HK68097A - Surface hardened platinum and palladium alloy articles and process for producing the same - Google Patents

Surface hardened platinum and palladium alloy articles and process for producing the same

Info

Publication number
HK68097A
HK68097A HK68097A HK68097A HK68097A HK 68097 A HK68097 A HK 68097A HK 68097 A HK68097 A HK 68097A HK 68097 A HK68097 A HK 68097A HK 68097 A HK68097 A HK 68097A
Authority
HK
Hong Kong
Prior art keywords
producing
same
palladium alloy
surface hardened
alloy articles
Prior art date
Application number
HK68097A
Other languages
English (en)
Inventor
Wolfgang Weber
Hans-Hermann Dr Beyer
Klaus Dr Zimmermann
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa filed Critical Degussa
Publication of HK68097A publication Critical patent/HK68097A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/60—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using solids, e.g. powders, pastes
    • C23C8/62—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using solids, e.g. powders, pastes only one element being applied
    • C23C8/68—Boronising

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Adornments (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
HK68097A 1993-04-23 1997-05-22 Surface hardened platinum and palladium alloy articles and process for producing the same HK68097A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4313272A DE4313272C1 (de) 1993-04-23 1993-04-23 Oberflächen gehärtete Gegenstände aus Platin- und Palladiumlegierungen und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
HK68097A true HK68097A (en) 1997-05-30

Family

ID=6486166

Family Applications (1)

Application Number Title Priority Date Filing Date
HK68097A HK68097A (en) 1993-04-23 1997-05-22 Surface hardened platinum and palladium alloy articles and process for producing the same

Country Status (6)

Country Link
US (1) US5518556A (xx)
EP (1) EP0621349B1 (xx)
JP (1) JP3048833B2 (xx)
AT (1) ATE136063T1 (xx)
DE (2) DE4313272C1 (xx)
HK (1) HK68097A (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2987314B2 (ja) 1994-08-11 1999-12-06 田崎真珠株式会社 プラチナまたはプラチナ合金の硬化方法、およびパラジウムまたはパラジウム合金の硬化方法
US6764561B1 (en) 2000-05-19 2004-07-20 The United States Of America As Represented By The Secretary Of The Navy Palladium-boron alloys and methods for making and using such alloys
US6465391B1 (en) 2000-08-22 2002-10-15 Phillips Petroleum Company Selective hydrogenation catalyst and processes therefor and therewith
US6734130B2 (en) * 2001-09-07 2004-05-11 Chvron Phillips Chemical Company Lp Hydrocarbon hydrogenation catalyst composition, a process of treating such catalyst composition, and a process of using such catalyst composition
US7354488B2 (en) * 2004-05-10 2008-04-08 Deringer-Ney, Inc. Palladium alloy
JP5076601B2 (ja) * 2006-06-02 2012-11-21 株式会社豊田中央研究所 導電性耐食材料の製造方法
WO2007142007A1 (ja) * 2006-06-02 2007-12-13 Kabushiki Kaisha Toyota Chuo Kenkyusho 導電性耐食材料及びその製造方法
JP5236876B2 (ja) * 2006-12-25 2013-07-17 株式会社パイロットコーポレーション 装飾用リング
US8187393B2 (en) * 2008-05-28 2012-05-29 Universal Global Products, LLC Boronization process and composition with improved surface characteristics of metals
US8613807B2 (en) * 2009-02-06 2013-12-24 Kabushiki Kaisha Toyota Chuo Kenkyusho Conductive film, corrosion-resistant conduction film, corrosion-resistant conduction material and process for producing the same
DE102009012676A1 (de) * 2009-03-13 2010-09-16 W.C. Heraeus Gmbh Behandlung borhaltiger Legierungen auf Basis von Metallen der Platingruppe
JP5755514B2 (ja) * 2011-06-16 2015-07-29 株式会社パイロットコーポレーション パラジウム合金の製造方法
US10106869B2 (en) 2011-05-02 2018-10-23 Ecole Polytechnique Federale De Lausanne (Epfl) Platinum based alloys
EP3121297B1 (fr) 2015-07-23 2020-12-16 Cartier International AG Procédé d'obtention d'un composant d'ornement en alliage de platine
JP6322300B1 (ja) * 2017-01-06 2018-05-09 株式会社エーアイ 白金加工品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE586622C (de) * 1930-09-14 1933-10-23 Heraeus Gmbh W C Verfahren zur Herstellung von Platinmetallformstuecken
DE2633137C2 (de) * 1976-07-23 1983-12-01 Degussa Ag, 6000 Frankfurt Borierungsmittel zum Borieren von Massenteilen aus Eisen und Nichteisenmetallen
JPS5681646A (en) * 1979-12-08 1981-07-03 Tanaka Kikinzoku Kogyo Kk Platinum alloy for accessory
JPS5923835A (ja) * 1982-07-28 1984-02-07 Toyota Central Res & Dev Lab Inc 硼化物分散合金の製造方法
JPS59104467A (ja) * 1982-12-06 1984-06-16 Mitsubishi Metal Corp 装飾用表面硬化Ａｕ合金部材
JPS59143032A (ja) * 1983-02-04 1984-08-16 Mitsubishi Metal Corp 装飾用表面硬化Ｐｔ合金部材
JPS6154109A (ja) * 1984-08-24 1986-03-18 株式会社フジクラ 難着氷架空電線
JPS622627A (ja) * 1985-06-28 1987-01-08 Toshiba Corp 半導体集積回路
GB8629728D0 (en) * 1986-12-12 1987-01-21 Johnson Matthey Plc Scratch resistant surface layer
US4960647A (en) * 1989-05-22 1990-10-02 Johnson Matthey Inc. Process for the reactive treating of palladium to form a protective coating and article
JPH03188232A (ja) * 1989-12-14 1991-08-16 Seiko Instr Inc 表面硬化カラーパラジウム合金
JPH03188231A (ja) * 1989-12-14 1991-08-16 Seiko Instr Inc 表面硬化カラー白金合金

Also Published As

Publication number Publication date
EP0621349B1 (de) 1996-03-27
DE4313272C1 (de) 1994-05-05
ATE136063T1 (de) 1996-04-15
DE59302056D1 (de) 1996-05-02
EP0621349A1 (de) 1994-10-26
US5518556A (en) 1996-05-21
JPH06346222A (ja) 1994-12-20
JP3048833B2 (ja) 2000-06-05

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20041223