HK26488A - Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound - Google Patents

Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound

Info

Publication number
HK26488A
HK26488A HK264/88A HK26488A HK26488A HK 26488 A HK26488 A HK 26488A HK 264/88 A HK264/88 A HK 264/88A HK 26488 A HK26488 A HK 26488A HK 26488 A HK26488 A HK 26488A
Authority
HK
Hong Kong
Prior art keywords
diaryl
radiation
polyimide precursor
precursor composition
composition derived
Prior art date
Application number
HK264/88A
Other languages
English (en)
Inventor
David Lee Goff
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/427,415 external-priority patent/US4416973A/en
Priority claimed from US06/430,856 external-priority patent/US4430418A/en
Application filed by Du Pont filed Critical Du Pont
Publication of HK26488A publication Critical patent/HK26488A/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
HK264/88A 1982-01-04 1988-04-14 Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound HK26488A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33676582A 1982-01-04 1982-01-04
US06/427,415 US4416973A (en) 1982-01-04 1982-09-29 Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
US06/430,856 US4430418A (en) 1982-09-30 1982-09-30 Radiation-sensitive polyimide precursor composition derived from a diaryl fluoronated diamine compound

Publications (1)

Publication Number Publication Date
HK26488A true HK26488A (en) 1988-04-22

Family

ID=27407151

Family Applications (1)

Application Number Title Priority Date Filing Date
HK264/88A HK26488A (en) 1982-01-04 1988-04-14 Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound

Country Status (8)

Country Link
EP (1) EP0084269B1 (xx)
KR (1) KR890004138B1 (xx)
CA (1) CA1195039A (xx)
DE (1) DE3277552D1 (xx)
HK (1) HK26488A (xx)
IE (1) IE54228B1 (xx)
IL (1) IL67611A (xx)
SG (1) SG3088G (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3570931D1 (en) * 1984-08-10 1989-07-13 Siemens Ag Thermostable polymer system, cross-linkable by irradiation, for microelectronic use
JPS62143929A (ja) * 1985-07-16 1987-06-27 Kanegafuchi Chem Ind Co Ltd ポリイミド前駆体薄膜
EP0254230A3 (en) * 1986-07-22 1988-11-23 Asahi Kasei Kogyo Kabushiki Kaisha Heat-resistant photoresist film
US4803147A (en) * 1987-11-24 1989-02-07 Hoechst Celanese Corporation Photosensitive polyimide polymer compositions
JPH0680776A (ja) * 1992-09-02 1994-03-22 Asahi Chem Ind Co Ltd ポリイミド前駆体及び組成物
US5879858A (en) * 1996-12-19 1999-03-09 Kodak Polychrome Graphics, Llc Photosensitive polymer composition containing photosensitive polyamide and negative working photosensitive element
US5925498A (en) * 1997-06-16 1999-07-20 Kodak Polychrome Graphics Llc Photosensitive polymer composition and element containing photosensitive polyamide and mixture of acrylates

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3959350A (en) * 1971-05-17 1976-05-25 E. I. Du Pont De Nemours And Company Melt-fusible linear polyimide of 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride
US3888672A (en) * 1972-07-31 1975-06-10 Du Pont Photopolymerizable process capable of yielding a reverse image
WO1980000706A1 (en) * 1978-09-29 1980-04-17 Hitachi Ltd Light-sensitive polymer composition
DE2933827A1 (de) * 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung hochwaermebestaendiger reliefstrukturen und deren verwendung.
US4308338A (en) * 1980-03-26 1981-12-29 E. I. Du Pont De Nemours And Company Methods of imaging photopolymerizable materials containing diester polyether
US4329419A (en) * 1980-09-03 1982-05-11 E. I. Du Pont De Nemours And Company Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors

Also Published As

Publication number Publication date
IL67611A (en) 1986-02-28
EP0084269A2 (en) 1983-07-27
EP0084269A3 (en) 1983-12-21
EP0084269B1 (en) 1987-10-28
CA1195039A (en) 1985-10-08
IE830001L (en) 1983-07-04
KR840003365A (ko) 1984-08-20
IE54228B1 (en) 1989-07-19
SG3088G (en) 1988-06-17
KR890004138B1 (ko) 1989-10-21
IL67611A0 (en) 1983-05-15
DE3277552D1 (en) 1987-12-03

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)