HK75286 A HK 75286A
- Authority
- HK
- Hong Kong
- Prior art keywords
- gold
- solution
- substrate
- electroless deposition
- complex
- Prior art date
Links
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 2
- 230000008021 deposition Effects 0.000 title abstract 2
- 239000003353 gold alloy Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title abstract 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 230000000536 complexating effect Effects 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 229910001431 copper ion Inorganic materials 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- 150000004699 copper complex Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8103174A NL8103174A (nl) | 1981-07-02 | 1981-07-02 | Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK75286A true HK75286A (en) | 1986-10-17 |
Family
ID=19837727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK752/86A HK75286A (en) | 1981-07-02 | 1986-10-09 | A solution for the electroless deposition of gold-alloys onto a substrate |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0070061B1 (ko) |
| JP (1) | JPS586967A (ko) |
| KR (1) | KR880002601B1 (ko) |
| AT (1) | ATE17502T1 (ko) |
| CA (1) | CA1206818A (ko) |
| DE (1) | DE3268530D1 (ko) |
| HK (1) | HK75286A (ko) |
| NL (1) | NL8103174A (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2538043B2 (ja) * | 1989-04-05 | 1996-09-25 | 松下電器産業株式会社 | パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1258699B (de) * | 1959-06-30 | 1968-01-11 | Clevite Corp | Alkalisches, waessriges Bad zum stromlosen Plattieren mit Kupfer |
| US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
| US3468676A (en) * | 1963-09-09 | 1969-09-23 | Photocircuits Corp | Electroless gold plating |
| SE361056B (ko) * | 1969-10-30 | 1973-10-15 | Western Electric Co | |
| GB2083080A (en) * | 1981-09-01 | 1982-03-17 | Philips Nv | Electroless deposition of copper alloy layers |
-
1981
- 1981-07-02 NL NL8103174A patent/NL8103174A/nl not_active Application Discontinuation
-
1982
- 1982-06-29 JP JP57110907A patent/JPS586967A/ja active Granted
- 1982-06-29 KR KR8202904A patent/KR880002601B1/ko active
- 1982-06-30 CA CA000406336A patent/CA1206818A/en not_active Expired
- 1982-06-30 DE DE8282200808T patent/DE3268530D1/de not_active Expired
- 1982-06-30 EP EP82200808A patent/EP0070061B1/en not_active Expired
- 1982-06-30 AT AT82200808T patent/ATE17502T1/de not_active IP Right Cessation
-
1986
- 1986-10-09 HK HK752/86A patent/HK75286A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE3268530D1 (en) | 1986-02-27 |
| EP0070061B1 (en) | 1986-01-15 |
| EP0070061A1 (en) | 1983-01-19 |
| CA1206818A (en) | 1986-07-02 |
| ATE17502T1 (de) | 1986-02-15 |
| JPS586967A (ja) | 1983-01-14 |
| KR880002601B1 (ko) | 1988-12-03 |
| JPH0216385B2 (ko) | 1990-04-17 |
| NL8103174A (nl) | 1983-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1121282A (en) | Process for stabilizing autocatalytic metal plating solutions | |
| DE3278597D1 (en) | Process for forming self-aligned metallization patterns for semiconductor devices | |
| PL320138A1 (en) | Method of and solution for obtaining a conversive coating on metal surface | |
| SE8203085L (sv) | Badkomposition for stromfri guldpletering | |
| FR2575187B1 (fr) | Composition et procede pour le depot non-electrolytique de cuivre sur un substrat avec son procede de regarnissage, et substrat ainsi obtenu | |
| DE3465888D1 (en) | Small particle formation and encapsulation | |
| DE3072031D1 (en) | Process for producing a solder connection between a semiconductor device and a carrier substrate, and a semiconductor device made by such method | |
| IE822299L (en) | Bismuth containing composition | |
| DE3268530D1 (en) | A solution for the electroless deposition of gold-alloys onto a substrate | |
| US4701350B1 (en) | Process for electroless metal deposition | |
| JPS53134759A (en) | Production of copmosite metal powder | |
| DE3266912D1 (en) | Method for producing metal layers on substrates by electroless plating techniques | |
| ES8502741A1 (es) | Procedimiento para la deposicion galvanica de aleaciones de oro | |
| ES8106241A1 (es) | Procedimiento para el tratamiento de soluciones de cloruro de plomo | |
| JPS56136970A (en) | Chemical copper plating bath | |
| JPS6483688A (en) | Solution for retaining surface activity of electroless copper plating layer | |
| JPS5798665A (en) | Method for plating on ferrite material | |
| Fellman et al. | Bright Zinc Electroplating Bath and Method | |
| JPS53101975A (en) | Treating method of semiconductor substrates | |
| JPS51151781A (en) | Process for manufacturing laminated boards for chemical plating | |
| JPS5343672A (en) | Treating method of cyanogenic galvanizing waste liquid containing zinc ion | |
| JPS57188665A (en) | Electroless plating method | |
| JPS5426580A (en) | Method of machining surrounding of metal lining-laminated plate | |
| Okinaka et al. | Preparation of Gold Cyanide | |
| JPS5396995A (en) | Production of precipitated film of cadmium sulfide |