HK40790A - Semiconductor device and method of producing such a device - Google Patents

Semiconductor device and method of producing such a device

Info

Publication number
HK40790A
HK40790A HK407/90A HK40790A HK40790A HK 40790 A HK40790 A HK 40790A HK 407/90 A HK407/90 A HK 407/90A HK 40790 A HK40790 A HK 40790A HK 40790 A HK40790 A HK 40790A
Authority
HK
Hong Kong
Prior art keywords
producing
semiconductor device
semiconductor
Prior art date
Application number
HK407/90A
Other languages
English (en)
Inventor
June Sugiura
Kazuhiro Komori
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK40790A publication Critical patent/HK40790A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/90—MOSFET type gate sidewall insulating spacer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
HK407/90A 1984-02-24 1990-05-24 Semiconductor device and method of producing such a device HK40790A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59032355A JP2515715B2 (ja) 1984-02-24 1984-02-24 半導体集積回路装置の製造方法

Publications (1)

Publication Number Publication Date
HK40790A true HK40790A (en) 1990-06-01

Family

ID=12356649

Family Applications (1)

Application Number Title Priority Date Filing Date
HK407/90A HK40790A (en) 1984-02-24 1990-05-24 Semiconductor device and method of producing such a device

Country Status (5)

Country Link
US (1) US4872041A (xx)
JP (1) JP2515715B2 (xx)
KR (1) KR930009481B1 (xx)
GB (1) GB2156586B (xx)
HK (1) HK40790A (xx)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939558A (en) * 1985-09-27 1990-07-03 Texas Instruments Incorporated EEPROM memory cell and driving circuitry
US5189497A (en) * 1986-05-26 1993-02-23 Hitachi, Ltd. Semiconductor memory device
JP3059442B2 (ja) 1988-11-09 2000-07-04 株式会社日立製作所 半導体記憶装置
IT1215559B (it) * 1987-06-11 1990-02-14 Sgs Microelettronica Spa Processo di fabbricazione per celle di memoria non volatili epromelettricamente cancellabili e cella cosi' ottenuta.
JPH0712063B2 (ja) * 1987-10-21 1995-02-08 三菱電機株式会社 不揮発性半導体記憶装置
FR2638285B1 (fr) * 1988-10-25 1992-06-19 Commissariat Energie Atomique Circuit integre a haute densite d'integration tel que memoire eprom et procede d'obtention correspondant
US5262846A (en) * 1988-11-14 1993-11-16 Texas Instruments Incorporated Contact-free floating-gate memory array with silicided buried bitlines and with single-step-defined floating gates
FR2642900B1 (fr) * 1989-01-17 1991-05-10 Sgs Thomson Microelectronics Procede de fabrication de circuits integres a transistors de memoire eprom et a transistors logiques
GB2229575B (en) * 1989-03-22 1993-05-12 Intel Corp Method of reducing hot-electron degradation in semiconductor devices
US5229311A (en) * 1989-03-22 1993-07-20 Intel Corporation Method of reducing hot-electron degradation in semiconductor devices
JP2509697B2 (ja) * 1989-04-28 1996-06-26 株式会社東芝 半導体装置およびその製造方法
US5106772A (en) * 1990-01-09 1992-04-21 Intel Corporation Method for improving the electrical erase characteristics of floating gate memory cells by immediately depositing a protective polysilicon layer following growth of the tunnel or gate oxide
US5273926A (en) * 1991-06-27 1993-12-28 Texas Instruments Incorporated Method of making flash EEPROM or merged FAMOS cell without alignment sensitivity
US5225700A (en) * 1991-06-28 1993-07-06 Texas Instruments Incorporated Circuit and method for forming a non-volatile memory cell
US5149665A (en) * 1991-07-10 1992-09-22 Micron Technology, Inc. Conductive source line for high density programmable read-only memory applications
US5270240A (en) * 1991-07-10 1993-12-14 Micron Semiconductor, Inc. Four poly EPROM process and structure comprising a conductive source line structure and self-aligned polycrystalline silicon digit lines
US5218568A (en) * 1991-12-17 1993-06-08 Texas Instruments Incorporated Electrically-erasable, electrically-programmable read-only memory cell, an array of such cells and methods for making and using the same
US5424571A (en) * 1992-03-30 1995-06-13 Sgs-Thomson Microelectronics, Inc. Sloped spacer for mos field effect devices
US5397725A (en) * 1993-10-28 1995-03-14 National Semiconductor Corporation Method of controlling oxide thinning in an EPROM or flash memory array
JP3241316B2 (ja) 1998-01-07 2001-12-25 日本電気株式会社 フラッシュメモリの製造方法
US6872624B2 (en) 2001-02-08 2005-03-29 Matsushita Electric Industrial Co., Ltd. Method of fabricating nonvolatile semiconductor memory device
KR100632654B1 (ko) * 2004-12-28 2006-10-12 주식회사 하이닉스반도체 플래시 메모리 소자의 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825946A (en) * 1971-01-15 1974-07-23 Intel Corp Electrically alterable floating gate device and method for altering same
US3984822A (en) * 1974-12-30 1976-10-05 Intel Corporation Double polycrystalline silicon gate memory device
US4203158A (en) * 1978-02-24 1980-05-13 Intel Corporation Electrically programmable and erasable MOS floating gate memory device employing tunneling and method of fabricating same
JPS5544742A (en) * 1978-09-26 1980-03-29 Fujitsu Ltd Manufacture of semiconductor device
US4267011A (en) * 1978-09-29 1981-05-12 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a semiconductor device
JPS5642375A (en) * 1979-08-31 1981-04-20 Fujitsu Ltd Semiconductor nonvolatile memory
US4295897B1 (en) * 1979-10-03 1997-09-09 Texas Instruments Inc Method of making cmos integrated circuit device
JPS56108259A (en) * 1980-02-01 1981-08-27 Hitachi Ltd Semiconductor memory device
JPS56120166A (en) * 1980-02-27 1981-09-21 Hitachi Ltd Semiconductor ic device and manufacture thereof
JPS5850771A (ja) * 1981-09-21 1983-03-25 Hitachi Ltd 再書込み可能な高集積ｒｏｍ及びその製造方法
CA1188419A (en) * 1981-12-14 1985-06-04 Yung-Chau Yen Nonvolatile multilayer gate semiconductor memory device
US4397077A (en) * 1981-12-16 1983-08-09 Inmos Corporation Method of fabricating self-aligned MOS devices and independently formed gate dielectrics and insulating layers
US4431900A (en) * 1982-01-15 1984-02-14 Fairchild Camera & Instrument Corporation Laser induced flow Ge-O based materials
US4442591A (en) * 1982-02-01 1984-04-17 Texas Instruments Incorporated High-voltage CMOS process
US4536944A (en) * 1982-12-29 1985-08-27 International Business Machines Corporation Method of making ROM/PLA semiconductor device by late stage personalization

Also Published As

Publication number Publication date
KR850006650A (ko) 1985-10-14
JP2515715B2 (ja) 1996-07-10
US4872041A (en) 1989-10-03
GB2156586A (en) 1985-10-09
JPS60177678A (ja) 1985-09-11
KR930009481B1 (ko) 1993-10-04
GB8504426D0 (en) 1985-03-27
GB2156586B (en) 1988-03-23

Similar Documents

Publication Publication Date Title
GB2115607B (en) Semiconductor device and a method of producing the same
EP0162677A3 (en) Semiconductor device and method for producing same
HK40790A (en) Semiconductor device and method of producing such a device
DE3473384D1 (en) Semiconductor device and a method of manufacturing the same
GB2138207B (en) A semiconductor memory device and a method of manufacture thereof
EP0174185A3 (en) Semiconductor device and manufacturing method thereof
JPS57162363A (en) Semiconductor device and method of producing same
GB2206448B (en) A method of producing a semiconductor device
DE3479548D1 (en) Semiconductor device and method of manufacture thereof
EP0333583A3 (en) Method of producing a semiconductor device
EP0214690A3 (en) A method of manufacturing a semiconductor device
EP0197284A3 (en) Method of producing semiconductor memory device
DE3567320D1 (en) A method of forming a semiconductor device using a mask
EP0260906A3 (en) Method of producing semiconductor device and semiconductor device
EP0187421A3 (en) Method of manufacturing a semiconductor device
DE3471405D1 (en) A method of producing a semiconductor structure on a substrate and a semiconductor device manufactured thereby
EP0157555A3 (en) A semiconductor laser and a method of producing the same
GB2191339B (en) A semiconductor laser device and a method of making same
EP0259490A4 (en) Semiconductor device and a method of producing the same
KR900008623B1 (en) Method of producing a semiconductor device
GB2222308B (en) A method of producing a semiconductor device
GB2181893B (en) Semiconductor device and method of manufacturing thereof
GB2183093B (en) Method of manufacturing a semiconductor device
GB2157495B (en) A method of producing a semiconductor integrated circuit device
DE3468585D1 (en) Semiconductor device and a method of manufacturing the same

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)