JPS57188665A - Electroless plating method - Google Patents

Electroless plating method

Info

Publication number
JPS57188665A
JPS57188665A JP7272481A JP7272481A JPS57188665A JP S57188665 A JPS57188665 A JP S57188665A JP 7272481 A JP7272481 A JP 7272481A JP 7272481 A JP7272481 A JP 7272481A JP S57188665 A JPS57188665 A JP S57188665A
Authority
JP
Japan
Prior art keywords
electroless plating
range
ions
metallic ions
concns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7272481A
Other languages
Japanese (ja)
Inventor
Ken Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP7272481A priority Critical patent/JPS57188665A/en
Publication of JPS57188665A publication Critical patent/JPS57188665A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To deposit dense electroless plating films having no pinholes by replenishing metallic ions, hypophosphite ions, carboxylic acids and a pH controller respectively thereby maintaining their respective concsn. and pH in a specific range and performing electroless plating.
CONSTITUTION: Plating is applied with an electroless plating soln. using hypophosphite as a reducing agent and carboxylic acids as a main complexing agent. Here, the electroless plating soln. of which the concns. of metallic ions is set at 2W3.8g/l, the concn. of hypophosphite ions at 1.5W3.5 times mole the set values for the metallic ions and the concns. of carboxylic acids in the range of 0.5W5 times mole the set values for the metallic ions is used. The concns. of the metallic ions are maintained always within the range of ±0.6g/l of the above- mentioned set values and in the range not exceeding 3.8g/l by replenishing metallic ions in the soln. Hypophosphite ions and, if necessary, carboxylic acids are replenished respectively to maintain the concns. thereof always in the set range; further a pH controlling agent is replenished to maintain the pH always in the range within ±0.6 of the set values, whereby the electroless plating is accomplished.
COPYRIGHT: (C)1982,JPO&Japio
JP7272481A 1981-05-14 1981-05-14 Electroless plating method Pending JPS57188665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7272481A JPS57188665A (en) 1981-05-14 1981-05-14 Electroless plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7272481A JPS57188665A (en) 1981-05-14 1981-05-14 Electroless plating method

Publications (1)

Publication Number Publication Date
JPS57188665A true JPS57188665A (en) 1982-11-19

Family

ID=13497582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7272481A Pending JPS57188665A (en) 1981-05-14 1981-05-14 Electroless plating method

Country Status (1)

Country Link
JP (1) JPS57188665A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005501964A (en) * 2001-08-31 2005-01-20 マクダーミド・インコーポレーテツド Electroless nickel plating solution and use thereof
JP2006507404A (en) * 2002-06-21 2006-03-02 マットソン テクノロジイ インコーポレイテッド Temperature control procedure for electroless plating bath

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005501964A (en) * 2001-08-31 2005-01-20 マクダーミド・インコーポレーテツド Electroless nickel plating solution and use thereof
JP2006507404A (en) * 2002-06-21 2006-03-02 マットソン テクノロジイ インコーポレイテッド Temperature control procedure for electroless plating bath

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