HK53397A - Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements - Google Patents

Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements

Info

Publication number
HK53397A
HK53397A HK53397A HK53397A HK53397A HK 53397 A HK53397 A HK 53397A HK 53397 A HK53397 A HK 53397A HK 53397 A HK53397 A HK 53397A HK 53397 A HK53397 A HK 53397A
Authority
HK
Hong Kong
Prior art keywords
screen
rods
goods carrier
pct
screening
Prior art date
Application number
HK53397A
Other languages
English (en)
Inventor
Kurt Astor
Peter Haase
Manfred Gute
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK53397A publication Critical patent/HK53397A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Pretreatment Of Seeds And Plants (AREA)
HK53397A 1991-03-02 1997-04-24 Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements HK53397A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4106733A DE4106733A1 (de) 1991-03-02 1991-03-02 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii)
PCT/DE1992/000182 WO1992015727A1 (fr) 1991-03-02 1992-02-28 Dispositif d'arret de lignes de champ au moyen d'un ecran pour installations de traitement electrolytique d'elements essentiellement plats

Publications (1)

Publication Number Publication Date
HK53397A true HK53397A (en) 1997-05-02

Family

ID=6426361

Family Applications (1)

Application Number Title Priority Date Filing Date
HK53397A HK53397A (en) 1991-03-02 1997-04-24 Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements

Country Status (8)

Country Link
US (1) US5391276A (fr)
EP (1) EP0574451B1 (fr)
AT (1) ATE114174T1 (fr)
CA (1) CA2105389A1 (fr)
DE (2) DE4106733A1 (fr)
ES (1) ES2065174T3 (fr)
HK (1) HK53397A (fr)
WO (1) WO1992015727A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT399074B (de) * 1991-12-23 1995-03-27 Lenhard Ges M B H Vorrichtung zum halten von leiterplatten
GB9325297D0 (en) 1993-12-10 1994-02-16 Process Automation Internation Improvements in or relating to clamps and the use thereof
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
DE19736352C1 (de) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
US6274010B1 (en) 1997-10-07 2001-08-14 Process Automation International Limited Electroplating apparatus
GB2330151A (en) * 1997-10-07 1999-04-14 Process Automation Internation An electroplating apparatus with movable diaphragms
DE19932785C1 (de) * 1999-07-14 2000-11-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Justieren von Abschirmmasken bei der elektrochemischen Behandlung von stabförmigem Behandlungsgut
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US20060037865A1 (en) * 2004-08-19 2006-02-23 Rucker Michael H Methods and apparatus for fabricating gas turbine engines
CN101437365B (zh) * 2007-11-15 2011-05-11 富葵精密组件(深圳)有限公司 固持装置及固持方法
CN102162119B (zh) * 2011-04-11 2012-07-04 衢州威盛精密电子科技有限公司 电镀薄板浮架装置及其使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145199A (en) * 1979-04-25 1980-11-12 Hitachi Ltd Shielding board for plating
DE3726571C1 (en) * 1987-08-10 1989-03-23 Siemens Ag Screening and positioning frame
US4879007B1 (en) * 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath
DE9007542U1 (de) * 1990-02-20 1992-06-25 Schering Ag Berlin Und Bergkamen, 1000 Berlin Vorrichtung zum Abblenden von Feldlinien in einer Galvanikanlage

Also Published As

Publication number Publication date
DE4106733C2 (fr) 1993-07-29
EP0574451B1 (fr) 1994-11-17
US5391276A (en) 1995-02-21
CA2105389A1 (fr) 1992-09-03
WO1992015727A1 (fr) 1992-09-17
EP0574451A1 (fr) 1993-12-22
DE59200793D1 (de) 1994-12-22
DE4106733A1 (de) 1992-09-03
ATE114174T1 (de) 1994-12-15
ES2065174T3 (es) 1995-02-01

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110228