HK141294A - Coating metallic substrates by the pvd process - Google Patents

Coating metallic substrates by the pvd process

Info

Publication number
HK141294A
HK141294A HK141294A HK141294A HK141294A HK 141294 A HK141294 A HK 141294A HK 141294 A HK141294 A HK 141294A HK 141294 A HK141294 A HK 141294A HK 141294 A HK141294 A HK 141294A
Authority
HK
Hong Kong
Prior art keywords
alloy
nickel
copper
palladium
pvd
Prior art date
Application number
HK141294A
Other languages
English (en)
Inventor
Baltz Michael
Schulze-Berge Klaus
Bastian Siegfried
Erhart Helmut
Petersen Hartwig
Original Assignee
Metaleurop Coating Technology Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metaleurop Coating Technology Gmbh filed Critical Metaleurop Coating Technology Gmbh
Publication of HK141294A publication Critical patent/HK141294A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Physical Vapour Deposition (AREA)
HK141294A 1988-03-18 1994-12-15 Coating metallic substrates by the pvd process HK141294A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3809139A DE3809139A1 (de) 1988-03-18 1988-03-18 Verwendung einer palladium/nickel-legierungsschicht als zwischenschicht zwischen einem nichtkorrosionsbestaendigen oder wenig korrosionsbestaendigen metallischen grundmaterial und einer nach dem pvd-verfahren aufgebrachten beschichtung

Publications (1)

Publication Number Publication Date
HK141294A true HK141294A (en) 1994-12-23

Family

ID=6350105

Family Applications (1)

Application Number Title Priority Date Filing Date
HK141294A HK141294A (en) 1988-03-18 1994-12-15 Coating metallic substrates by the pvd process

Country Status (5)

Country Link
JP (1) JPH0277585A (enrdf_load_stackoverflow)
CH (1) CH677366A5 (enrdf_load_stackoverflow)
DE (1) DE3809139A1 (enrdf_load_stackoverflow)
GB (1) GB2218111B (enrdf_load_stackoverflow)
HK (1) HK141294A (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4006550C1 (en) * 1990-02-15 1991-06-27 Anke Gmbh & Co. Kg Oberflaechentechnik, 4300 Essen, De Textured rolls for processing steel etc. - have electrolytical treated, surface deposited with chromium coated with nitride by PVD or CVD
DE4008254A1 (de) * 1990-03-15 1991-09-19 Huettl & Vester Gmbh Verfahren zum herstellen von gravierten walzen oder platten
US5252360A (en) * 1990-03-15 1993-10-12 Huettl Wolfgang Process for the protection of an engraved roll or plate by coating an engraved surface with an interlayer and thereafter applying a wear-resistant layer to the interlayer by PVD
US5384201A (en) * 1991-05-31 1995-01-24 Robert Bosch Gmbh Tool for treating surfaces of structural parts and carrier material for the same
DE4232429A1 (de) * 1992-09-28 1994-03-31 Bosch Gmbh Robert Werkzeug zur Behandlung von Oberflächen von Bauteilen und Trägerwerkstoff für dieses Werkzeug
AT400040B (de) * 1993-06-02 1995-09-25 Andritz Patentverwaltung Verfahren und vorrichtung zur beschichtung von metallsubstraten, insbesondere stahl- oder aluminiumbblechen in bandform
US5879532A (en) * 1997-07-09 1999-03-09 Masco Corporation Of Indiana Process for applying protective and decorative coating on an article
AU2001240599A1 (en) * 2000-02-07 2001-08-14 Cis Solartechnik Gmbh Flexible metal substrate for cis solar cells, and method for producing the same
US6489035B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
DE10303650A1 (de) * 2003-01-27 2004-07-29 Hansgrohe Ag Beschichtungsverfahren
DE102004010762B4 (de) * 2004-03-05 2006-06-29 Daimlerchrysler Ag Verbundbauteil
EP1876268B1 (de) 2006-06-13 2013-05-15 Wolf-Dieter Franz Cr-VI-freie Schwarzverchromung
RU2329337C1 (ru) * 2006-11-27 2008-07-20 Вячеслав Вячеславович Рогожин Электролит для электрохимического осаждения покрытий никель-бор
DE202019104533U1 (de) * 2019-08-16 2019-09-03 Ec Europ Coating Gmbh Beschichteter, metallischer Gebrauchsgegenstand oder beschichtete, metallische Komponente eines Gebrauchsgegenstandes
CN110885996A (zh) * 2019-12-25 2020-03-17 东莞立德精密工业有限公司 一种五金件表面处理工艺及五金件
CN114540813A (zh) * 2022-02-24 2022-05-27 瑞鼎机电科技（昆山）有限公司 一种咖啡机按压板pvd镀膜工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3647643A (en) * 1969-09-29 1972-03-07 Ibm Process of fabricating a hybrid magnetic film
CH539130A (de) * 1970-02-27 1973-08-31 Egyesuelt Izzolampa Verfahren zur Aufdampfung von Schichten durch Vakuumaufdampfen
DE2118977C3 (de) * 1971-04-20 1974-06-20 Vereinigte Flugtechnische Werkefokker Gmbh, 2800 Bremen Verfahren zum Aufdampfen haftfester Silberschichten auf Titan oder Titanlegierungen
DE3108508C2 (de) * 1981-03-06 1983-06-30 Langbein-Pfanhauser Werke Ag, 4040 Neuss Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3232735C2 (de) * 1981-09-11 1984-04-26 LPW-Chemie GmbH, 4040 Neuss Verwendung einer als Glanzbildnerzusatz zu Nickelbädern bekannten Verbindung als Korrosionsschutzadditiv
GB2123039B (en) * 1982-03-23 1985-10-23 Atomic Energy Authority Uk Coatings for cutting implements
JPS60248892A (ja) * 1984-05-24 1985-12-09 Electroplating Eng Of Japan Co 高純度パラジウム・ニッケル合金メッキ液及び方法
GB2168381B (en) * 1984-12-12 1988-03-09 Stc Plc Gold plated electrical contacts
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition

Also Published As

Publication number Publication date
DE3809139C2 (enrdf_load_stackoverflow) 1990-04-05
GB2218111B (en) 1992-05-06
GB8905734D0 (en) 1989-04-26
DE3809139A1 (de) 1989-09-28
JPH0277585A (ja) 1990-03-16
GB2218111A (en) 1989-11-08
CH677366A5 (enrdf_load_stackoverflow) 1991-05-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)