HK1257087A1 - 冷卻數據中心中的電子裝置 - Google Patents

冷卻數據中心中的電子裝置

Info

Publication number
HK1257087A1
HK1257087A1 HK18116262.7A HK18116262A HK1257087A1 HK 1257087 A1 HK1257087 A1 HK 1257087A1 HK 18116262 A HK18116262 A HK 18116262A HK 1257087 A1 HK1257087 A1 HK 1257087A1
Authority
HK
Hong Kong
Prior art keywords
electronic devices
data center
cooling electronic
cooling
center
Prior art date
Application number
HK18116262.7A
Other languages
English (en)
Inventor
E‧薩馬迪亞尼
E‧J‧黃
G‧P‧伊姆瓦勒
S‧法施基安
Original Assignee
谷歌有限責任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 谷歌有限責任公司 filed Critical 谷歌有限責任公司
Publication of HK1257087A1 publication Critical patent/HK1257087A1/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20809Liquid cooling with phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK18116262.7A 2014-09-23 2017-09-01 冷卻數據中心中的電子裝置 HK1257087A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/494,216 US9552025B2 (en) 2014-09-23 2014-09-23 Cooling electronic devices in a data center

Publications (1)

Publication Number Publication Date
HK1257087A1 true HK1257087A1 (zh) 2019-10-11

Family

ID=54140716

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18116262.7A HK1257087A1 (zh) 2014-09-23 2017-09-01 冷卻數據中心中的電子裝置

Country Status (8)

Country Link
US (3) US9552025B2 (zh)
EP (1) EP3199006B8 (zh)
CN (2) CN106489308B (zh)
DE (2) DE112015004333B4 (zh)
DK (1) DK3199006T3 (zh)
GB (1) GB2545106B (zh)
HK (1) HK1257087A1 (zh)
WO (1) WO2016048616A1 (zh)

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US10842054B2 (en) * 2018-03-20 2020-11-17 Quanta Computer Inc. Extended heat sink design in server
US11297745B2 (en) * 2018-03-28 2022-04-05 The Board Of Trustees Of The University Of Illinois Active thermal management system for electronic devices and method of achieving device-to-device isothermalization
US11209215B2 (en) * 2018-07-27 2021-12-28 Qualcomm Incorporated Enhanced cooling of an electronic device using micropumps in thermosiphons
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
EP3671828A1 (en) * 2018-12-21 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Evaporative microchip cooling
CN109780917B (zh) * 2019-01-21 2020-12-29 姜金娜 一种组合式换热器
TWI735074B (zh) * 2019-11-06 2021-08-01 新加坡商鴻運科股份有限公司 Lts散熱器及具有該lts散熱器的電子設備
DE102020100973A1 (de) 2020-01-16 2021-07-22 Wincor Nixdorf International Gmbh Kassenvorgangsprotokolliervorrichtungsdatenträger
DE102020100974A1 (de) 2020-01-16 2021-07-22 Wincor Nixdorf International Gmbh Server-einschub zur implementierung einer kassenvorgangsprotokolliervorrichtung
US11044834B1 (en) 2020-02-21 2021-06-22 Google Llc Inverted liquid cooling system
CN113720030B (zh) * 2020-05-26 2023-04-14 重庆美的通用制冷设备有限公司 空调器、控制方法、控制装置和计算机可读存储介质
CN212970511U (zh) * 2020-06-19 2021-04-13 阳光电源股份有限公司 一种应用散热装置的电气设备
EP3958659A1 (en) 2020-08-19 2022-02-23 Nokia Technologies Oy Apparatus and systems for cooling
CN112181106A (zh) * 2020-09-02 2021-01-05 宁畅信息产业(北京)有限公司 服务器及其驱动方法
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US11582888B2 (en) * 2021-03-25 2023-02-14 Baidu Usa Llc Hybrid cooling device for acceleration hardware
US20230371202A1 (en) * 2022-05-13 2023-11-16 Baidu Usa Llc Server rack cooling system architecture

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Also Published As

Publication number Publication date
US10542641B2 (en) 2020-01-21
US9552025B2 (en) 2017-01-24
US20160085277A1 (en) 2016-03-24
US20170079167A1 (en) 2017-03-16
DE112015004333B4 (de) 2022-10-13
US9961803B2 (en) 2018-05-01
GB201621540D0 (en) 2017-02-01
CN106489308B (zh) 2018-07-13
GB2545106B (en) 2018-08-22
DK3199006T3 (en) 2019-04-01
WO2016048616A1 (en) 2016-03-31
DE112015004333T5 (de) 2017-10-19
GB2545106A (en) 2017-06-07
EP3199006B1 (en) 2018-12-19
EP3199006A1 (en) 2017-08-02
US20180235108A1 (en) 2018-08-16
CN108770297A (zh) 2018-11-06
DE202015009367U1 (de) 2017-04-13
CN108770297B (zh) 2021-01-12
EP3199006B8 (en) 2019-03-06
CN106489308A (zh) 2017-03-08

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