JPS57188665A - Electroless plating method - Google Patents
Electroless plating methodInfo
- Publication number
- JPS57188665A JPS57188665A JP7272481A JP7272481A JPS57188665A JP S57188665 A JPS57188665 A JP S57188665A JP 7272481 A JP7272481 A JP 7272481A JP 7272481 A JP7272481 A JP 7272481A JP S57188665 A JPS57188665 A JP S57188665A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- range
- ions
- metallic ions
- concns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To deposit dense electroless plating films having no pinholes by replenishing metallic ions, hypophosphite ions, carboxylic acids and a pH controller respectively thereby maintaining their respective concsn. and pH in a specific range and performing electroless plating.
CONSTITUTION: Plating is applied with an electroless plating soln. using hypophosphite as a reducing agent and carboxylic acids as a main complexing agent. Here, the electroless plating soln. of which the concns. of metallic ions is set at 2W3.8g/l, the concn. of hypophosphite ions at 1.5W3.5 times mole the set values for the metallic ions and the concns. of carboxylic acids in the range of 0.5W5 times mole the set values for the metallic ions is used. The concns. of the metallic ions are maintained always within the range of ±0.6g/l of the above- mentioned set values and in the range not exceeding 3.8g/l by replenishing metallic ions in the soln. Hypophosphite ions and, if necessary, carboxylic acids are replenished respectively to maintain the concns. thereof always in the set range; further a pH controlling agent is replenished to maintain the pH always in the range within ±0.6 of the set values, whereby the electroless plating is accomplished.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7272481A JPS57188665A (en) | 1981-05-14 | 1981-05-14 | Electroless plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7272481A JPS57188665A (en) | 1981-05-14 | 1981-05-14 | Electroless plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57188665A true JPS57188665A (en) | 1982-11-19 |
Family
ID=13497582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7272481A Pending JPS57188665A (en) | 1981-05-14 | 1981-05-14 | Electroless plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57188665A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005501964A (en) * | 2001-08-31 | 2005-01-20 | マクダーミド・インコーポレーテツド | Electroless nickel plating solution and use thereof |
JP2006507404A (en) * | 2002-06-21 | 2006-03-02 | マットソン テクノロジイ インコーポレイテッド | Temperature control procedure for electroless plating bath |
-
1981
- 1981-05-14 JP JP7272481A patent/JPS57188665A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005501964A (en) * | 2001-08-31 | 2005-01-20 | マクダーミド・インコーポレーテツド | Electroless nickel plating solution and use thereof |
JP2006507404A (en) * | 2002-06-21 | 2006-03-02 | マットソン テクノロジイ インコーポレイテッド | Temperature control procedure for electroless plating bath |
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